JPS60249355A - Plastic chip carrier and manufacture thereof - Google Patents
Plastic chip carrier and manufacture thereofInfo
- Publication number
- JPS60249355A JPS60249355A JP59105490A JP10549084A JPS60249355A JP S60249355 A JPS60249355 A JP S60249355A JP 59105490 A JP59105490 A JP 59105490A JP 10549084 A JP10549084 A JP 10549084A JP S60249355 A JPS60249355 A JP S60249355A
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- resin
- plastic chip
- adhesive
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は樹脂封入型半導体装置に関し、特に外部リード
を樹脂本体に沿わせて樹脂本体の底面の内側方向にリー
ド成形したプラスチックチップキャリアとその製造装置
に関するものである。[Detailed Description of the Invention] [Technical Field] The present invention relates to a resin-encapsulated semiconductor device, and more particularly to a plastic chip carrier in which external leads are formed along the resin body toward the inside of the bottom surface of the resin body, and an apparatus for manufacturing the same. It is something.
従来、プラスチックチップキャリアは第３図、第４図に
示すように半導体素子１が搭載されたリードフレーム２
と、半導体素子１の外部リード３と、これらを樹脂封入
した樹脂本体４とからなっている。また５は半導体素子
１とリードフレーム２とを結線する金属細線である。Conventionally, a plastic chip carrier has a lead frame 2 on which a semiconductor element 1 is mounted, as shown in FIGS. 3 and 4.
, external leads 3 of the semiconductor element 1, and a resin body 4 in which these are sealed in resin. Further, 5 is a thin metal wire that connects the semiconductor element 1 and the lead frame 2.
外部リード３は樹脂本体４に沿って底面内側方向にリー
ド成形されておシ、樹脂本体４の底面腹部４ａはプリン
ト配線基板表面６から帆５ ｍｍ〜１．０ｕｒｎ程度離
れている。これは消費電力の大きい半導体素子の場合に
熱放散を目的として強制空冷を行なう為に間隙をあけて
いるものである。一方、プラスチックチップキャリアを
プリント配線基板に実装する方法として接着剤７によっ
てパッケージを基板に仮止めし、その後噴流半田によっ
て実装を行なう方法が大半である。この場合、プラスチ
ックチップキャリアの底面腹部は基板から帆５ ｍｙｎ
〜１．０朋離れている為に、接着剤がプラスチックチッ
プキャリアの底面腹部に至らない場合があり、仮止めが
不確実になるという問題点がある。また、自動実装機を
用いてプリント基板８にパッケージを実装する場合、一
般的にチップ部品は供給テープに粘着テープ９で貼りつ
けられ、巻きとってリールにする。その後リールを自動
実装機にセットし、チップ部品をリールのテープによっ
て供給する方法が主流である。The external leads 3 are molded inward toward the bottom along the resin body 4, and the bottom abdomen 4a of the resin body 4 is separated from the printed wiring board surface 6 by about 5 mm to 1.0 urn. This gap is provided in order to perform forced air cooling for the purpose of heat dissipation in the case of a semiconductor element that consumes a large amount of power. On the other hand, most methods for mounting a plastic chip carrier on a printed wiring board include temporarily fixing the package to the board with an adhesive 7, and then mounting with jet solder. In this case, the bottom belly of the plastic chip carrier is 5 myn away from the substrate.
Because of the distance of ~1.0 mm, the adhesive may not reach the bottom surface of the plastic chip carrier, resulting in a problem that temporary fixing becomes uncertain. Furthermore, when a package is mounted on a printed circuit board 8 using an automatic mounting machine, chip components are generally attached to a supply tape with an adhesive tape 9 and wound into a reel. The mainstream method is to then set the reel on an automatic mounting machine and supply the chip components with tape on the reel.
しかしながら、第５図に示すように従来のプラスチック
チップキャリアの底面腹部４ＯＬは外部り一部３の最下
点３ｃＬから０．５１ａｍ −１，０ｍｍ離れている為
に、供給テープ１０に粘着テープ９で貼りつけることが
できない。However, as shown in FIG. 5, the bottom abdomen 4OL of the conventional plastic chip carrier is 0.51 am - 1.0 mm away from the lowest point 3 cL of the outer part 3, so the adhesive tape 9 is attached to the supply tape 10. It cannot be pasted.
従って、プラスチックチップキャリアを使用する実装メ
ーカーによって、自動実装を行なう為に底面腹部４ＣＬ
が外部リード最下点３ａとほぼ同一平面であることが不
可欠な場合と、他方、高消費電力製品の場合、強制空冷
をする為にプラスチックチップキャリアの底面腹部４α
とリード先端のなす平面との距離ｅを帆５ ｍｍ〜１．
０ｍｍ基板から離すことが不可欠である場合とがあった
。Therefore, some mounting manufacturers using plastic chip carriers may use the bottom belly 4CL for automatic mounting.
In cases where it is essential that the bottom surface of the plastic chip carrier be almost flush with the lowest point 3a of the external lead, and on the other hand, in the case of high power consumption products, the bottom abdomen 4α of the plastic chip carrier is required for forced air cooling.
The distance e between the plane and the tip of the reed is 5 mm to 1.
There were cases where it was essential to maintain a distance of 0 mm from the substrate.
本発明の目的はプラスチックチップキャリアの底面腹部
と外部リード先端のなす平面の距離を容易に変えられる
プラスチックチップキャリアの形状とその製造装置を提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a shape of a plastic chip carrier and an apparatus for manufacturing the same, which can easily change the distance between the bottom surface of the plastic chip carrier and the plane formed by the tips of the external leads.
本発明は半導体素子を封入した樹脂本体の底面の一部に
、外部リード最下点のなす平面とほぼ同一面まで下方に
延在させた突起部を設けたことを特徴とするパッケージ
、及び樹脂本体の底面を象る樹脂封入用下型の底部一部
に樹脂封止用を兼ねた離型用イジェクタ−ビンを嵌挿さ
せる樹脂注入口を開口したことを特徴とするプラスチッ
クチップキャリアの製造装置である。The present invention relates to a package and a resin package, characterized in that a protrusion is provided on a part of the bottom surface of a resin body in which a semiconductor element is encapsulated, and extends downward to almost the same plane as the lowest point of the external lead. A manufacturing apparatus for a plastic chip carrier, characterized in that a resin injection port is opened in a part of the bottom of a lower mold for resin encapsulation, which models the bottom surface of the main body, into which a release ejector bottle which also serves as resin encapsulation is inserted. It is.
以下に、本発明の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図において、本発明は半導体素子１を樹脂封入した
樹脂本体４の底部４ｂの一部に、外部ＩＪ −ド３の最
下点３ｃＬのなす平面１０とほぼ同一平面まで延在させ
た円柱状突起部１１を突設したものである。In FIG. 1, the present invention includes a circle extending to a part of the bottom part 4b of the resin body 4 in which the semiconductor element 1 is sealed in resin to almost the same plane as the plane 10 formed by the lowest point 3cL of the external IJ-board 3. A columnar protrusion 11 is provided in a protruding manner.
尚、突起部１１は円柱状以外のものでも良い。Note that the protrusion 11 may have a shape other than a cylinder.
本発明によるプラスチックチップキャリアが、プリント
基板に実装されている状態の断面図を第１図に示す。本
発明によるプラスチックチップキャリアは、パッケージ
の底面に下方に延びた円柱状突起部１１を有するので、
プリント配線基板１２に該プラスチックチップキャリア
を仮止めする場合、接着剤１３が円柱状突起部１１によ
って押し広げられ、円柱状突起部底面全体に接着剤が付
着する。かかる効果は接着剤１３の量にバラツキが大き
い場合により効果的であり、接着剤が少ない場合でも円
柱突起部底面と基板表面との間隙が小さいので、正確に
広がって付着する。また、接着剤１３が過多の場合でも
円柱突起部１１と電気的コンタクト部３αの間に十分な
間隙１４があり、この間隙は接着剤溜めの役割を果す。FIG. 1 shows a cross-sectional view of a plastic chip carrier according to the present invention mounted on a printed circuit board. Since the plastic chip carrier according to the present invention has a cylindrical protrusion 11 extending downward on the bottom surface of the package,
When temporarily fixing the plastic chip carrier to the printed wiring board 12, the adhesive 13 is spread out by the cylindrical projection 11, and the adhesive adheres to the entire bottom surface of the cylindrical projection. This effect is more effective when there are large variations in the amount of adhesive 13, and even when there is a small amount of adhesive, the gap between the bottom surface of the cylindrical protrusion and the substrate surface is small, so that it spreads and adheres accurately. Further, even when there is an excessive amount of adhesive 13, there is a sufficient gap 14 between the cylindrical protrusion 11 and the electrical contact portion 3α, and this gap serves as an adhesive reservoir.
また、自動実装機を用いる場合にも粘着テープによって
円柱突起部が接着され、同様にパッケージが供給テープ
に保持される。このように、実装に際し有効な円柱状突
起部は本発明による製造装置によって形成され、実装メ
ーカーの要求に柔軟に対応して円柱状突起部の有無を切
換えられるものである。Furthermore, when an automatic mounting machine is used, the cylindrical protrusion is adhered with adhesive tape, and the package is held on the supply tape in the same way. In this way, the cylindrical protrusion that is effective during mounting is formed by the manufacturing apparatus according to the present invention, and the presence or absence of the cylindrical protrusion can be switched flexibly in response to the requirements of the mounting manufacturer.
一般的に、半導体素子１が搭載されたリードフレーム２
は金属細線５によって結線された後、樹脂封入する為に
上型１５と下型１６との間に挾み込まれて樹脂が注入さ
れる。樹脂が熱硬化した後、上型と下型とは自動的に上
下に分れて、その後樹脂本体の底面に位置する樹脂離型
用イジェクターゼン１７が上昇し、樹脂本体４をつき上
げて型離れさせる。Generally, a lead frame 2 on which a semiconductor element 1 is mounted
are connected by thin metal wires 5, and then sandwiched between an upper mold 15 and a lower mold 16 for resin encapsulation, and resin is injected therein. After the resin is thermally cured, the upper mold and lower mold are automatically separated into upper and lower parts, and then the resin mold release ejector Zen 17 located at the bottom of the resin body rises to push up the resin body 4 and release the mold. let go
本発明による製造装置は第２図に示すように、樹脂本体
４の底面４αを象る樹脂封入用下型１６の内側底部１６
（Ｚの一部に、樹脂封止用を兼ねた離型用イジェクタ−
ビン１７を嵌挿させる樹脂封入口１ｆ３６を開口したも
のである。外部リード先端となるべき金型掘込み部１８
を含む平面１９とほぼ一致する位置まで樹脂離型用イジ
ェクタ−ビン１７の上面を注入口１６ｂ内に嵌挿させ、
樹脂を注入して硬化させる。As shown in FIG. 2, the manufacturing apparatus according to the present invention includes an inner bottom part 16 of a lower mold 16 for resin encapsulation that models the bottom surface 4α of the resin main body 4.
(There is a mold release ejector that also serves as resin sealing in a part of Z.)
A resin sealing port 1f36 into which the bottle 17 is inserted is opened. Mold digging part 18 that should become the tip of the external lead
Insert the upper surface of the resin mold release ejector bin 17 into the injection port 16b until it almost coincides with the plane 19 including the
Inject the resin and let it harden.
その後、封入金型１５ 、１６を上下に分けて離型用イ
ジェクタ−ビン１７で樹脂本体を突き上げて型離れさせ
る。このようにしてできたプラスチックチップキャリア
には、離型用イジェクタ−ビンによって円柱状突起部１
１が形成される。また、離型用イジエククーピンの挿入
する位置によって円柱状突起部を成型するのであるため
、突起部の高さ調整又は突起部の有無の切換は非常に容
易であり、異なった封入金型を新規に製作する必要がな
い。Thereafter, the enclosing molds 15 and 16 are divided into upper and lower parts, and the resin body is pushed up with a mold release ejector bin 17 to separate the molds. The plastic chip carrier made in this way has a cylindrical protrusion 1 formed by an ejector bottle for mold release.
1 is formed. In addition, since the cylindrical protrusion is molded depending on the position where the releasing cup pin is inserted, it is very easy to adjust the height of the protrusion or switch between the presence and absence of the protrusion, and it is possible to use a new mold for different encapsulation molds. No need to manufacture.
なお、離型用イジエククーピンの位置の調整はイジェク
タ−ビンの長さ自体を変更する方法と、イジェクタ−ビ
ン突上げ部にスペーサーを挿入して位置を調整する方法
があり、前者は大量に生産する場合に適しており、安定
して長さ精度の高い円柱状突起を形成することができる
。後者は、小量で頻繁に円柱状突起の有無を切換える場
合に適しておシ、容易に変更が可能である。There are two ways to adjust the position of the ejector cup for releasing the mold: one is to change the length of the ejector bin itself, and the other is to adjust the position by inserting a spacer into the ejector bin's protruding part.The former method requires mass production. It is suitable for various cases, and can stably form cylindrical protrusions with high length accuracy. The latter is suitable for frequently switching between the presence and absence of cylindrical protrusions in small quantities, and can be easily changed.
本発明は以上説明したように、プラスチックチップキャ
リアを他のチップ部品と同様にテープに貼りつけてリー
ルに巻きとり、自動実装機にリール供給することができ
る。また、基板に実装するに際して従来のプラスチック
チップキャリアでは、パッケージの腹部が凹状の為に接
着剤による仮止めが不確実であったが、本発明によるプ
ラスチックチップキャリアによればパッケージの腹部が
突起部により凸状になっている為、仮止めが確実となり
実装歩留りを向上できる。As described above, according to the present invention, a plastic chip carrier can be attached to a tape and wound onto a reel in the same way as other chip components, and the reel can be supplied to an automatic mounting machine. In addition, when mounting on a board, with conventional plastic chip carriers, temporary fixing with adhesive was uncertain due to the concave shape of the package's belly, but with the plastic chip carrier of the present invention, the package's belly has a protrusion. Since it has a convex shape, temporary fixing becomes reliable and the mounting yield can be improved.
さらに本発明は、封入用金型の離型用イジェクタ−ビン
を利用して製造するものであり、新規な金型を製作する
必要がなく、消費電力の大きな半導体素子等のように基
板とパッケージの間に間隙の必要な場合には、イジェク
タ−ビンの挿入高さを調整することによｐ、パッケージ
底面とイジェクタ−ビン上面を一致させることによって
、本発明による円柱突起をなくすことができる。即ち、
同一の設備によって二種類のプラスチックチップキャリ
アが製造し得るものであるため、設備の稼働率を向上で
き、設備を変えることなく、実装メーカーの要求に柔軟
に対応することができる効果を有するものである。Furthermore, the present invention utilizes the mold release ejector bin of the encapsulation mold for manufacturing, so there is no need to create a new mold, and it is possible to manufacture the product by using the ejector bin for mold release of the encapsulation mold. If a gap is required between the two, the cylindrical protrusion according to the present invention can be eliminated by adjusting the insertion height of the ejector bin and by aligning the bottom surface of the package with the top surface of the ejector bin. That is,
Since two types of plastic chip carriers can be manufactured using the same equipment, the operating rate of the equipment can be improved, and it has the effect of being able to flexibly respond to the demands of mounting manufacturers without changing the equipment. be.
第１図は本発明に係るプラスチックチップキャリアを基
板に実装した状態の断面図、第２図は本発明の製造装置
を示す断面図、第３図は従来のプラスチックチップキャ
リアの側面図、第４図は従来のプラスチックチップキャ
リアが基板に実装されている状態の断面図、第５図は従
来のプラスチックチップキャリアがテープに貼りつけら
れている状態の断面図である。
１・・半導体素子、２・・・リードフレーム、４・・・
樹脂本体、１１・・・円柱状突起部、１５・・・封入金
型上型、１６・・・封入金型下型、１６ｂ・・樹脂注入
口、１７・・・離型用イジェクタ−ビン
第１図
第２図FIG. 1 is a sectional view of a plastic chip carrier according to the present invention mounted on a substrate, FIG. 2 is a sectional view showing a manufacturing apparatus of the present invention, FIG. 3 is a side view of a conventional plastic chip carrier, and FIG. The figure is a sectional view of a conventional plastic chip carrier mounted on a board, and FIG. 5 is a sectional view of a conventional plastic chip carrier attached to a tape. 1...Semiconductor element, 2...Lead frame, 4...
Resin main body, 11... Cylindrical protrusion, 15... Encapsulating mold upper mold, 16... Enclosing mold lower mold, 16b... Resin injection port, 17... Ejector bin for mold release No. Figure 1 Figure 2
Claims (2)
体に沿わせて、樹脂本体の底面の内側方向に成形したプ
ラスチックチップキャリアにおいて、樹脂本体の底面の
一部に、外部リードの最下点のなす平面とほぼ同一平面
まで下方に延在させた突起部を設けたことを特徴とする
プラスチックチップキャリア。(1) In a plastic chip carrier in which the external leads of a resin-encapsulated semiconductor element are molded along the resin body and inward from the bottom of the resin body, the lowest point of the external lead is placed on a part of the bottom of the resin body. A plastic chip carrier characterized by having a protrusion extending downward to almost the same plane as the plane formed by the plastic chip carrier.
体に沿わせて、樹脂本体の底面の内側方向に成形したプ
ラスチックチップキャリアの製造装置において、樹脂本
体の底面を象る樹脂封入用下型の底部の一部に、樹脂封
止用を兼ねた離型用イジェクタ−ビンを嵌挿させる樹脂
注入口を開口したことを特徴とするプラスチックチップ
キャリアの製造装置・(2) A lower mold for resin encapsulation that models the bottom surface of the resin body in a plastic chip carrier manufacturing equipment in which the external leads of the resin-encapsulated semiconductor element are aligned with the resin body and molded toward the inside of the bottom surface of the resin body. A manufacturing apparatus for a plastic chip carrier, characterized in that a resin injection port is opened in a part of the bottom part of the plastic chip carrier, into which a mold release ejector bottle which also serves as resin sealing is inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59105490A JPS60249355A (en) | 1984-05-24 | 1984-05-24 | Plastic chip carrier and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59105490A JPS60249355A (en) | 1984-05-24 | 1984-05-24 | Plastic chip carrier and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60249355A true JPS60249355A (en) | 1985-12-10 |
Family
ID=14409034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59105490A Pending JPS60249355A (en) | 1984-05-24 | 1984-05-24 | Plastic chip carrier and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60249355A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298654U (en) * | 1989-01-26 | 1990-08-06 | ||
| JPH02278858A (en) * | 1989-04-20 | 1990-11-15 | Nec Corp | J-bend type integrated circuit |
-
1984
- 1984-05-24 JP JP59105490A patent/JPS60249355A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298654U (en) * | 1989-01-26 | 1990-08-06 | ||
| JPH02278858A (en) * | 1989-04-20 | 1990-11-15 | Nec Corp | J-bend type integrated circuit |
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