JPS6035529A - Needle - Google Patents

Abstract

PURPOSE:To extend the life of the title needle by a method wherein the pointed tip of the needle to be used for pickup of a semiconductor element in the manufacture of semiconductor devices is formed using the abrasion resisting material such as ruby, sapphire, diamond and the like, thereby enabling to prevent the pointed tip from abrasion and breaking. CONSTITUTION:The needle 1 is composed of a fine core member 7 consisting of the material having excellent abrasion resisting property such as ruby, sapphire and diamond, and the tube-like main body 8 consisting of SKH steel which is covering said core member 7. Said core member 7 and the main body 8 are adhered using solder material such as silver solder, the tip of which is formed into a conical part 9 by grinding, and it has a pencil-like structure. The tip of the pointed part 10 has a circular arc-shaped end. As the greater part of the core member is protected by the main body 8 consisting of SKH steel having excellent toughness, it is hardly broken.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a needle,! [Background Art] Needles are useful for fixing (bonding) semiconductor elements (referred to as chips or pellets) in the manufacture of semiconductor devices. In the past, for example, Electronic Materials Magazine, November 1971 issue, pp. 116-119, "Automation of Chip Supply" and 1 of the same magazine.
It is also described in the February 1973 issue, pages 79 to 82, "Bonding Device" (as shown in this article), a chip is adhered to an adhesive tape, and during chip bonding, the chip on the adhesive tape is picked up and held in place by a pick knob. “I carry it to the factory and do chip bonding.

By the way, the applicant has developed a method using carbide or 5KH with a conical pressure-pointed tip (the tip has a roundness of several μiTl) when using this chip for big amplification.
The chip is picked up by piercing the adhesive tape from below with a 6fl needle to peel the chip from the adhesive tape.

However, the inventors have found that this technique has the following drawbacks.

That is, the needle is made of wear-resistant carbide or SK
Although it is formed of an I-I hook, the tip gradually wears out due to contact with the tape and tip during repeated use, and the tip becomes flat as shown in FIG. As a result, when the adhesive tape 2 was punched out and the tip 3 was pushed up with a VJ'', the tip of the 5 needle 1 became flat 4, so the adhesive tape 2 was punched out and the punched piece 5 is attached to the bottom surface of the chip 3. A punching piece 5 is attached to the chip 3, and it is connected to a predetermined part with a knee cut 6.
Bonded. In this state where the punched piece 5 is interposed, the individuality of the bonding material during step bonding becomes poor, resulting in poor bonding. It was also found that chip cracks frequently occur during wire bonding, which connects wires to the chip surface.

Therefore, the needle must be replaced before the above-mentioned trouble occurs. Needle replacement must be performed in a short period of time, for example, every time, and this has the disadvantage of reducing the operating rate of chip bonding.

On the other hand, the present inventor has developed a technique that eliminates haunch outburrs by forming the needle with ruby, which has better wear resistance than carbide or SKHRfj.

The needle is extremely thin and long, with a diameter of several 100 μm to several mm, so it breaks easily (it was also found that it is not suitable for practical use as it is).

[Purpose of the invention]

An object of the present invention is to provide a needle with a long service life, the sharp end of which does not wear out and is difficult to break.

The above and other objects and novel features of the present invention are as follows:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, the needle is made of carbide or SK1. It consists of a thin core made of ruby, which has better wear resistance than I fIs, and a tubular body made of SKH steel, which has higher toughness than ruby, surrounding this core, and the tip is ground into a conical shape and has a sharp point. Since the part has a pencil structure with a core made of ruby, the sharp part hardly wears out, and the main body other than the tip part is not prone to breakage, so the life of the needle is greatly improved. , the needle exchange period becomes longer, and when using Chig bonding VC length, an improvement in the operating rate can be achieved.

〔Example〕

FIG. 2 is a cross-sectional view of a needle according to one embodiment of the invention.

A thin core body 7 made of ruby with a diameter of 1 kt & 100 μm to several dragons, and a Ti-shaped main body 8 made of S K Hm fitted so as to cover this core body 7.

1, both of which are fixed with a solder material such as silver solder,
The tip is ground to form a conical portion 9, which has a so-called pencil structure. Further, the tip of the sharp tip portion 10 of the core body 7 is, for example, an arcuate end with a radius of 2 μm and d4 degrees. This is because needle l breaks through the adhesive tape and pushes the chip straight upward when picking up the chip.
This was adopted after the applicant confirmed that it was a suitable tip shape. Ruby has higher IIFI abrasion resistance than carbide or 5KHI, but has lower toughness and breaks more easily than carbide or SKH steel.

(Effects) Since the il+ needle has a pencil structure, the core body 7 that is easy to break is only the sharp tip 10 at the tip of the conical part 9, and most of the other core body parts are made of SKH grout with excellent toughness. 8
protected. For this reason, it is difficult to break.

(2) Sharp tip portion 10 of needle 1 that pushes up the tip
Since it is made of ruby, which hardly wears, the needle replacement period is significantly longer than that of carbide or SKH white.

(31 As mentioned in (2) above, the tip 10 of the needle 1 is not easily worn out, so there is no need to punch out adhesive tape to support the chip when pushing the chip up. Therefore, there is no adhesive tape on the bottom surface of the chip. There is no possibility that the punched pieces will stick to the product (therefore, chip connection failures and chip cracking defects due to punched piece adhesion traps are less likely to occur), which improves quality and semiconductor device OT manufacturing yield. I can figure it out.

(If the sharp end 10 of the 41 needle 1 is worn out or chipped due to improper handling.

The sharpened portion 10 may be formed by sequentially re-grinding. Also, since needle 1 has a pencil structure.

(By repeating the grinding several times, the needle 1 can be used over almost the entire length, which is efficient.

It's cheap.

(51 According to (1) to (41) above, needle 1 is cheaper,
A synergistic effect of improving the productivity and yield of semiconductor devices and reducing the manufacturing cost of semiconductor devices can be obtained.

Although the invention made by the present inventor has been specifically explained above based on examples, it goes without saying that the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Nor.

For example, as shown in FIG. 3, even if the needle 1 has a structure in which a pointed part 10 made of a ruby with a cone 11 formed at one end of a main body 8 made of round bar-shaped SKH steel is fixed with steel,
Since the sharp point 10 is made of a wear-resistant material and is not easily worn out by pushing up the tip, and the main body 8 of the needle 1 is made of S K II silicon that does not break easily, the needle 1
You can get the effect that your life is long.

The main body of the needle 1 may be made of other materials that are hard to break, and the same effect as in the embodiment can be obtained even if a material with excellent wear resistance such as sapphire or diamond is used instead of the sharp point 101X ruby. can get.

[Application field]

In the above explanation, we have mainly explained the case where the invention made by the present inventor is applied to the chip bonding technology, which is the background application field, but it is not limited to this application. It can also be applied to pick-up technology for products that need to be peeled off one by one.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a conventional chip pickup state, and FIG. 2 is a sectional view of a needle according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a small needle according to another embodiment of the invention. 1...needle, 2...adhesive tape, 3...chip.

Claims (1)

[Claims] 1. A needle having a sharp tip, the needle being characterized in that the sharp tip is made of a wear-resistant material such as ruby, sapphire, or diamond.