JPS6033392A - Preparation of alumite substrate for magnetic recording medium - Google Patents
Preparation of alumite substrate for magnetic recording mediumInfo
- Publication number
- JPS6033392A JPS6033392A JP14143183A JP14143183A JPS6033392A JP S6033392 A JPS6033392 A JP S6033392A JP 14143183 A JP14143183 A JP 14143183A JP 14143183 A JP14143183 A JP 14143183A JP S6033392 A JPS6033392 A JP S6033392A
- Authority
- JP
- Japan
- Prior art keywords
- alumite
- magnetic recording
- substrate
- cracks
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electrochemical Coating By Surface Reaction (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は磁気ディスク等、磁気記録媒体用アルマイト基
板の製造方法に関し、詳しくは実質的に黒点欠陥がなく
、機械強度にすぐれ、さらに耐熱性にもすぐれた磁気記
録媒体用アルマイト基板の製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an alumite substrate for magnetic recording media such as magnetic disks, and more specifically, a magnetic recording medium that is substantially free of black spot defects, has excellent mechanical strength, and has excellent heat resistance. The present invention relates to a method of manufacturing an alumite substrate for use.
磁気ディスク等の磁気配録媒体基板には表面にアルマイ
ト層を形成したアルミララム咬たけアルミニウム合金材
(以下アぞマイト井桁と婬・ぶ)が用いられている。For magnetic recording media substrates such as magnetic disks, an aluminum alloy material (hereinafter referred to as AZOMITE IGETA) with an alumite layer formed on its surface is used.
このようにアルマイト基板が用いられる胛由入してはア
ルマイトがアルマイト合金より硬質で耐字耗性にすぐれ
、また研摩性も良好なため高Ml¥の平滑面が得られ易
く、容易にその表面に薄膜の磁性Mケ形成させることが
できるからである。ところでこのアルマイト基板にも以
下に示すような欠点があり、これが磁性記録媒体の高配
録密度化の妨げとなっている。The reason why alumite substrates are used in this way is that alumite is harder than alumite alloys, has excellent wear resistance, and has good abrasiveness, so it is easy to obtain a smooth surface with a high Ml. This is because it is possible to form a thin magnetic M layer. By the way, this alumite substrate also has the following drawbacks, and these are obstacles to increasing the recording density of magnetic recording media.
その1つは、黒点欠陥と呼ばれるものでアルミニウムま
たはアルミニウム合金基材中に存在する鉄、珪素等の不
純物が金属間化合物として晶出し、これが基材表面に点
在していてアルマイト基板に際してこの部分が極く微少
なアルマイト皮膜欠落部となるものであって、この欠落
部は当初はサブミクロンのオーダーの招く微少なもので
ある75ス、アルマイト皮膜の成長と共に拡大し、5μ
m以上の皮膜厚のアルマイト層にあっては5〜10μm
のビット状孕小欠陥を示すので、この数が多い杓磁気記
録媒体における。信号エラーが多くなり好ましくない。One of them is called a black spot defect, in which impurities such as iron and silicon present in the aluminum or aluminum alloy base material crystallize as intermetallic compounds, which are dotted on the surface of the base material, and when the alumite substrate is anodized, these defects occur. This is an extremely small missing part of the alumite film, and this missing part is initially a very small part on the order of submicrons, but expands as the alumite film grows, and becomes 5μ.
For an alumite layer with a film thickness of m or more, the thickness is 5 to 10 μm.
This number of small bit-like defects is large in magnetic recording media. This is undesirable as it increases signal errors.
また、アルマイト基板を高密度磁気配録fg体とする場
合にはアルマイト基板上にα−1!’e205iたはF
θ・304の薄膜ヲスパッタリングその他の方法により
被着させ、その後300〜400°Cに加熱処理してγ
−Fθ203化するととが行なわれるが、このような高
温加熱を行なった場合、アルマイト謹に亀裂を生じ、こ
のため製品不良を起し易いことである。In addition, when the alumite substrate is used as a high-density magnetic recording FG body, α-1! 'e205i or F
A thin film of θ 304 is deposited by sputtering or other methods, and then heated to 300-400°C to obtain γ
-Fθ203 is carried out, but when such high temperature heating is carried out, cracks occur in the alumite, which tends to cause product defects.
これはアルミニウム基材とアルマイ)17Mの熱膨張係
数の差に基づくもので、このためアルマイ)INの膜j
lを1〜3μm程度と極端に薄くしかつ処理温度を31
0°C程度以下にして亀裂発生を回避しなければならな
い。しかしこのように薄いアルマイト層では実質的にア
ルマイトの硬質性を生かすことができず、磁気記録媒体
の耐ヘツドクラツシユ性低下の原因となり、また温度が
不十分でr−Fe203形成が遅く好ましいものではな
かった。This is based on the difference in thermal expansion coefficient between the aluminum base material and the aluminium)17M, and therefore the aluminium)IN film j
1 to 3 μm, and the processing temperature was 31 μm.
The temperature must be kept below about 0°C to avoid cracking. However, such a thin alumite layer cannot substantially take advantage of the hardness of alumite, which causes a decrease in the head crushing resistance of the magnetic recording medium, and the formation of r-Fe203 is slow due to insufficient temperature, which is not desirable. Ta.
従ってアルマイト層が斤く、しかも高温加熱により亀裂
の発生しないアルマイト基板の開発が望せれていた。Therefore, it has been desired to develop an alumite substrate that has a flat alumite layer and does not crack when heated at high temperatures.
発明者らは上記欠点を解決すべく舒意研究1.た結果、
アルマイト処理溶液としてクロム酸溶液を使用し、定電
圧法によってアルマイト処理を行なった場合にはアルマ
イト皮膜の小点欠陥の防1トとアルマイト層の厚肉化と
耐熱性の向トにか々りの効果があることが判った。しか
しこの方法にも限界があり、アルマイト皮膜がlOzz
m程度までは耐熱性がよいが、それ以上のrP暉では加
熱時にアルマイト層にクラックを生じるので、実用上布
オ]1な10μm以上のアルマイIIMケもつ某炬の訓
令にけ問題があった。In order to solve the above-mentioned drawbacks, the inventors conducted research on 1. As a result,
When a chromic acid solution is used as the alumite treatment solution and the alumite treatment is performed by the constant voltage method, it is possible to prevent small defects in the alumite film, increase the thickness of the alumite layer, and improve heat resistance. It was found that there is an effect. However, this method also has its limitations, and the alumite film is
It has good heat resistance up to about 10 μm, but if the rP is higher than that, cracks will occur in the alumite layer when heated, so there was a problem in practical use with a certain kettle that had an alumite IIM of 10 μm or more. .
本発明は118m以下の膜厚では勿論のこぶ、1(1μ
m以上のアルマイト皮膜をもつ場合にも連用出来る耐熱
住処すぐれたアルマイト基板のjl’l造方法であって
、アルマイト処理に際してクロム酸溶液中で定電圧法に
よりアルマイト皮膜を形成したのち、Snfg、 f含
む電解溶液中で電圧を印加して2次電解処理?JfQす
ことによって黒点発生の防止と加熱暗にクラック発生の
ないアルマイト:$板を♀11造することを目的として
いる。In the present invention, of course, if the film thickness is 118 m or less,
An excellent heat-resistant alumite manufacturing method that can be used even when the alumite film has an alumite film of m or more. Secondary electrolytic treatment by applying voltage in an electrolytic solution containing The purpose is to prevent the occurrence of sunspots by applying JfQ and to produce anodized aluminum plate without cracking during heating.
即チ、本発明はアルミニウムまたはアルミニウム合金基
材に重量で1.5〜15%濃度のクロム酸溶液を使用し
て定電圧法にて6ovより高い重圧、好ましくは70〜
100Vの電圧でアルマイト処理を施したのち、常法に
より水洗竺の洗浄を行なってからSn塩を含有する電解
溶液中で2次電解机理を施すことによってアルマイ)1
1のη々♀用孔中にSnを析出させると共に、アルマイ
ト微細孔底部のバリヤー1(支)に無数の微細クラック
’を発生させるぜ)のであって、この微細クラックが磁
性膜生成のたぬの加熱に際[7てアルマイト層に磁気記
録媒体と【7て不都合な程度の大きさのクラックの発生
を防止させるものである。That is, the present invention uses a chromic acid solution having a concentration of 1.5 to 15% by weight on an aluminum or aluminum alloy substrate and applies a pressure higher than 6 OV, preferably 70 to
After performing alumite treatment at a voltage of 100V, the cloth is washed with water using a conventional method, and then subjected to secondary electrolysis in an electrolytic solution containing Sn salt to form alumite)1.
This causes Sn to precipitate in the holes for η and ♀ of 1, and also generates countless fine cracks in the barrier 1 (support) at the bottom of the alumite micropores, and these fine cracks are a barrier to magnetic film formation. This is to prevent the occurrence of cracks of an inconvenient size in the alumite layer during heating of the magnetic recording medium.
使用するアルマイト処理会件表しては従来のグツサード
法と同様で、クロム酸溶液の’lF’=% p’; 1
、5〜15車量係、液温35〜50 ”C中の定電圧
であるが、電圧はグツサード法の40 Vより高< (
io V 舎超え、好ましくけ70〜100vの間でア
ルマイト処理を行なう。その際、クロム酸宿M液中に液
の機雷、性を高めるため少量の硫酸を加えてもよい一
アルマイト処理後丼材″fr電解槽から取り出し、常法
により水洗し、必要に応じて純水で洗浄]−でもよい。The alumite treatment conditions used are the same as those of the conventional Gutsard method, and the 'lF' of the chromic acid solution = % p'; 1
, 5 to 15 vehicles, constant voltage at a liquid temperature of 35 to 50"C, but the voltage is higher than the 40 V of the Gutsard method.
Alumite treatment is carried out at a voltage higher than ioV, preferably between 70 and 100V. At that time, a small amount of sulfuric acid may be added to the chromic acid-acid M solution to increase the mineral properties of the solution. After the alumite treatment, the bowl material "fr" is taken out of the electrolytic cell, washed with water in the usual manner, and purified as necessary. washing with water]- may also be used.
その後、Sn塩を含んだ電解溶液中で2次電解する。2
次電解の電解溶液はSnをアルマイト層微細孔中に析出
する坩類ならばよく、例えば硝酸第一錫を用い、濃度3
〜15り/1に鉱層、有梼酔等を加えpH0,5〜2程
度に調整し、湛摩を、加〜(9)Cとすれば奸便に使用
することがでたる。また酒石C段をキレート剤と[−・
て加えて弱酸〜中性の5nP4含有溶液として用いると
七も出来るっ既にクロム酸アルマイト層を形成したアル
マイト基板を上記溶液中に浸し、交流または交流に漁じ
る波形を用いてΔ)秒〜1()分間程度、好咬しくは3
0秒〜8す間電解溶液中に通電するう
以トの処理により得られるアルマイト基板は微少黒点が
#1とんどなく、10μm以上の皮tj@厚さでも+i
]・I熱性がすぐれており、さらにその皮11q上に被
着させたα−Fe2.03薄膜を1−Fa203薄膜と
するための加熱処理を施してもクラック発生が起らない
ものである。Thereafter, secondary electrolysis is performed in an electrolytic solution containing Sn salt. 2
The electrolytic solution for the next electrolysis may be a crucible that precipitates Sn into the fine pores of the alumite layer, for example, using stannous nitrate at a concentration of 3.
If the pH is adjusted to about 0.5 to 2 by adding ore layers, hydration, etc. to ~15 R/1, and the pH is adjusted to ~(9)C, it can be used for phlegm. In addition, tartarite C stage is used as a chelating agent [-・
In addition, if you use it as a weak acid to neutral 5nP4-containing solution, you can also do seven things.Immerse an alumite substrate on which a chromic acid alumite layer has already been formed in the above solution, and use a waveform that changes to alternating current or alternating current for Δ) seconds to About 1 () minutes, 3 minutes if you like it
The alumite substrate obtained by the process of passing electricity through an electrolytic solution for 0 seconds to 8 seconds has almost no #1 minute black spots, and even with a skin thickness of 10 μm or more, +i
] - I It has excellent heat resistance, and even when the α-Fe2.03 thin film deposited on the skin 11q is subjected to heat treatment to form a 1-Fa203 thin film, no cracks occur.
次に本発明を完成するに当って発明者らの行々つた実験
について述べる。Next, the experiments conducted by the inventors in completing the present invention will be described.
m1表はアルミニウム合金材(AI−3iN帯(f、J
合金)を、液温40 ’Cに保存した5重量係クロム酸
溶液中で直流定電圧法によりアルマイト処理した場合の
電圧とアルマイ)X板にかける黒点発生の様子、350
°C12時間加熱でのクラック発生状況および耐ヘッド
クラツシユ性に間する皮IIa硼ffを各々示す。その
際のアルマイト皮膜の厚さけ5/1mおよび15μmで
ある。m1 table shows aluminum alloy material (AI-3iN band (f, J
Voltage and appearance of black spots when alumite (aluminum alloy) is alumite treated by direct current constant voltage method in a 5 weight ratio chromic acid solution stored at a liquid temperature of 40'C, 350
The appearance of cracks after heating at °C for 12 hours and the thickness of the skin IIa with respect to head crushing resistance are shown. The thickness of the alumite film at that time was 5/1 m and 15 μm.
また、第1表において、黒点の評価は顕微鏡視野(0,
36ryrm” )で行い、(つけ2.5ttm以下、
△け3.5μm以下、Yは5μm以下の黒点が1個以下
であることを示し、クラックの評価は加熱処理後のアル
マイト基板を顕微鏡観察したもので、0けクラックが全
くないもの、Δは部分的にクラックが生じたもの、イは
全面的にクラックが生じたものを示し、さらに、硬度の
評価は微少?度肝を使用した結果で、○け250 Hv
以上、△け200〜250 Hv、 yけ200 Hv
以下を示すも゛のである。なお、黒点、クラック、硬度
についての測定試料は皮膜表面を2/1m研削したもの
について行なった。In addition, in Table 1, the evaluation of sunspots is in the microscopic field (0,
36ryrm"),
△ indicates that there is no more than 3.5 μm, Y indicates that there is no more than 1 black spot of 5 μm or less, crack evaluation is based on microscopic observation of the alumite substrate after heat treatment, 0 indicates that there are no cracks, Δ indicates that there is no crack at all. Items with partial cracks are shown, and A indicates items with full cracks.Furthermore, the hardness is evaluated to be very small. As a result of using courage, ○ke 250 Hv
Above, △ke 200-250 Hv, yke 200 Hv
It also shows the following. Note that the measurement samples for black spots, cracks, and hardness were made on samples whose coating surfaces were ground by 2/1 m.
ptr、■ 弄 (1)アルマイト皮膜厚5μm0 t2i 1 15μm。ptr, ■ Fuck (1) Alumite film thickness 5μm0 t2i 1 15 μm.
(3)5μmで2次電解処理によりSn析出。(3) Sn is deposited at 5 μm by secondary electrolytic treatment.
t41 #15μm11 、8n析出う(51cu析出
。t41 #15μm11, 8n deposited (51cu deposited.
15μm
(注)2次電解条件(31,14i 5nS0.5F/
/−1pH1,2の電解溶液、交流HI V、3分間通
電。15μm (Note) Secondary electrolysis conditions (31,14i 5nS0.5F/
/-1 pH 1,2 electrolyte solution, AC HIV, 3 minutes of electricity.
黒点についてはアルマイト雷、圧60 Vより高い、好
ま(7くは70〜100Vにて、膜l早5nm、1F+
μmの皮MN k形成させると、2次電解の有無によら
ず黒点のないものが得られる。For sunspots, use alumite lightning, pressure higher than 60 V, preferably (at 70 to 100 V, film thickness 5 nm, 1F+
When a μm skin MN k is formed, a product without black spots can be obtained regardless of the presence or absence of secondary electrolysis.
なお、比較のため従来法の硫酸皮膜も示したがいずれも
黒点が発生し1.高密度磁気配録媒体用ぷ:板としては
不適当である、
クラックについてはアルマイト皮膜のみでけ嘩厚5μm
程度ではよいが、膜厚1011m以−ヒではクラックを
生じる。しかしSn塩を含む電解溶液中での2次電解処
理を施こせは膜厚10μm以上でもクラックが発生しな
い。しかしCu塩を含む電解溶液での2次電解ではクラ
ックが発生する。For comparison, sulfuric acid coatings made using the conventional method are also shown, but black spots occur in both cases. For high-density magnetic recording media: Unsuitable as a board. Only alumite film with a crack thickness of 5 μm is present.
Although it is fine to a certain extent, cracks occur when the film thickness exceeds 1011 m. However, if the secondary electrolytic treatment is performed in an electrolytic solution containing Sn salt, no cracks will occur even if the film thickness is 10 μm or more. However, cracks occur during secondary electrolysis using an electrolytic solution containing Cu salt.
硬度については上記した第1表のごとくほとんど差がな
いが、皮膜が厚くなるとアルマイト処理時間が長くなる
ので、処理液による皮膜表面の溶解が進み、硬度が下が
る傾向がある。There is almost no difference in hardness as shown in Table 1 above, but as the film becomes thicker, the alumite treatment time becomes longer, so the surface of the film is more dissolved by the treatment liquid, and the hardness tends to decrease.
また、第2表はMI表と同様にアルミニウム合金基材を
用い、かつ同様の温度および濃度のクロム酸溶液愛用い
直流定電圧法にて85vでアルマイト処理を施したのち
に、さらに5nSO,を含む液温5−°Cの雷、解溶液
中で電圧1(l Vの交流を甲いて2次電mを行なった
。なお、比較のためにCu5O,を含む場合についても
示す。この方法で作成したSnJたはCu′?:アルマ
イト微細孔中に析出させた基板を300〜400″Cの
温度範囲で加熱温度を変え、各2時間この@度を保持し
た場合のクラック発生状況と加熱前の黒点発生の様子、
耐ヘッドクラツシユ性に関する皮膜硬度を各々示す。Table 2 also uses an aluminum alloy base material as in the MI table, and after anodizing at 85V using a chromic acid solution at the same temperature and concentration using the DC constant voltage method, an additional 5nSO. Secondary electromagnetic waves were carried out by applying an alternating current voltage of 1 V in a solution containing lightning at a temperature of 5-°C.For comparison, a case containing Cu5O is also shown.This method Created SnJ or Cu'?: Crack occurrence situation and before heating when the substrate deposited in the alumite micropores was heated at a temperature range of 300 to 400"C and held at this temperature for 2 hours each. The appearance of sunspots,
The film hardness related to head crush resistance is shown below.
なお、第2表に卦ける黒点および皮膜硬度の評価基準は
@1表の場合と同様である。The evaluation criteria for black spots and film hardness in Table 2 are the same as in Table 1.
第1表および第2表の結果から以下のことが判った。From the results in Tables 1 and 2, the following was found.
即ち、本発明のようにクロム酸溶液を用い直流定電圧法
により6()■より高い電圧でアルマイト−処理を施し
たのち、さらにSn塩を含む電解溶液中で2次電解を行
なった基板に卦いては、黒点や加熱によるクラック発生
は全くみらり、ず、あるいけ殆んど卯7られす、また基
オ反の面子へ・ソドクラッシュ性を高めるために皮膜厚
を太さ〈17た場合でも、黒へやクラックの発生は見ら
れなかった。しかし比軸例に示すごと(Cu塩ケ含む1
バhT!溶液中で2吹雪。That is, as in the present invention, a substrate is anodized using a chromic acid solution at a voltage higher than 6()■ using a DC constant voltage method, and then subjected to secondary electrolysis in an electrolytic solution containing Sn salt. In particular, there are no sunspots or cracks caused by heating, and almost no cracks are observed.Also, to the face of the original team, the film thickness has been increased to improve the sodo-crash resistance. No blackening or cracking was observed even when However, as shown in the example of the ratio axis (1 including Cu salt)
BahT! 2 snowstorms in solution.
暇を行なった場合、10μm以上のアルマイト皮11W
I’Wではクラック発生がみられた。If you have free time, alumite skin 11W with a diameter of 10μm or more
Cracks were observed in I'W.
なお、2次rQi解の除に析出するSnの(ルけ2〕秒
では加my / m2.1分では70my / m2.
5分間では250my / m2桿度であった。−!i
た、2次′屯解め陛にSn増を含む酸性の電解溶液では
アルマイト孔底に数+A程度の極めて細かいクラックが
年数に生じ、加熱時に析出S、nが浴融しクラックから
・qリヤ一層内に浸透し、そのため・イリャ一層を改質
するので、クラック発生が起らず、一方、Cuは溶融点
が高いためこのような現象は起点ないものと考えられる
。In addition, the amount of Sn precipitated by dividing the second-order rQi solution is 70 my/m2 in 2 seconds and 70 my/m2 in 1 minute.
In 5 minutes, it was 250 my/m2 rod. -! i
In addition, in the case of an acidic electrolytic solution containing increased Sn during secondary melting, extremely fine cracks of approximately several + A are formed at the bottom of the alumite pores, and during heating, the precipitated S and N are melted in the bath, and from the cracks. Since Cu penetrates into the layer and thereby modifies the layer, cracks do not occur.On the other hand, since Cu has a high melting point, it is thought that such a phenomenon does not occur.
以上述べたように本発明方法による高密度磁気記録媒体
用アルマイト基板の製造法では、従来から問題にされて
来た黒点の発生、高温加熱時のクラック発生および耐ヘ
ッドクラツシユ性に関する皮膜硬度について同時に解決
することができT業的にすぐれた発明と云うことができ
る。As described above, in the method of manufacturing an alumite substrate for high-density magnetic recording media according to the method of the present invention, problems such as generation of black spots, generation of cracks during high-temperature heating, and film hardness related to head crushing resistance, which have been problems in the past, can be solved. It can be said that this invention is excellent in terms of T industry because it can solve the problems at the same time.
次に本発明の実施例を以下に示す。Next, examples of the present invention will be shown below.
実施例1
高密度磁気記録用アルミニウム合金基材(A1.−3重
量%Mg合金、内径100龍、外径210朋、厘さ2m
m)′f!:所定の表面研摩を施した後、非侵食性洗浄
剤にて洗浄し、アルマイト処理をした。アルマイト処理
は40°Cに加熱した5重量%クロム酸溶液中に、前記
アルミニウム材を浸漬し、アノードとして直流にて電解
処理した。電圧は85 V−宇とし、約150分の電解
で膜厚加μmの乳白色の平滑なアルマイト皮膜が得られ
た。Example 1 Aluminum alloy base material for high-density magnetic recording (A1.-3% by weight Mg alloy, inner diameter 100 mm, outer diameter 210 mm, width 2 m
m)′f! : After the specified surface was polished, it was cleaned with a non-erosive cleaning agent and anodized. For the alumite treatment, the aluminum material was immersed in a 5% by weight chromic acid solution heated to 40° C., and electrolytically treated with direct current as an anode. The voltage was 85 V-U, and a milky white smooth alumite film with a thickness of 1 μm was obtained after about 150 minutes of electrolysis.
次にアルマイト処理した合金基月ヲ電解槽から引き上げ
、水洗、純水洗を行なったのち、炭素を対極とし1()
Vの交流を印加して2次電解を行なった。その際の電解
溶液の組成は以下のとおりである。Next, the alumite-treated alloy base was taken out of the electrolytic bath, washed with water and purified water, and then carbon was used as the counter electrode.
Secondary electrolysis was performed by applying an alternating current of V. The composition of the electrolytic solution at that time is as follows.
硫酸第(fil+ S rlrJOa 5f //−硫
酸 1(2S0. 5q/l。Sulfuric acid No. (fil+ S rlrJOa 5f //- Sulfuric acid 1 (2S0.5q/l.
硫酸アンモニウム(”4 ’hSOa 7 f / /
。Ammonium sulfate ("4'hSOa 7 f//
.
水 7J1■に
pH1,2
′αtiT溶1Vl温庶 25°C
電解時間 m秒、40秒、1分、3分、5分2次電解後
水洗乾燥したのち、2ttm研削してアルマイト皮膜表
面ケ千mにし、350°C12時間力n熱して顕微@観
察したところい15れの場合もクラック発生が昭められ
なかった。Water pH 1,2'αtiT solution 1Vl Temperature 25°C Electrolysis time m seconds, 40 seconds, 1 minute, 3 minutes, 5 minutes After secondary electrolysis, wash and dry, grind 2ttm to remove the surface of the alumite film. When the specimens were heated at 350° C. for 12 hours and observed under a microscope, the occurrence of cracks did not subside in all cases.
さらに、加熱の前後で表面粗さケ触針式却さn1(タリ
サーフ)で測定し比較したが、加M //IL Flj
による表面粗さの劣化は4111定誤差内で検8jされ
な力1つだ。従って本発明しこよりイ乍Mしたアルマイ
ト孔底はγ−Fe2O3の磁性薄膜を形成する力11F
’へ70ロセスにおいて、十分な耐熱性を有することが
判った。Furthermore, the surface roughness before and after heating was measured and compared using a stylus probe n1 (Talysurf).
The deterioration of the surface roughness due to the 4111 constant error is 1 force. Therefore, according to the present invention, the alumite hole bottom has a force of 11 F to form a magnetic thin film of γ-Fe2O3.
It was found that it had sufficient heat resistance in 70 processes.
なお、比較のため上記組成のうちsn So4のみをc
uso、 (7yet )に代え電解溶液を用いその他
を同じ条件で2次電解したところ、いずれもクラックの
発生がみられ、高密度磁気記録媒体用基板と17で不適
当であった。For comparison, only sn So4 of the above composition was
When secondary electrolysis was performed using an electrolytic solution in place of uso, (7yet) and the others under the same conditions, cracks were observed in all cases, and substrate 17 for high-density magnetic recording media was unsuitable.
実施例2
実ru例1に示した方法で形成したアルマイト基板の表
面をさらにポリッシュしてアルマイ)INの厚さを3μ
、6.5μ、12μとしたものを各々作成し、その上に
0.17ttmの厚さの1− Fe2O3磁性f!If
mを形成した。この磁気記録媒体の表面に先端径がmμ
mのダイヤモンドビン全荷i1〜;う()7で押しっけ
、スクラッチしてスクラッチ痕の深さを表面粗さ計で測
定した。比り佼のために表面硬化ガラス其板および約δ
μm厚のN1−Pメッキ啜で表面硬化したアルミニウム
合金基板の上にγ−Fθ2osW+x性薄膜を形成した
ものを用いた。Example 2 The surface of the alumite substrate formed by the method shown in Example 1 was further polished to a thickness of 3 μm.
, 6.5μ, and 12μ, respectively, and a 0.17ttm thick 1-Fe2O3 magnetic f! If
m was formed. The tip diameter is mμ on the surface of this magnetic recording medium.
The entire load of the diamond bottle i1~; U() was pushed and scratched with 7, and the depth of the scratch mark was measured using a surface roughness meter. Surface hardened glass plate and approx. δ for comparison
A γ-Fθ2osW+x thin film was formed on an aluminum alloy substrate whose surface was hardened with a μm thick N1-P plating.
スクラッチ保さの荷重依存性を第1図に示す。Figure 1 shows the load dependence of scratch retention.
第1図に示されるように、アルマイト基板を用いた際に
はアルマイトl響の炉力nと共にスクラッチ深さが減少
して卦り、12μm厚さのアルマイト基板を用いるとス
クラッチ深さld表面硬化ガラスやN1−Pメッキ基板
を用いた場合と#をソ同等の水準まで改良されている。As shown in Figure 1, when an alumite substrate is used, the scratch depth decreases with the furnace force n of the alumite, and when a 12 μm thick alumite substrate is used, the scratch depth ld decreases when the surface hardens. The # is improved to the same level as when glass or N1-P plated substrates are used.
これはアルマイ)Hさが薄い場合にはアルマイト層が実
質的に表面硬化の役割り全せず、比較的低荷重でも下地
のアルミニウム合金にFIJ性変形が生じるのに対し、
アルマイト厚さが厚い場合には表面硬化の効果が麺著に
現われて央るためである。従って、本発明の方法で作成
したアルマイト基板はアルマイト層の硬度Hvを減少さ
せずにアルマイト層を厚く出来た結牛、従来の1〜3μ
mまでのアルマイト基板に比べ機樟的強度が向上してお
り、従来基板の欠点であった耐ヘッドクラツシユ性の問
題を大巾に改善す不ととに成功していることを示す。This is because when the alumite (aluminum) H is thin, the alumite layer does not substantially play the role of surface hardening, and FIJ deformation occurs in the underlying aluminum alloy even under relatively low loads.
This is because if the alumite is thick, the surface hardening effect will appear on the noodles. Therefore, the alumite substrate produced by the method of the present invention has a thicker alumite layer without reducing the hardness Hv of the alumite layer, compared to the conventional 1 to 3 μm hardness.
The mechanical strength is improved compared to the alumite substrates up to m, indicating that the problem of head crush resistance, which was a drawback of conventional substrates, has been successfully improved to a large extent.
第1図は本発明の技術的内容を示すものであって、アル
マイト厚さを3μm、 6.5μm、 12μm七しそ
の表面に帆17μmの厚さのγ−Fe203磁性薄膜金
被着させたもの、並びに比較のための表面硬化ガラスと
N1−Pメッキについて荷重とスクラッチ深さの関係を
示すグラフがある。
特許出vn入 日本電信′m話公社
同 日本軽金属株式会社Figure 1 shows the technical content of the present invention, in which a 17 μm thick γ-Fe203 magnetic thin film of gold is coated on the surface of anodized aluminum with a thickness of 3 μm, 6.5 μm, and 12 μm. , and a graph showing the relationship between load and scratch depth for surface hardened glass and N1-P plating for comparison. Patent issued by Nippon Telegraph Corporation Nippon Light Metal Co., Ltd.
Claims (1)
5重′j#%クロム酸溶液中に浸し定電圧法により60
Vより高い電圧でアルミニウムまたはアルミニウム合金
基材表面にアルマイト処理を施こしたのち、Sn塩を含
有する電解溶液中で2次電解し、アルマイト層中にSn
を析出させることを特徴とする磁気記録媒体用アルマイ
ト基板の製造方法。Aluminum or aluminum alloy base material from 1.5 to 1
60% by constant voltage method by dipping in 5% chromic acid solution.
After performing alumite treatment on the surface of aluminum or aluminum alloy base material at a voltage higher than V, secondary electrolysis is performed in an electrolytic solution containing Sn salt, and Sn is added to the alumite layer.
1. A method for producing an alumite substrate for a magnetic recording medium, the method comprising depositing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14143183A JPS6033392A (en) | 1983-08-02 | 1983-08-02 | Preparation of alumite substrate for magnetic recording medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14143183A JPS6033392A (en) | 1983-08-02 | 1983-08-02 | Preparation of alumite substrate for magnetic recording medium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6033392A true JPS6033392A (en) | 1985-02-20 |
| JPS6149400B2 JPS6149400B2 (en) | 1986-10-29 |
Family
ID=15291809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14143183A Granted JPS6033392A (en) | 1983-08-02 | 1983-08-02 | Preparation of alumite substrate for magnetic recording medium |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033392A (en) |
-
1983
- 1983-08-02 JP JP14143183A patent/JPS6033392A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6149400B2 (en) | 1986-10-29 |
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