JPS6035519A - 膜厚モニタ−装置 - Google Patents

膜厚モニタ−装置

Info

Publication number
JPS6035519A
JPS6035519A JP14382283A JP14382283A JPS6035519A JP S6035519 A JPS6035519 A JP S6035519A JP 14382283 A JP14382283 A JP 14382283A JP 14382283 A JP14382283 A JP 14382283A JP S6035519 A JPS6035519 A JP S6035519A
Authority
JP
Japan
Prior art keywords
film
laser
laser beam
film thickness
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14382283A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0449643B2 (fr
Inventor
Tatsufumi Nishina
仁科　達史
Shinichi Suzuki
慎一 鈴木
Hiromitsu Enami
弘充 榎並
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP14382283A priority Critical patent/JPS6035519A/ja
Publication of JPS6035519A publication Critical patent/JPS6035519A/ja
Publication of JPH0449643B2 publication Critical patent/JPH0449643B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
JP14382283A 1983-08-08 1983-08-08 膜厚モニタ−装置 Granted JPS6035519A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14382283A JPS6035519A (ja) 1983-08-08 1983-08-08 膜厚モニタ−装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14382283A JPS6035519A (ja) 1983-08-08 1983-08-08 膜厚モニタ−装置

Publications (2)

Publication Number Publication Date
JPS6035519A true JPS6035519A (ja) 1985-02-23
JPH0449643B2 JPH0449643B2 (fr) 1992-08-12

Family

ID=15347760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14382283A Granted JPS6035519A (ja) 1983-08-08 1983-08-08 膜厚モニタ−装置

Country Status (1)

Country Link
JP (1) JPS6035519A (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01145508A (ja) * 1987-12-01 1989-06-07 Canon Inc 測定装置
JPH01145507A (ja) * 1987-12-01 1989-06-07 Canon Inc 測定方法
FR2678426A1 (fr) * 1991-06-26 1992-12-31 Digital Equipment Corp Traitement de plaquette semiconductrice avec controle de dimension critique de section de plaquette utilisant une detection optique de point limite.
US5232537A (en) * 1990-10-12 1993-08-03 Seiko Epson Corporation Dry etching apparatus
US5308447A (en) * 1992-06-09 1994-05-03 Luxtron Corporation Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across the layer
CN100373557C (zh) * 2003-06-05 2008-03-05 东京毅力科创株式会社 蚀刻量检测方法、蚀刻方法和蚀刻装置
WO2018169728A1 (fr) * 2017-03-13 2018-09-20 Applied Materials, Inc. Système de traitement de gravure ayant une détection de point d'extrémité réfléchissante

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01145508A (ja) * 1987-12-01 1989-06-07 Canon Inc 測定装置
JPH01145507A (ja) * 1987-12-01 1989-06-07 Canon Inc 測定方法
US5232537A (en) * 1990-10-12 1993-08-03 Seiko Epson Corporation Dry etching apparatus
US5346582A (en) * 1990-10-12 1994-09-13 Seiko Epson Corporation Dry etching apparatus
FR2678426A1 (fr) * 1991-06-26 1992-12-31 Digital Equipment Corp Traitement de plaquette semiconductrice avec controle de dimension critique de section de plaquette utilisant une detection optique de point limite.
US5308447A (en) * 1992-06-09 1994-05-03 Luxtron Corporation Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across the layer
CN100373557C (zh) * 2003-06-05 2008-03-05 东京毅力科创株式会社 蚀刻量检测方法、蚀刻方法和蚀刻装置
WO2018169728A1 (fr) * 2017-03-13 2018-09-20 Applied Materials, Inc. Système de traitement de gravure ayant une détection de point d'extrémité réfléchissante

Also Published As

Publication number Publication date
JPH0449643B2 (fr) 1992-08-12

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