JPS6037252U - Lead frame for semiconductor devices - Google Patents

Lead frame for semiconductor devices

Info

Publication number
JPS6037252U
JPS6037252U JP13003783U JP13003783U JPS6037252U JP S6037252 U JPS6037252 U JP S6037252U JP 13003783 U JP13003783 U JP 13003783U JP 13003783 U JP13003783 U JP 13003783U JP S6037252 U JPS6037252 U JP S6037252U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor devices
guide
external leads
frame guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13003783U
Other languages
Japanese (ja)
Other versions
JPS635252Y2 (en
Inventor
隆 長手
三井所　博史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP13003783U priority Critical patent/JPS6037252U/en
Publication of JPS6037252U publication Critical patent/JPS6037252U/en
Application granted granted Critical
Publication of JPS635252Y2 publication Critical patent/JPS635252Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図、第３図は、従来の半導体装置用リード
フレームの例を示す平面図、第４図は、本考案による改
良されたフレーム端部を有するリードフレームの一実施
例を示す平面図である。 １・・・リードフレームガイド、２・・・外部リード、
３・・・ペレット搭載部、４・・・内部リード、５，５
Ａ、５Ｂ・・・結合部、６Ａ、６Ｂ、６Ｃ，６Ｄ、６Ｅ
、６Ｆ、６Ｇ、６Ｈ，６Ｊ、６に、６Ｌ、６Ｍ・・・従
来のフレーム端部、７Ａ、７Ｂ、７Ｃ，？Ｄ・・・本考
案のフレーム端部、７Ｎ、７Ｐ、７Ｑ、７Ｒ・・・切り
欠き部。1, 2, and 3 are plan views showing examples of conventional lead frames for semiconductor devices, and FIG. 4 shows an example of a lead frame having an improved frame end according to the present invention. FIG. 1...Lead frame guide, 2...External lead,
3... Pellet mounting part, 4... Internal lead, 5, 5
A, 5B...Joining part, 6A, 6B, 6C, 6D, 6E
, 6F, 6G, 6H, 6J, 6, 6L, 6M... Conventional frame end, 7A, 7B, 7C, ? D...Frame end portion of the present invention, 7N, 7P, 7Q, 7R... Notch portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外部リード２の少なくとも一部が互いにかみ合い上下両
端にリードフレームガイド１を有し連続製造される半導
体装置用リードフレームにおい、　　　て、リードフレ
ームガイド端部７が前記外部リード２と同じ長さで前記
リードフレームガイド１の半分の幅を有し前記リードフ
レームの左右でフレーム端部７Ａと７Ｂ、７Ｃと７Ｄと
なり、それぞれ前記リードフレームガイド１の上下逆の
半分を占める形状であることを特徴とする半導体装置用
リードフレーム。In a lead frame for a semiconductor device that is continuously manufactured and has lead frame guides 1 at both upper and lower ends in which at least a portion of the external leads 2 engage with each other, the lead frame guide end 7 has the same length as the external leads 2 and It has a half width of the lead frame guide 1, and has frame end portions 7A, 7B, 7C, and 7D on the left and right sides of the lead frame, each occupying an upside-down half of the lead frame guide 1. Lead frame for semiconductor devices.
JP13003783U 1983-08-23 1983-08-23 Lead frame for semiconductor devices Granted JPS6037252U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13003783U JPS6037252U (en) 1983-08-23 1983-08-23 Lead frame for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13003783U JPS6037252U (en) 1983-08-23 1983-08-23 Lead frame for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS6037252U true JPS6037252U (en) 1985-03-14
JPS635252Y2 JPS635252Y2 (en) 1988-02-12

Family

ID=30294451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13003783U Granted JPS6037252U (en) 1983-08-23 1983-08-23 Lead frame for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6037252U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125159A (en) * 1984-11-22 1986-06-12 Hitachi Ltd Cutting method of lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125159A (en) * 1984-11-22 1986-06-12 Hitachi Ltd Cutting method of lead frame

Also Published As

Publication number Publication date
JPS635252Y2 (en) 1988-02-12

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