JPS6037139A - ウェ−ハ移送経路におけるゲ−トバルブ機構 - Google Patents
ウェ−ハ移送経路におけるゲ−トバルブ機構Info
- Publication number
- JPS6037139A JPS6037139A JP58144945A JP14494583A JPS6037139A JP S6037139 A JPS6037139 A JP S6037139A JP 58144945 A JP58144945 A JP 58144945A JP 14494583 A JP14494583 A JP 14494583A JP S6037139 A JPS6037139 A JP S6037139A
- Authority
- JP
- Japan
- Prior art keywords
- shutter
- gate valve
- sealing surface
- shaft
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lift Valve (AREA)
- Details Of Valves (AREA)
- Physical Vapour Deposition (AREA)
- Intermediate Stations On Conveyors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58144945A JPS6037139A (ja) | 1983-08-10 | 1983-08-10 | ウェ−ハ移送経路におけるゲ−トバルブ機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58144945A JPS6037139A (ja) | 1983-08-10 | 1983-08-10 | ウェ−ハ移送経路におけるゲ−トバルブ機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6037139A true JPS6037139A (ja) | 1985-02-26 |
| JPH0413424B2 JPH0413424B2 (2) | 1992-03-09 |
Family
ID=15373837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58144945A Granted JPS6037139A (ja) | 1983-08-10 | 1983-08-10 | ウェ−ハ移送経路におけるゲ−トバルブ機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6037139A (2) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02190691A (ja) * | 1989-01-19 | 1990-07-26 | Ulvac Corp | 真空バルブ |
| JP2009272602A (ja) * | 2008-04-07 | 2009-11-19 | Tokyo Electron Ltd | 基板処理装置 |
| WO2012128029A1 (ja) * | 2011-03-18 | 2012-09-27 | 東京エレクトロン株式会社 | ゲートバルブ装置及び基板処理装置並びにその基板処理方法 |
| JP2019183996A (ja) * | 2018-04-13 | 2019-10-24 | 株式会社ブイテックス | ゲートバルブ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5526799U (2) * | 1978-08-10 | 1980-02-21 | ||
| JPS57134599U (2) * | 1981-02-17 | 1982-08-21 |
-
1983
- 1983-08-10 JP JP58144945A patent/JPS6037139A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5526799U (2) * | 1978-08-10 | 1980-02-21 | ||
| JPS57134599U (2) * | 1981-02-17 | 1982-08-21 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02190691A (ja) * | 1989-01-19 | 1990-07-26 | Ulvac Corp | 真空バルブ |
| JP2009272602A (ja) * | 2008-04-07 | 2009-11-19 | Tokyo Electron Ltd | 基板処理装置 |
| WO2012128029A1 (ja) * | 2011-03-18 | 2012-09-27 | 東京エレクトロン株式会社 | ゲートバルブ装置及び基板処理装置並びにその基板処理方法 |
| JP2012197476A (ja) * | 2011-03-18 | 2012-10-18 | Tokyo Electron Ltd | ゲートバルブ装置及び基板処理装置並びにその基板処理方法 |
| US9121515B2 (en) | 2011-03-18 | 2015-09-01 | Tokyo Electron Limited | Gate valve unit, substrate processing device and substrate processing method thereof |
| JP2019183996A (ja) * | 2018-04-13 | 2019-10-24 | 株式会社ブイテックス | ゲートバルブ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0413424B2 (2) | 1992-03-09 |
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