JPS6036675A - Catalyst for electroless copper plating - Google Patents

Abstract

PURPOSE:To improve the characteristics of the resulting electroless copper plating by adding a complex compound which is prepd. by reacting a bivalent palldium compound or a uni- or bivalent copper compound with amino acid and produces metallic Pd or Cu by heating. CONSTITUTION:To a catalyst for electroless copper plating is added a complex compound which is prepd. by reacting a bivalent palladium compound or a uni- or bivalent copper compound with amino acid and produces metallic Pd or Cu by heating. The amount of the complex compound added is <=1wt% when the compound is expressed in terms of Pd or Cu. Palladium (II) chloride, palladium IIfluoride, palladium (II) bromide, palladium (II) iodide or the like is used as the bivalent palladium compound. Copper ( I ) chloride, copper (II) chloride, copper (II) sulfate or a mixture thereof is used as the uni- or bivalent copper compound.

Description

[Detailed description of the invention] The present invention is applicable to a catalyst for electroless copper plating.

Electroless copper plating is used in the field of printed wiring boards to form circuits on thickened leather boards such as laminated boards.

In this case, the electroless steel plating in the round cycle is activated, that is, the catalytic nucleus for electroless steel plating is formed around this catalyst nucleus, Copper ions in the 41-free copper plating solution precipitate and grow to form a copper film, forming a circuit.

In order to make the loquat edge similar to Y, it is used as a catalyst for electroless plating.

Conventionally, this Kinten palladium was HC7! In the reaction of PdC6, +5n (J, Pd +SnC/!4, I4j et al ↓゛ is supported on a carrier with a silicon stock.
11 It has a devised formula like the catalytic function.

Therefore, @Sn, (, jl 7i: disadvantage 1?l purple, and so on. ) with 4
'If the IV layer is in danger, warping and screws may occur, and there are VC and iF points in the loquat, and it was difficult to insert the insulation into the loquat layer. In addition, by heating, a gold-plated palladium compound was produced and a catalyst for electroless steel plating was obtained.

Palladium compounds of 211III include palladium chloride (111), palladium fluoride (II), palladium iodide (rg), palladium nitrate (II), palladium sulfate (■), palladium oxide ( II)% desensitized palladium (a mixture of 7" and 7" is used).

Halide, preferably palladium(II) chloride in %1]-
5. Copper chloride (r) is an example of a monovalent or divalent copper compound.

Copper chloride (■), copper (II) sulfate and mixtures thereof are 1
Use n/).

As amino acids, glutamic acid, Asunoku Lagin 1m
Glycine, alanine, phosphorus, phenylalanine and mixtures thereof are used.

For example, when divalent palladium compound is removed from amino acid and complexed with t, it is 1 and methanol is 1.5.
eeK, 1. - Glutamine oa y gm Radium(II) tetrachloride 0.1 g'a = Addition of 0.1 g'a = Addition of 0.0 g of radium (II). This complex compound is heated to 80 degrees Celsius to form radium? In the resulting complex compound, the chemical palladium (b) coordinates to the amine group of the amino acid to form J, -
The temperature of 50 to 200°C is bright, for example, and the temperature of 50 to 200°C is bright, ! Example of use of the complex compound of the present invention (explanation).Use (1) Immerse the proboscis to be plated in a water bath containing the complex compound and pull it up. By heating, palladium is formed on the surface of the object to be plated.The complex compound is dispersed in a rubber-phenolic adhesive, and the adhesive is coated with epoxy on a glass cloth. It is applied to the surface of the impregnated laminate, etc., and is heated and dried to form a metal palladium. The base material is impregnated, and a laminate is manufactured by a normal method. When the brigreg is dried, metal palladium is generated by the heat when the laminate is heated and pressed. (4) Lead compound, M of polyester resin. Disperse in a organic solvent, pour and form two films (wire mesh palladium is produced by heating during heat removal of organic shavings) 0 (5) Tetrahydro of 7% polyimide with 9% lead Dispersed in the fushin bath, the heat of the time will cause the formation of gold baladicum, and the insulation of the fence will become more than 71.00. In summary, the catalyst for plating non-screened steel of the present invention has the following advantages: (1) Because the particles of the produced basidium are fine, the catalyst for electroless plating of bamboo obtained is Since 1st grade is used without using carriers such as Tsun, 0 (2) name Tsukito, f Shigetsu → ka = Jf Pideme 9, j phrase - easy to mix 0 ( 5J Impurities such as Sn, C1, etc.
.

He has a good ability to understand things easily.

5-] Above This No. -1E Store- 1. Display of matter 1'1 1158 sho 1 difference 1: Application No. 144634 2. Title of invention Catalyst for electroless copper plating 3. Person making the amendment outside the vehicle. Relationship with Patent applicant address No. F, 2-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo Name (445)
) Hitachi Chemical Co., Ltd. Representative Director Ryoji Yokoyama 4, Lee (JIL), ■160 Address Hitachi Chemical Co., Ltd., 2-1-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo (Tel: Tokyo 346-3) 11 (Main representative) ) 6. Details of the amendments are as shown in the attached sheet.

Details Oath 1, No title of the invention "Tun-Dan-Cook Me-) @ Catalyst 2, 41I! of hook IFf request! Title 1, 2i1111 (/J Palladium-plated 9-kilometer, 1
Kun, 21 ta j's copper 8- thing? Amino ■ and li ratio, let samurai n.

〃1j Fever V (more palladium or pharyngeal fever-producing proboscis τ-bom jiao-chu-kiri-bata) 05, Invention 1
Net 11 Iwaimachi Honbenmei is No 11L piece bronze plated touch green e (Ending 20 Kumaya Scale Aya Messa is the printing distribution board understanding-C1 dove board 4? O cap powder leather board It is widely used in VC.

When the electroless steel plating of the insulating water plate is applied, it is activated, and the PPJI section core for electroless steel plating is formed. During VC and %A release, copper ions precipitate and grow to form a single circuit, becoming a catalyst for electroless steel plating in order to activate insulation and temporary τ. There is a formation type on the side edge of Kanazawa Palladium or e Yukin Tame Funa τ side edge.

oE rice, Tori Ehako Q Kanasu palladium rJCl PdC1m + Sn (Jm Pd +5nCA! 4 reaction, the samurai 'n'n was invited to the association such as J-L, and touched Itφr to? Yonecho It's a well-thought-out heart.

Therefore, Sn, Cβ and small axis tψ〈meeting tortoise body τ and 67t, mixed with Hui torture vC, Atitigu mark Aβ11 k lR temporary ship ship (with green color) N
The IX layer plate is busy and has troubles, edges, and screws tL7ji, and the side edges are attractive, and the disconnection 1 of Zetsurinkago 1 Sochu V (
α Insert bc and 11 troubles kO This defense is based on the ship's point of view. It reacts with amino acids and heats up the metal palladium or 1J metallurgy.

211IiI rivaradiwam compound as 01 palladium bromide (Isu, buffi fluoride (kawa), palladium bromide (
■), Baladicum iodide tub, 6MN Baladicum r) mu (It).

Palladium oxate (IU), baladium chloride (IU), reduced palladium (H) and a mixture of these are used.
The decorations for the 11th and 21st songs include Hanka Wholesal II Hanka Im (1), sulfuric acid steel (Kawa Takoko (L et al.'s Kusengoku Kani).

As for Abinobaba, gourmetase/jojo, asparagus,
Glycine, arani, valine, phenylalanine and mixtures thereof are used to react with bent palladized amino acids to form a complex compound τ, for example, methanol 1.5 CCV, L-glue p , 17
gs fM vanadium (11J11sl addition) VC Yoji Samurai n mind.
ψ Kaede palladium is generated with zero heat of the sword.

Palladium chloride (IJJ0) is coordinated to the amine group of the amino acid, and is exposed to palladium Imbashi by the hydrogen that is separated from the carbon water Vc that forms the amicite I5. 50-200-C is preferable, and the pigeon inkstone is made large by the woodcutter of Abano@.

5-4; Examples of use of the complexing material of the invention will be explained. Pd after use
, CII C/J-1 mouth is less than 1% or less.

(1) Raise and heat the VC plating object in the water tank and heat it.
Nisaichi+! :/).

(2) Introducing f5-product τ, 1g of rubber-phenol-based toxins. 11 shi, power l fever vi, 沫 f 6 J3.

(5) With the axle attachment, the acetone bath accident of the epoxy tree 1j mouth IPi δ and the Soniske Karasu wakucho υ material (reverse it, and set up the eli reconnaissance pigeon temporary in the force stroke of the appropriate sound). Preg' dry edge 1j, 7.4 Tei J-plate q) Katana Ro thermal power 11 pressure hunting heat and gold palladium or a gold #4 steel or Sho seicho/b
.

(4) Rust compound 'IvJ= * Organic solution of polyester position Illpo 11sf61) Deficiency Vc minute n and 6ze, film τ one (small. ) force 11
46 The heat during removal causes the palladium or metal steel to burn to the bottom of the can.

(5) Wholesale distribution'#k * Disperse polyamide in a tetrahydrofuran bath and treat it to copper wire. Seizing occurs due to the heat of time, and the J gold is tJE.

Based on the above H, the P for plating without m tassel steel of the 4th invention!
i! The medium should pass through the following four points.

(1) 1 golden autumn palladium or a moss successor teacher wholesale 1
Kai K, samurai [Tamu 41. Because the timing of plating is agitated ゐゐゐ12) 4+↓I don't have to use #Li storage at Sashiji Temple.

The number of baths used is 1jJj+t=, and uniform mixing is easily 0 (3J bn, (,;g4r impurity W=contains -1a 7I
:ohib et al. jL7 without '14. The hunting nature of the folding plate O5-

Claims (1)

[Claims] 1. Is the palladium compound of 21 songs the compound of 11 and 21 songs? React with amine filtrate. A catalyst for electroless steel plating that produces gold ingot palladium by heating.