JPH0449643B2 - - Google Patents

Info

Publication number
JPH0449643B2
JPH0449643B2 JP14382283A JP14382283A JPH0449643B2 JP H0449643 B2 JPH0449643 B2 JP H0449643B2 JP 14382283 A JP14382283 A JP 14382283A JP 14382283 A JP14382283 A JP 14382283A JP H0449643 B2 JPH0449643 B2 JP H0449643B2
Authority
JP
Japan
Prior art keywords
film
laser
laser beam
etching
film thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14382283A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6035519A (ja
Inventor
Tatsufumi Nishina
Shinichi Suzuki
Hiromitsu Enami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomputer System Ltd, Hitachi Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to JP14382283A priority Critical patent/JPS6035519A/ja
Publication of JPS6035519A publication Critical patent/JPS6035519A/ja
Publication of JPH0449643B2 publication Critical patent/JPH0449643B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
JP14382283A 1983-08-08 1983-08-08 膜厚モニタ−装置 Granted JPS6035519A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14382283A JPS6035519A (ja) 1983-08-08 1983-08-08 膜厚モニタ−装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14382283A JPS6035519A (ja) 1983-08-08 1983-08-08 膜厚モニタ−装置

Publications (2)

Publication Number Publication Date
JPS6035519A JPS6035519A (ja) 1985-02-23
JPH0449643B2 true JPH0449643B2 (fr) 1992-08-12

Family

ID=15347760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14382283A Granted JPS6035519A (ja) 1983-08-08 1983-08-08 膜厚モニタ−装置

Country Status (1)

Country Link
JP (1) JPS6035519A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01145508A (ja) * 1987-12-01 1989-06-07 Canon Inc 測定装置
JPH01145507A (ja) * 1987-12-01 1989-06-07 Canon Inc 測定方法
JPH04355916A (ja) * 1990-10-12 1992-12-09 Seiko Epson Corp ドライエッチング装置
GB2257507B (en) * 1991-06-26 1995-03-01 Digital Equipment Corp Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection
US5308447A (en) * 1992-06-09 1994-05-03 Luxtron Corporation Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across the layer
JP4500510B2 (ja) * 2003-06-05 2010-07-14 東京エレクトロン株式会社 エッチング量検出方法，エッチング方法，およびエッチング装置
US11022877B2 (en) * 2017-03-13 2021-06-01 Applied Materials, Inc. Etch processing system having reflective endpoint detection

Also Published As

Publication number Publication date
JPS6035519A (ja) 1985-02-23

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