JPS603138A - Simultaneous enforcement of brazing of iron substrate and copper disk and glass sealing of leads of stem for electronic parts - Google Patents

Abstract

PURPOSE:To contrive to attain labor-saving at manufacture of a stem for an electronic parts by a method wherein glass sealing and brazing of leads are made as to be performable simultaneously using a brazing material consisting of copper and tin of the specified ratio for brazing. CONSTITUTION:A copper disk 2 is put upon the top side of an iron substrate 1, and a hole 2a for pouring of a brazing material is provided to the disk 2 thereof. The brazing material 5 is inserted into the hole 2a thereof. The brazing material piece 5 thereof is consisting of 82-85% of copper and 18-15% of tin. Moreover a pair of leands 3, 3 are penetrated respectively in the central holes of sealing materials 4 consisting of a cylindrically molded part of powdered glass, and inserted in the holes 1a of the substrate 1 together with the sealing materials 4 thereof. The material assembled like this is put in an oven to be heated at 1,000-1,050 deg.C, and when cooled after the sealing materials 4 and the brazing material pieces 5 are fused simultaneously, the substrate 1 and the disk 2 are brazed, and the leads 3 are sealed to the substrate 1 at the same time.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of simultaneously brazing an iron substrate and a copper disk of a metal and brazing a lead to the iron substrate.

The stem for electronic components is made of iron substrate 1 as shown in Figures 61-3.
A copper disk 2 is soldered thereon, and a pair of glue rods 3 are inserted into the pair of holes 1a and la of the iron substrate 1 and sealed here with a J lath. The power transistor (the rC chip) is mounted on a copper disk, and its 1-M terminal is connected to leads 3 and 3.
Continued. A cap is then placed to cover this.

8. Therefore, when manufacturing such stems, iron j
It requires two steps: (1) the joining of the board 1 and the copper disk 2, and the arrival of the glue 3 into the hole 1a of the iron base 4.However, conventionally, the process of arrival of the board 1 is ,
The brazing process must be carried out in a furnace with a water source atmosphere of approximately 800C, whereas the 1':LD process cannot be performed at the same time. It has become one of the overflow routes for becoming more powerful.
Furthermore, if the material is reheated for waxing after the glass arrives, there is a problem in that the airway properties of the sealing portion deteriorate.

The present invention was made by focusing on the above-mentioned problems in the conventional stem manufacturing method, and uses 82 to 85% copper and 100% copper as a brazing material for jointly brazing a scrap iron substrate and a tin disk.
Use 8-15%, 1000°C-1.050
The purpose of this invention is to solve the above-mentioned conventional problems by making it possible to perform brazing simultaneously with the glass side hole of the lead in the furnace of c.

An example of Mlt according to the present invention will be explained below with reference to the figures.

As shown in FIGS. 1 to 3, a board 1 made of 4μ iron has a pair of holes 1a and 1a in the center for attaching leads, and a pair of bolt insertion holes 1b for attaching to equipment on both sides.

1b. The iron substrate 1 is placed on a carbon jig 10 as shown in Figure 4. Port insertion hole 1b.

1b is engaged with a pair of protrusions 10a, 10a installed on the upper surface of the carbon jig 10 to determine the position F1.7.

The copper biased disk 2 is placed on top of the iron substrate 1.

This [Ql (Il) disk 2 has a hole 2a for pouring the wax 2.

The brazing filler metal pieces 5 are inserted nine times into the holes 2a of each copper trout die 2. This brazing material piece 5 is made of 82% to 85% copper and 18% tin.
~15%, with a melting point of 1.000°C ~ 1.050°C
It is C.

A pair of glues 3, 3 are each inserted into a hole 4a at the center of a sealing material 4 made of a cylindrical molded product of powdered glass, and are inserted together with this sealing material 4 into a hole la of an iron sill plate 1. Ru. An umbrella 3a is provided at the upper j'1% of the lead 3 to prevent it from coming off from the hole 4a on the l;j receiving side'4. The rod 3 extending downward from the iron substrate 1 is received in the support hole 10b of the carbon jig 10. Elbow adhesive 4 has a melting point of 1.000°. ~L
It is 050°.

The material deposited on the carbon jig 10 as described above is placed in a furnace with a nitrogen atmosphere and heated to a temperature of 1,000 c to 1. '050
When heated to c, the brazing filler metal piece 5 melts and flows between the iron substrate 1 and the copper disk 2. At the same time, Lieutenant Arrival 4 is also 1N11M. If these four conditions are taken out of the furnace and cooled, the iron 11 dedicated board 1 and the copper disk 2 will be brazed, and at the same time the leads 3 will be attached to the iron board 1.

As explained above, the present invention provides a pair of leads 3,
3. Cut a copper 51 disk 2 having a hole 2a for pouring the brazing material onto the iron substrate 1 having the insertion holes 1a, 1a, and insert the pair of holes 1a, 3- of the iron B-v substrate 1. a
A seal material 4 made of a cylindrical molded powdered glass with a lead 3 inserted into the hole 4a in the center of each is inserted into the hole 2a of the copper disk 2. , copper 8
1 piece of solder metal piece 5 consisting of 2% to 85% tin and 18% to 15% tin is heated in a furnace to 1.000 c to 1.050 c to seal eJtA4 and solder piece 5. Since the structure is such that the iron substrate 1 and the copper 11j7 disk 2 are melted at the same time and then cooled and solidified, the soldering process of the iron substrate 1 and the copper 11j7 disk 2, and the glass metal machining process of the lead 3 to the iron substrate 1 can be performed simultaneously. This has the effect of not only making it possible to manufacture stems for electronic components in a variety of ways, but also producing high-quality components.

[Brief explanation of the drawing]

Fig. 1 is a front view of the stem for r4 electronic parts, Fig. 2 is a plan view thereof, Fig. 3 is a sectional view taken along the line In-Fll in Fig. 152, and Fig. 44 is a sectional view of the stem in the u/°μ direct process. 1... Iron 17-inch board, 1a... Hole for lead insertion, 2... IHI + Hiroshi disk s 2a... Hole for wax pouring, 4... Glass M & material, 4a
...hole, 5...wax + 2 pieces.

Claims (1)

[Claims] A copper disk with a hole for pouring the solder is placed on an iron substrate with a pair of holes for inserting the leads, and the iron l! ! Into the pair of holes in the substrate, a second piece made of a cylindrical molded product of powdered glass with a lead inserted into the center hole, respectively, is fitted, and in the hole of the copper 6.j1 disk,
1. Iron for stems for electronic parts, consisting of 82% to 85% copper and 18% to 15% silk, which is heated to melt the seal and wax at the same time, and then cooled and solidified. Mi! Simultaneous brazing of the board and 114 disk and crow resistance of the lead M! i
Construction method.