JPS60239048A - 熱伝導冷却モジユ−ル装置 - Google Patents

熱伝導冷却モジユ−ル装置

Info

Publication number
JPS60239048A
JPS60239048A JP59092867A JP9286784A JPS60239048A JP S60239048 A JPS60239048 A JP S60239048A JP 59092867 A JP59092867 A JP 59092867A JP 9286784 A JP9286784 A JP 9286784A JP S60239048 A JPS60239048 A JP S60239048A
Authority
JP
Japan
Prior art keywords
heat
heat generating
cooling module
cooling
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59092867A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439781B2 (fr
Inventor
Yasutoshi Kurihara
保敏 栗原
Tasao Soga
太佐男 曽我
Komei Yatsuno
八野 耕明
Kenji Miyata
健治 宮田
Masahiro Okamura
岡村 昌弘
Fumiyuki Kobayashi
小林 二三幸
Takahiro Oguro
崇弘 大黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59092867A priority Critical patent/JPS60239048A/ja
Publication of JPS60239048A publication Critical patent/JPS60239048A/ja
Publication of JPH0439781B2 publication Critical patent/JPH0439781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77Auxiliary members characterised by their shape
    • H10W40/774Pistons, e.g. spring-loaded members
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59092867A 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置 Granted JPS60239048A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59092867A JPS60239048A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59092867A JPS60239048A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Publications (2)

Publication Number Publication Date
JPS60239048A true JPS60239048A (ja) 1985-11-27
JPH0439781B2 JPH0439781B2 (fr) 1992-06-30

Family

ID=14066378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59092867A Granted JPS60239048A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Country Status (1)

Country Link
JP (1) JPS60239048A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020046755A (ko) * 2000-12-15 2002-06-21 밍 루 보호용 케이스에 수납된 전자 부품의 방열 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020046755A (ko) * 2000-12-15 2002-06-21 밍 루 보호용 케이스에 수납된 전자 부품의 방열 장치

Also Published As

Publication number Publication date
JPH0439781B2 (fr) 1992-06-30

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