JPS603204A - Assembling method of high frequency filter device - Google Patents
Assembling method of high frequency filter deviceInfo
- Publication number
- JPS603204A JPS603204A JP11050283A JP11050283A JPS603204A JP S603204 A JPS603204 A JP S603204A JP 11050283 A JP11050283 A JP 11050283A JP 11050283 A JP11050283 A JP 11050283A JP S603204 A JPS603204 A JP S603204A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- inductor
- high frequency
- assembling
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
【発明の詳細な説明】
この発明はUHF等の高周波信号を取シ扱う様にしてい
る高周波フィルタ装置、詳しくは基板に、キャビティと
各々のキャビティ内に備えさせた内部導体要素とから成
る高周波フィルタを備えさせて成る高周波フィルタ装置
の組立方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a high frequency filter device that handles high frequency signals such as UHF, and more specifically, a high frequency filter comprising a substrate, a cavity, and an internal conductor element provided in each cavity. The present invention relates to a method of assembling a high frequency filter device comprising:
従来の高周波フィルタ装置の組立方法にあって基板にキ
ャビティを取付け、そのキャビティの狭い内部空間に対
してインダクタを組み込むと共に、更に上記内部空間に
おいて上記のインダクタの両側に大々結合要素を組込む
ようにしていた方法は、非常に細かい作業をせねばなら
ぬ関係上、その作業がやシにくく、またそのような作業
によって出来上った製品は高周波特性が予め予定された
ものから狂ってしまうという欠点があった。In the conventional method of assembling a high frequency filter device, a cavity is attached to a substrate, an inductor is built into the narrow internal space of the cavity, and coupling elements are also built into the narrow internal space on both sides of the inductor. The conventional method has the disadvantage that the work is difficult because it requires very detailed work, and the high-frequency characteristics of the products produced by such work deviate from the predetermined ones. there were.
そこで本発明は、上述の欠点を除くようにしたもので、
組立作業が容易でしかも出来上ったものの高周波特性も
良好となるようにした高周波フィルタ装置の組立方法を
提供しようとするものである。Therefore, the present invention aims to eliminate the above-mentioned drawbacks.
It is an object of the present invention to provide a method for assembling a high frequency filter device which is easy to assemble and has good high frequency characteristics.
以下本願の実施例を示す図面について説明する。The drawings showing the embodiments of the present application will be described below.
第1図乃至第8図において、高周波フィルタ装置Aは基
板lとその基板に取付けた高周波フィルタ(バンドパス
フィルタ)Bとから成る。上記基板1は絶縁板2の表面
と製置に夫々導体箔(銅箔)3.4を貼り付けて形成し
である。それら導体箔3.4はアース導体を形成してい
る。尚この基板lは銅板、鉄板などの導電性の良好な金
属板で形成してもよい。上記基板1において、5はコン
デンサ止材部、6はインダクタ止材部で、これらは人々
透孔をもって構成しである。7はキャビティ止材部を示
し、複数の角孔8をもって構成しである。次に高周波フ
ィルタBにおいて、10 、10は夫々キャビティを示
し、本実施例においては夫4銅板あるいは鉄板に銅メッ
キを施したものなど導電性の良好な金属板で形成された
側板■を3枚と妻板丘を2枚図示されるように組み合わ
せ、相互に半田付して結合することによって、二つのキ
ャビティ10 、10が一体に形成されている。(中間
の側板Uは両キャビティ10 、10に兼用されている
。)上記側板■及び妻板用において’、(L3は嵌合部
、14は嵌合片で、これらは側板11と妻板νを組合わ
す際に相互の位置関係が所定の通シとなるようにする為
に設けられたものである。6は支持板取付部で、側板■
の一部を曲げ起こすことによって形成されてお)、また
ねじ孔16が穿設されている。17は欠如部で、その下
縁17aの高さは取付部15の高さよシも低く形成して
、後述の支持板が接触せぬようにしである。摺は蓋体止
材片で、基部IBaを図示される如く細く形成しである
。19は止材片を示す。次にキャビティ10内に備えさ
せた部材について説明する。4はバリコンで、接地端子
ηとインダクタ接続端子器を有しておシ、接地端子ρを
止付ねじ棒必によって基板1に止め付けである。In FIGS. 1 to 8, a high frequency filter device A consists of a substrate 1 and a high frequency filter (bandpass filter) B attached to the substrate. The substrate 1 is formed by pasting conductor foils (copper foils) 3 and 4 on the surface and the mounting surface of an insulating plate 2, respectively. These conductor foils 3.4 form the ground conductor. Note that this substrate 1 may be formed of a metal plate with good conductivity such as a copper plate or an iron plate. In the substrate 1, 5 is a capacitor fixing member, and 6 is an inductor fixing member, each of which has a through hole. Reference numeral 7 denotes a cavity stopper part, which has a plurality of square holes 8. Next, in the high frequency filter B, 10 and 10 respectively indicate cavities, and in this embodiment, there are three side plates (1) made of metal plates with good conductivity, such as copper plates or iron plates plated with copper. The two cavities 10, 10 are integrally formed by assembling the two end plates as shown and soldering them together. (The middle side plate U is used for both cavities 10 and 10.) In the above side plate ■ and the end plate, (L3 is a fitting part, 14 is a fitting piece, and these are used to assemble the side plate 11 and the end plate ν. This is provided to ensure that the mutual positional relationship matches the specified alignment when mating. 6 is the support plate attachment part, and the side plate ■
), and a screw hole 16 is bored therein. Reference numeral 17 denotes a cutout, and its lower edge 17a is formed to be lower than the height of the mounting portion 15 so that a supporting plate, which will be described later, does not come into contact with it. The slide is a piece of material for fixing the lid, and the base IBa is formed to be thin as shown in the figure. 19 indicates a stopper piece. Next, the members provided inside the cavity 10 will be explained. Reference numeral 4 denotes a variable capacitor, which has a grounding terminal η and an inductor connecting terminal, and the grounding terminal ρ is fixed to the board 1 with a set screw rod.
尚止付ねじ棒Uとしては導電材料(金属)で形成したも
のが用いてあシ、このねじ棒ツによって接地端子4と基
板1の裏面の導体箔4が相互に導通するようにしである
。5はインダクタで、本体25aと支持部25bとから
成る。支持部25bは基板lに対し本体25aを機械的
に止付ける役割と本体δaの一端を基板1のアース導体
(導体箔4)に電気的に接続する役割をもっている。支
持部δblf位置決片加を有しておシ、支持部3bの下
端を基板1に取シ付けた状態において、インダクタ5の
本体25aが基板1から所定の高さのところに位置する
ようにしである。次に田は支持板で、絶縁板四の一面に
導体箔(銅箔)を貼シ付けたもの(プリント基板と称さ
れる)で形成されている。この支持板路において、(資
)、田はキャビティ内在部で、ちょうどキャビティ10
、10内に納まるようキャビティ10の内寸と対応し
た寸法に形成しである。31は切欠き部、部、32は端
子部、詔は止付ねじ棒挿通用の透孔な大4示す。勢は調
整孔で、バリコン210回転軸と投影的に重合する位置
に形成しである。The threaded rod U is made of a conductive material (metal) so that the ground terminal 4 and the conductive foil 4 on the back surface of the substrate 1 are electrically connected to each other by the screw rod U. Reference numeral 5 denotes an inductor, which is composed of a main body 25a and a support portion 25b. The support portion 25b has the role of mechanically fixing the main body 25a to the substrate l and the role of electrically connecting one end of the main body δa to the ground conductor (conductor foil 4) of the substrate 1. The support part δblf has a positioning member so that the main body 25a of the inductor 5 is located at a predetermined height from the board 1 when the lower end of the support part 3b is attached to the board 1. It is. Next is the support plate, which is made of a conductor foil (copper foil) pasted on one side of the insulating plate (referred to as a printed circuit board). In this supporting plate road, the field is inside the cavity, and is exactly at the cavity 10.
, 10, and has dimensions corresponding to the inner dimensions of the cavity 10. 31 is a notch portion, 32 is a terminal portion, and the brim is a large through hole for inserting a set screw rod. The adjustment hole is formed at a position that overlaps the rotation axis of the variable capacitor 210 in projection.
次に導体箔に印刷配線手段(エツチング手段)を施すこ
とによって形成された種々の導体において、稲、35は
アース部、蕊、36は端子で、一方は入力端子、他方は
出力端子として大々利用される。ごは接続導体である。Next, in the various conductors formed by printing wiring means (etching means) on the conductor foil, 35 is a ground part, 36 is a terminal, one is an input terminal, and the other is an output terminal. used. The wire is the connecting conductor.
あ、39は夫々結合要素を示し、各々の一端はアース郡
部につながっていると共に、他端は端子部あるいは接続
導体aにつながっている。次に菊は調整用のトリマコン
デンサで、接続4体ごとアース部あとの間に接続しであ
る。41は蓋で、導電性の良好な材料(例えば銅板)を
ブレスして形成されておシ、前記バリコン4の軸、トリ
マコンデンサ匍の軸と大々投影的に重合する箇所に調整
棒挿入用の透孔C043を有しておシ、又止材用の透孔
伺も有している。尚この蓋dはキャビティ10の内部の
空間を遮蔽するようになっている。The numerals 39 and 39 each represent a coupling element, one end of which is connected to a grounding section, and the other end connected to a terminal section or a connecting conductor a. Next, the chrysanthemum is a trimmer capacitor for adjustment, which is connected between all four connections and the back of the ground section. Reference numeral 41 denotes a lid, which is formed by pressing a material with good conductivity (for example, a copper plate), and is used for inserting an adjustment rod at a location where it overlaps the shaft of the variable capacitor 4 and the shaft of the trimmer capacitor 4 in a projection manner. It has a through hole C043, and also has a through hole for a stopper. Note that this lid d is designed to shield the interior space of the cavity 10.
次に上記構成のものの組み立手順を説明する。Next, the procedure for assembling the above structure will be explained.
先ず第4図に示されるように基板1のバリコン止材部5
にバリコン21を止付ねじ棒で止付ける。次にインダク
タ器の支持部25bを止材部6に挿通してアース導体4
に半田付すると共に、インダクタ本体25aの一端を接
続端子器に半田付けする。なお上記支持部25bの半田
付けは基板の表面にあるアース導体3と半田付けしても
、あるいは両方3゜4に半田付けしてもよい。First, as shown in FIG.
Attach the variable capacitor 21 to with a set screw rod. Next, the support part 25b of the inductor device is inserted through the stopper part 6 to connect the ground conductor 4.
At the same time, one end of the inductor body 25a is soldered to the connection terminal. Note that the support portion 25b may be soldered to the ground conductor 3 on the surface of the board, or both may be soldered to 3.degree. 4.
次に予め第4図に示されるように組立てておいたキャビ
ティ10 、10を組み付ける。この組付けは、各止材
片I9を各角孔8に差し通し、その先端を導体箔4に半
田付することによシ行なう。Next, the cavities 10, which have been assembled in advance as shown in FIG. 4, are assembled. This assembly is carried out by inserting each stopper piece I9 into each square hole 8 and soldering its tip to the conductor foil 4.
尚キャビティ10の止材け、コンデンサ4及びインダク
タ25の組付よシ先に行なってもよい。Incidentally, the fixing of the cavity 10 may be performed before the capacitor 4 and the inductor 25 are assembled.
次に予めトリマコンデンサ菊が取付けられた支持板あを
、キャビティ内在部、J、aOが各キャビティ10 、
10内に納まってそれらの縁部が取付部すの上に乗るよ
うに組み込み、止材ねじ棒栃を透孔田を通してねじ孔1
6に螺着させて、上記支持飯田をキャビディ10に一体
化固定する。これによシ、アース郡部は取付部正を介し
てキャビティ10と導通状態(同電位の状態)となる。Next, the support plate A to which the trimmer capacitor chrysanthemum was attached in advance is placed inside the cavity, J, aO are each cavity 10,
10 so that their edges rest on the mounting part, and insert the retaining threaded rod into the screw hole 1 through the through-hole field.
6 to integrally fix the support Iida to the cavity 10. As a result, the grounding section becomes electrically connected to the cavity 10 (at the same potential) via the mounting section.
また各キャビディ10内における結合要素器、39け第
3図に示される如くインダクタ部の両側において設計上
予定された位置関係で並設状態となる。Further, as shown in FIG. 3, the coupling elements 39 in each cavity 10 are arranged side by side on both sides of the inductor section in a designed positional relationship.
次に蓋41を止材片招が透孔刹に差し通るように被せつ
け、止材片摺の透孔羽から突出した部分をねじシ変形さ
せることによって蓋dをキャビティ10に固定する。Next, the lid 41 is placed on the lid 41 so that the stopper piece passes through the hole, and the lid d is fixed to the cavity 10 by screwing and deforming the portion of the stopper piece that protrudes from the hole blade.
以上のような操作によってフィルタ装置Aが完成する。The filter device A is completed by the above operations.
上記構成のものKあっては、図示外のリード線を介して
一方の端子36(入力端子)に入力された高周波信号(
例えばUHFのテレビ信号)は一方のキャビティ10内
においてその端子部に連なる結合要素器に伝わシ、更に
キャビティ10内の各部材相互の周知の電気的結合を通
して結合要素器に伝わる。更にその信号は接続導体Jを
通して他方のキャビティ10内の結合要素器に伝えられ
、そのキャビティ10内の部材の周知の電気的結合を通
して結合要素器に伝わル、そこを通して他方の端子部(
出力端子)に伝わる。このようにして上記信号が高周波
フィルタBを通過する過程で周知のフィルタ作用が行な
われ、フィルタBに入力する信号が多数であっても、そ
のうちの所定の帯域の信号のみが出力側の端子あに現わ
れる。In the above configuration K, a high frequency signal (
For example, a UHF television signal) is transmitted within one cavity 10 to a coupling element connected to the terminal portion thereof, and further transmitted to the coupling element through well-known electrical connections between the members within the cavity 10. Further, the signal is transmitted through the connecting conductor J to the coupling element in the other cavity 10, through the well-known electrical coupling of the members in that cavity 10 to the coupling element, and through there to the coupling element in the other terminal (
output terminal). In this way, a well-known filtering effect is performed during the process in which the above-mentioned signal passes through the high-frequency filter B, and even if there are many signals input to the filter B, only the signals in a predetermined band among them are sent to the output terminal. appears in
次に本願の異なる実施例を示す図面第9図について説明
する。この図は支持板2Beに更に他の回路導体を備え
させた例を示すものである。図において、支持板281
3は絶縁板29eの表裏両面に導体箔を備えたもので形
成しである。裏面の導体箔には前実施例と同様の種4の
導体が形成しである一方、表面の導体箔にはアース部6
.45及び結合度調整要素46が形成しである。尚この
結合度調整要素46は、該支持板28eをキャビティに
取付けた状態において前記インダクタと投影的に重合す
る位置に形1戊しである。Next, FIG. 9, which shows a different embodiment of the present application, will be described. This figure shows an example in which the support plate 2Be is further provided with other circuit conductors. In the figure, support plate 281
3 is formed by providing conductor foil on both the front and back surfaces of an insulating plate 29e. The conductor foil on the back side has a conductor of type 4 similar to the previous example, while the conductor foil on the front side has a ground portion 6.
.. 45 and a coupling degree adjusting element 46 are formed. The degree of coupling adjustment element 46 has a shape of 1 at a position where it overlaps the inductor in projection when the support plate 28e is attached to the cavity.
上記のような構成のものは、それを前記キャビティに取
付けて使用した場合、第10図に2点鎖線で示されるよ
うな特性を示して帯域を広くすることができる。このよ
うな特性をもつフィルタは複数のチャンネルを通過させ
るバンドパスフィルタとして用いるに好都合である。ま
た上記使用状態において調整要素弱とアース部6とを符
号47 、47・・・で示される位置で半田付して接続
すると、第1O図で実線で示されるような特性を示して
帯域を狭くすることができる。このような特性をもつフ
ィルタは単チャンネルを通過させるバンドパスフィルタ
として用いるに好都合である。When the device having the above configuration is installed in the cavity and used, it exhibits the characteristics shown by the two-dot chain line in FIG. 10 and can widen the band. A filter with such characteristics is conveniently used as a bandpass filter that passes a plurality of channels. In addition, when the adjustment element weak and the ground part 6 are connected by soldering at the positions indicated by 47, 47, etc. in the above-mentioned state of use, the characteristic shown by the solid line in Fig. 1O is exhibited and the band is narrowed. can do. A filter with such characteristics is conveniently used as a bandpass filter that passes a single channel.
尚上記調整要素栃は両端がアース部6,45に大々つな
がった状態に形成しておいて、所望によシその接続部分
をナイフ等でカットするようにしてもよい。The adjustment element chestnut may be formed with both ends connected to the ground portions 6, 45, and the connected portions may be cut with a knife or the like, if desired.
尚機能上前図のものと同−又は均等構成と考えられる部
分には、前回と同一の符号にアルファベットのeを付し
て重複する説明を省略した。(まだ次回のものにおいて
も同様の考えでfを付して重複する説明を省略する。)
次に第11図は本願の更に異なる実施例を示すもので、
よシ多数のフィルタが並設されているフィルタ装置の例
を示すものである。It should be noted that parts that are functionally the same or equivalent to those in the previous figure are given the same reference numerals with the letter e and redundant explanations are omitted. (The same concept will be used in the next version as well, and the redundant explanation will be omitted.) Next, FIG. 11 shows a further different embodiment of the present application.
This is an example of a filter device in which a large number of filters are arranged in parallel.
以上のようにこの発明にあっては、
(イ)組立に当ってインダクタ5を組付ける場合、結合
要素器、39の組付に先立ってそれを行なうから、イン
ダクタ5を1本単独で組付ければよく(両横に結合要素
ア、園を並べて取付ける必要がないから)、極めて作業
性良く(3本を並べて取付けるのに比べて大巾に簡単に
)組付けできる効果がある。As described above, in this invention, (a) When assembling the inductor 5 during assembly, it is done before assembling the coupling element device 39, so that the inductor 5 can be assembled alone. It has the effect of being easy to assemble (because there is no need to mount the connecting elements side by side on both sides) and workability is very good (much easier than installing 3 pieces side by side).
呻)またキャビティ10の組付に関しても同様に、その
止付はキャビティ単独で容易に行ない得る効果がある。Similarly, regarding the assembly of the cavity 10, there is an effect that the assembly can be easily performed by the cavity alone.
(ハ)更にインダクタ6及びキャビティ10を基板1に
止付けだ状11においては、キャビティlO及びインダ
クタδを基板1を中心に位置決でき、相互の位置関係を
設計上予定された位置関係にすることができる特長がお
る。(c) Further, in the ridge 11 that fixes the inductor 6 and the cavity 10 to the substrate 1, the cavity lO and the inductor δ can be positioned centering on the substrate 1, and their mutual positional relationship is set as planned in the design. There are features that allow you to
に)その上、2本の結合要素ア、39をインダクタ6の
両側に各1木兄位置するように組付ける場合、それらの
結合要素38.39は、予めキャビティ10との位置関
係が定まるようKしである支持板器に印刷配線手段で形
成しであるから、上記支持板器をキャビティ10に設け
られた取付部すに取付けるだけでそれら両結合要素38
.39の所定位置への組付を完了でき、組付作業を極め
て簡易に行ない得る効果もある。In addition, when the two coupling elements 38 and 39 are assembled so that they are positioned one inch each on both sides of the inductor 6, the coupling elements 38 and 39 are arranged so that the positional relationship with the cavity 10 is determined in advance. Since the support plate is formed with a printed wiring means, the support plate is simply attached to the mounting portion provided in the cavity 10, and both connecting elements 38 are connected.
.. 39 can be completed in a predetermined position, and there is also an effect that the assembling work can be performed extremely easily.
09シかも上記のようにして個々別々に組付を行なうも
のでも、組付完了状態においては、上記のようにキャビ
ティ10とインダクタ5、キャビティ10と両結合要素
38.31、インダクタ器と両結合要素オ、3gの位置
関係が定まシ、設計上予定された高周波特性を正しく得
ることのできる効果がある。Even if the assembly is performed individually as described above, in the assembled state, the cavity 10 and the inductor 5, the cavity 10 and both coupling elements 38 and 31, and the inductor and both couplings are connected as described above. The positional relationship between elements 0 and 3g is determined, and there is an effect that the designed high frequency characteristics can be obtained correctly.
図面は本願の実施例を示すもので、第1図は斜視図、第
2図はl−1線断面図、第3図はI−1線断面図、第4
図はキャビティを組付ける前の状態を示す斜視図、第5
図は支持板を組付ける前の状態を示す斜視図、第6図は
支持板の裏面図、第7図は立体回路図、第8図はキャビ
ティの分解斜視図、第9図は支持板の異なる例を示す斜
視図、第10図は特性図、第11図は複数連結状のフィ
ルタ装置において支持板のみを離間させて内部構造が認
視できるようにした状態の図。
1・・・基板、10・・・キャビティ、5・・・インダ
クタ、あ・・・支持板、蕊、39・・・結合要素。
第1図
第3[
第1図
第4図The drawings show an embodiment of the present application, and FIG. 1 is a perspective view, FIG. 2 is a sectional view taken along line I-1, FIG. 3 is a sectional view taken along line I-1, and FIG.
The figure is a perspective view showing the state before the cavity is assembled.
The figure is a perspective view showing the state before the support plate is assembled, Figure 6 is a back view of the support plate, Figure 7 is a three-dimensional circuit diagram, Figure 8 is an exploded perspective view of the cavity, and Figure 9 is a view of the support plate. FIG. 10 is a perspective view showing a different example, FIG. 10 is a characteristic diagram, and FIG. 11 is a diagram of a multi-connected filter device in which only the support plates are separated so that the internal structure can be seen. DESCRIPTION OF SYMBOLS 1...Substrate, 10...Cavity, 5...Inductor, A...Support plate, holder, 39...Coupling element. Figure 1 Figure 3 [ Figure 1 Figure 4
Claims (1)
導体要素とから成る高周波フィルタを付設し、しかも上
記内部導体要素は、インダクタとそのインダクタの両側
に各1木兄並設させた結合要素とによシ構成している高
周波フィルタ装置の組立方法において、上記基板にはキ
ャビティ上付部とインダクタ上付部とを予め設けておき
、一方上記キャビティには支持板取付部を予め設けてお
き、他方、上記結合要素は、上記支持板取付部への取付
を可能に形成した支持板に対して、印刷配線手段でもっ
て予め付設しておき、組立に当っては、上記キャビティ
上付部及びインダクタ上付部に夫々キャビティ及びイン
ダクタを止付け、然る後、上記結合要素が付設されてい
る支持板を上記支持板取付部に取付けることを特徴とす
る高周波フィルタ装置の組立方法。A high frequency filter consisting of a cavity and an internal conductor element provided in the cavity is attached to the substrate, and the internal conductor element is connected to an inductor and coupling elements arranged in parallel on each side of the inductor. In the method for assembling a high frequency filter device, the substrate is provided with a cavity top part and an inductor top part in advance, the cavity is provided with a support plate mounting part in advance, and the other part is provided with a support plate mounting part in advance. , the coupling element is attached in advance by printed wiring means to a support plate formed to be able to be attached to the support plate attachment part, and during assembly, A method for assembling a high frequency filter device, comprising the steps of fixing a cavity and an inductor to the attachment parts, respectively, and then attaching a support plate to which the coupling element is attached to the support plate attachment part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11050283A JPS603204A (en) | 1983-06-20 | 1983-06-20 | Assembling method of high frequency filter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11050283A JPS603204A (en) | 1983-06-20 | 1983-06-20 | Assembling method of high frequency filter device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS603204A true JPS603204A (en) | 1985-01-09 |
| JPH0374523B2 JPH0374523B2 (en) | 1991-11-27 |
Family
ID=14537387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11050283A Granted JPS603204A (en) | 1983-06-20 | 1983-06-20 | Assembling method of high frequency filter device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS603204A (en) |
-
1983
- 1983-06-20 JP JP11050283A patent/JPS603204A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0374523B2 (en) | 1991-11-27 |
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