JPS60240129A - Scrub washing apparatus - Google Patents
Scrub washing apparatusInfo
- Publication number
- JPS60240129A JPS60240129A JP59096984A JP9698484A JPS60240129A JP S60240129 A JPS60240129 A JP S60240129A JP 59096984 A JP59096984 A JP 59096984A JP 9698484 A JP9698484 A JP 9698484A JP S60240129 A JPS60240129 A JP S60240129A
- Authority
- JP
- Japan
- Prior art keywords
- washer
- cleaning
- scrub
- washing
- peripheral portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/54—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using mechanical tools
Landscapes
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】 （ａｌ 産業上の利用分野 本発明は、スクラブ洗浄装置の構成に関す。[Detailed description of the invention] (Al Industrial application field The present invention relates to the configuration of a scrub cleaning device.
スクラブ洗浄装置は、例えば半導体装置などの主要構成
物である半導体チップなどの製造において、製造過程に
あるウェハや、該ウェハにホトリソグラフィ技術を適用
する際に使用されるホトマスクなどの表面に付着した異
物を除去する洗浄に使用される装置である。For example, in the manufacture of semiconductor chips, which are the main components of semiconductor devices, scrub cleaning equipment is used to clean the surfaces of wafers during the manufacturing process and photomasks used when applying photolithography technology to the wafers. This is a device used for cleaning to remove foreign substances.
従って、スクラブ洗浄装置には、前記異物を充分に除去
することは勿論のこと、洗浄面に傷を付けないことが望
まれる。Therefore, it is desired that the scrub cleaning device not only sufficiently remove the foreign matter but also not damage the cleaning surface.
（ｂ） 従来の技術
表面に付着した異物を除去する方法には、例えば、洗浄
液に浸漬する、洗浄液の蒸気に当てる、洗浄液を噴射す
る、洗浄液に浸漬して超音波を加える、などがあるが、
異物が微粒子である場合には、これらの方法で該異物が
充分に除去されないことがある。このような場合には、
洗浄面を洗浄具によって擦る方法、ないしその方法と前
記方法とを組み合わせることが用いられる。(b) Conventional techniques Methods for removing foreign substances attached to surfaces include, for example, immersing the surface in a cleaning solution, exposing the surface to the vapor of the cleaning solution, spraying the cleaning solution, and applying ultrasonic waves after immersing the surface in the cleaning solution. ,
When the foreign matter is a fine particle, the foreign matter may not be sufficiently removed by these methods. In such a case,
A method of scrubbing the cleaning surface with a cleaning tool, or a combination of this method and the above method is used.
スクラブ洗浄装置は、ウェハやホトマスクの洗浄面を洗
浄具によって擦る方法を採用した洗浄装置で、第２図は
その構成を模式的に示した側面図である。A scrub cleaning device is a cleaning device that employs a method of scrubbing the cleaning surface of a wafer or a photomask with a cleaning tool, and FIG. 2 is a side view schematically showing its configuration.
第２図図示において、ウェハやホトマスクなどの平板状
被洗浄体Ａは、洗浄面＾１を外側（図示下側）に向けて
保持具１に例えば矢印ａ方向の真空吸引により保持され
、場合によっては回転しながら、保持具１と共に矢印す
方向に移動する。In FIG. 2, a flat plate-shaped object A to be cleaned, such as a wafer or a photomask, is held in the holder 1 by vacuum suction in the direction of arrow a, with the cleaning surface ^1 facing outward (lower side in the figure), and as the case may be, While rotating, it moves together with the holder 1 in the direction indicated by the arrow.
洗浄面Ａ１は、前記移動過程において、ノズル２から例
えば純水などの洗浄液３が供給されながら、円筒状をな
し中心軸を軸に例えば矢印Ｃ方向に回転する例えばブラ
シまたはスポンジなどからなる洗浄具４の円周面部で擦
られ（スクラビングされ）洗浄される。The cleaning surface A1 is a cleaning tool such as a brush or a sponge that has a cylindrical shape and rotates in the direction of arrow C about a central axis while being supplied with a cleaning liquid 3 such as pure water from a nozzle 2 during the movement process. It is scrubbed and cleaned by the circumferential surface of No.4.
この構成でなるスクラブ洗浄装置においては、洗浄面＾
１に付着している異物、即ち、例えば被洗浄体Ａがシリ
コンウェハである場合のシリコンや二酸化シリコンの粉
や粒子および外界から付着した塵埃などを、洗浄具４が
拭い去って極めて良好な洗浄を行うが、該異物の一部が
洗浄具４に付着したまま回転して洗浄面ＡＩを擦り洗浄
面へ１に傷を付けることがあって、例えば製造する半導
体チップの品質を劣化させる欠点を有する。In the scrub cleaning device with this configuration, the cleaning surface ^
The cleaning tool 4 wipes away foreign matter adhering to the surface of the object 1, such as powders and particles of silicon or silicon dioxide when the object A to be cleaned is a silicon wafer, and dust adhering from the outside world, resulting in extremely good cleaning. However, some of the foreign objects may rotate while attached to the cleaning tool 4, rubbing the cleaning surface AI and damaging the cleaning surface 1, resulting in a drawback that, for example, the quality of semiconductor chips to be manufactured may be degraded. have
なお、被洗浄体Ａの保持形態には、前記真空吸引の他に
被洗浄体Ａの周辺を保持するものなどがあるが、洗浄の
機構は上記と同様である。In addition to the vacuum suction described above, there are other ways to hold the object A to be cleaned, such as holding the periphery of the object A, but the cleaning mechanism is the same as described above.
（Ｃ１発明が解決しようとする問題点
本発明が解決しようとする問題点は、前記異物の一部が
洗浄具４に付着したまま回転して洗浄面Ａ１を擦り洗浄
面＾１に傷を付けることである。(C1 Problem to be Solved by the Invention The problem to be solved by the present invention is that a part of the foreign matter adheres to the cleaning tool 4 and rotates, scraping the cleaning surface A1 and damaging the cleaning surface ^1. That's true.
ｆｄｌ 問題点を解決するための手段
上記問題点は、従来の洗浄具の回転の過程において、そ
の円周面部を擦る別の洗浄具を追加すると云う手段を講
することによって解決される。fdl Means for Solving the Problem The above problem can be solved by adding another cleaning tool that scrubs the circumferential surface of the conventional cleaning tool in the process of rotation.
本発明によれば、前記側の洗浄具は、例えばブラシまた
はスポンジなどで形成した円筒状をなし、中心軸を軸に
回転して該円筒状の円周面部が従来の洗浄具の円周面部
を擦るようにしている。According to the present invention, the cleaning tool on the side has a cylindrical shape formed of, for example, a brush or a sponge, and rotates about a central axis so that the cylindrical circumferential surface portion is the same as the circumferential surface of the conventional cleaning tool. I try to rub it.
（ｅｌ 作用
第２図の４で示される従来の洗浄具に付着したまま回転
して洗浄面へ１に傷を付ける異物を、洗浄面＾１に到達
する前に、本発明により追加した別の洗浄具が擦って拭
い去るので、該傷は大幅に減少し、例えば製造する半導
体チップの品質を向上させることが可能になる。(el action) The foreign matter that rotates while attached to the conventional cleaning tool and damages the cleaning surface ^1 shown by 4 in Fig. 2 is removed by another foreign matter added according to the present invention before it reaches the cleaning surface Since the cleaning tool scrubs and wipes away the scratches, the scratches are significantly reduced, making it possible, for example, to improve the quality of semiconductor chips produced.
（ｆｌ 実施例
以下本発明によるスクラブ洗浄装置の一実施例を模式的
に示した第１図（側面図）により説明する。全図を通じ
同一符号は同一対象物を示す。(fl Example) An example of a scrub cleaning apparatus according to the present invention will be explained below with reference to FIG. 1 (side view) which schematically shows an example. The same reference numerals indicate the same objects throughout the figures.
第１図図示において、保持具１、被洗浄体Ａの保持形態
、−ノズル２、洗浄液３、洗浄具４、洗浄面肘の洗浄機
構は第２図図示の場合と変わらない。In FIG. 1, the holder 1, the form of holding the object A to be cleaned, the nozzle 2, the cleaning liquid 3, the cleaning tool 4, and the cleaning mechanism of the cleaning surface elbow are the same as those shown in FIG.
５は本発明により追加した洗浄具である。洗浄具５は、
例えばブラシまたはスポンジなどからなり、その円周面
部が、例えば矢印ｄ方向に回転しながら、洗浄具４の円
周面部を擦り、洗浄具４が洗浄面Ａ１から拭い去って洗
浄具４に付着した異物を拭い去る。5 is a cleaning tool added according to the present invention. The cleaning tool 5 is
For example, it is made of a brush or a sponge, and its circumferential surface part rubs the circumferential surface part of the cleaning tool 4 while rotating, for example, in the direction of arrow d, and the cleaning tool 4 wipes off the cleaning surface A1 and adheres to the cleaning tool 4. Wipe away foreign objects.
この際、図示においては、ノズル２から洗浄面Ａ１に供
給された洗浄液３が落下して、上記した洗浄具４の洗浄
にも利用されるが、別のノズルを設けて新しい洗浄液を
供給してもよい。At this time, in the illustration, the cleaning liquid 3 supplied from the nozzle 2 to the cleaning surface A1 falls and is also used for cleaning the above-mentioned cleaning tool 4, but another nozzle is provided to supply new cleaning liquid. Good too.
また、図示においては、洗浄具５を二個設けたが、状況
により一個でもよく、三個以上にしてもい。Further, in the illustration, two cleaning tools 5 are provided, but depending on the situation, it may be one, or three or more.
本願の発明者は、洗浄具４がナイロンブラシからなる従
来のスクラブ洗浄装置に、同様のブラシを洗浄具５にし
て第１図図示のように追加し、６！′シリコンウエハを
洗浄して、上記問題の傷が認められないようになること
を確認した。The inventor of the present invention added a similar brush to the conventional scrub cleaning device in which the cleaning tool 4 was a nylon brush as shown in FIG. 'After cleaning the silicon wafer, we confirmed that the scratches mentioned above were no longer visible.
（ａ 発明の効果
以上に説明したように、本発明による手段を講すること
により、洗浄面の傷を減少させ、例えば半導体チップの
製造において該チップの品質向上を可能にさせる効果が
ある。(a) Effects of the Invention As explained above, the measures of the present invention have the effect of reducing scratches on the cleaning surface and making it possible to improve the quality of semiconductor chips, for example, in the manufacture of such chips.
第１図は本発明によるスクラブ洗浄装置の構成を模式的
に示した側面図、
第２図は従来のスクラブ洗浄装置の構成を模式的に示し
た側面図である。
図面において、
１は保持具、 ２はノズル、
３は洗浄液、 ４．５は洗浄具、
Ａは被洗浄体、 ■は洗浄面、
をそれぞれ示す。
第１図 ７
茅 ２ 図FIG. 1 is a side view schematically showing the configuration of a scrub cleaning device according to the present invention, and FIG. 2 is a side view schematically showing the configuration of a conventional scrub cleaning device. In the drawings, 1 is a holder, 2 is a nozzle, 3 is a cleaning liquid, 4.5 is a cleaning tool, A is an object to be cleaned, and (2) is a cleaning surface. Figure 1 7. Thatch 2 Figure
Claims (1)
周面部が洗浄面を擦る第一の洗浄具と、該回転の過程に
おいて該円周面部を擦る第二の洗浄具とを具えているこ
とを特徴とするスクラブ洗浄装置。 （２）前記第二の洗浄具は、円筒状をなし、中心軸を軸
に回転して該円筒状の円周面部が前記第一の洗浄具の円
周面部を擦ることを特徴とする特許請求の範囲第Ｔｌ）
項記載のスクラブ洗浄装置。 （３）前記第二の洗浄具はブラシで形成されていること
を特徴とする特許請求の範囲第（２）項記載のスクラブ
洗浄装置。 （４）前記第二の洗浄具はスポンジで形成されているこ
とを特徴とする特許請求の範囲第（２）項記載のスクラ
ブ洗浄装置。[Scope of claims] A scrub cleaning device characterized by comprising a second cleaning tool. (2) The second cleaning tool has a cylindrical shape, and rotates around a central axis to remove the cylindrical circumferential surface. (Claim No. TI), characterized in that the cleaning tool rubs the circumferential surface portion of the first cleaning tool.
Scrub cleaning device as described in Section. (3) The scrub cleaning device according to claim (2), wherein the second cleaning tool is formed of a brush. (4) The scrub cleaning device according to claim (2), wherein the second cleaning tool is made of a sponge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59096984A JPS60240129A (en) | 1984-05-15 | 1984-05-15 | Scrub washing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59096984A JPS60240129A (en) | 1984-05-15 | 1984-05-15 | Scrub washing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60240129A true JPS60240129A (en) | 1985-11-29 |
Family
ID=14179475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59096984A Pending JPS60240129A (en) | 1984-05-15 | 1984-05-15 | Scrub washing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60240129A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6349285A (en) * | 1986-08-18 | 1988-03-02 | 松下電器産業株式会社 | Washer |
| JPH0214775A (en) * | 1988-03-25 | 1990-01-18 | Eduard Kuesters Mas Fab Gmbh & Co Kg | Roller cleaning device |
| JPH0817771A (en) * | 1994-07-04 | 1996-01-19 | Shin Etsu Handotai Co Ltd | Brush cleaning device and work cleaning system |
| EP0764478A1 (en) * | 1995-09-20 | 1997-03-26 | Ebara Corporation | Method of and apparatus for cleaning workpiece |
| WO1999051398A1 (en) * | 1998-04-08 | 1999-10-14 | Applied Materials, Inc. | Apparatus and methods for slurry removal in chemical mechanical polishing |
| EP1733810A1 (en) * | 2005-06-17 | 2006-12-20 | Sacmi Cooperativa Meccanici Imola Societa' Cooperativa | Method and apparatus for reconditioning tools used to machine sanitaryware and the like. |
| JP2007167700A (en) * | 2005-12-19 | 2007-07-05 | Toppan Printing Co Ltd | Foreign matter removing method and multilayer body manufacturing apparatus |
| CN109201547A (en) * | 2017-06-30 | 2019-01-15 | 中电海康集团有限公司 | Wafer cleaning device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56119204A (en) * | 1980-02-22 | 1981-09-18 | Nomura Sangyo Kk | Cleaning apparatus of rotary cylindrical brush |
-
1984
- 1984-05-15 JP JP59096984A patent/JPS60240129A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56119204A (en) * | 1980-02-22 | 1981-09-18 | Nomura Sangyo Kk | Cleaning apparatus of rotary cylindrical brush |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6349285A (en) * | 1986-08-18 | 1988-03-02 | 松下電器産業株式会社 | Washer |
| JPH0214775A (en) * | 1988-03-25 | 1990-01-18 | Eduard Kuesters Mas Fab Gmbh & Co Kg | Roller cleaning device |
| JPH0817771A (en) * | 1994-07-04 | 1996-01-19 | Shin Etsu Handotai Co Ltd | Brush cleaning device and work cleaning system |
| EP0764478A1 (en) * | 1995-09-20 | 1997-03-26 | Ebara Corporation | Method of and apparatus for cleaning workpiece |
| US5860181A (en) * | 1995-09-20 | 1999-01-19 | Ebara Corporation | Method of and apparatus for cleaning workpiece |
| WO1999051398A1 (en) * | 1998-04-08 | 1999-10-14 | Applied Materials, Inc. | Apparatus and methods for slurry removal in chemical mechanical polishing |
| EP1733810A1 (en) * | 2005-06-17 | 2006-12-20 | Sacmi Cooperativa Meccanici Imola Societa' Cooperativa | Method and apparatus for reconditioning tools used to machine sanitaryware and the like. |
| JP2007167700A (en) * | 2005-12-19 | 2007-07-05 | Toppan Printing Co Ltd | Foreign matter removing method and multilayer body manufacturing apparatus |
| CN109201547A (en) * | 2017-06-30 | 2019-01-15 | 中电海康集团有限公司 | Wafer cleaning device |
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