JPS6041044U - ガラス封止型ケ−ス - Google Patents

ガラス封止型ケ−ス

Info

Publication number
JPS6041044U
JPS6041044U JP1983133295U JP13329583U JPS6041044U JP S6041044 U JPS6041044 U JP S6041044U JP 1983133295 U JP1983133295 U JP 1983133295U JP 13329583 U JP13329583 U JP 13329583U JP S6041044 U JPS6041044 U JP S6041044U
Authority
JP
Japan
Prior art keywords
sealed case
glass
glass sealed
cavity
die attach
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983133295U
Other languages
English (en)
Inventor
高志 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983133295U priority Critical patent/JPS6041044U/ja
Publication of JPS6041044U publication Critical patent/JPS6041044U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のガラスマウント用ケースにペレットをマ
ウントした構造を示す断面図、第２図は従来のガラスマ
ウント用ケースに基づくペレット剥離モードを示す拡大
断面図、第３図は従来のガラスマウント用ケースにペレ
ットをマウントした他の構造を示す断面図、第４図は第
３図の従来のガラスマウント用ケースに基づくペレ゛ン
、ト剥離モードを示す拡大断面図、第５図は本考案に基
づくガラスマウント用ケースの実施例を示す断面図、第
６図は第５図のガラスマウント用ケースにペレットをマ
ウントした構造を示す拡大断面図、第７図は本考案に基
づくガラスマウント用ケースに用いるセラミック基体の
斜視図、第８図は第７図の横断面拡大図、である。 なお図において、１・・・セラミック基体、２・・・キ
ャビティ、３・・・ペレット取付用低融点ガラス層、４
・・・低融点ガラス層、５・・・リードフレーム、６・
・・ペレット、７・・・金属膜層、８・・・連続凹凸形
状、である。 第　３　図 第　、５　図

Claims (1)

    【実用新案登録請求の範囲】
  1. キャビティーを有するセラミック基体に低融点ガラスを
    介してリードフレームを固着して成るガラス封止型ケー
    スにおいて、該キャビティー内のダイアタッチ面が複数
    個の連続した凹凸形状を有しかつ前記ダイアタッチ面上
    に低融点ガラス層を有することを特徴とするガラス封止
    型ケース。
JP1983133295U 1983-08-29 1983-08-29 ガラス封止型ケ−ス Pending JPS6041044U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983133295U JPS6041044U (ja) 1983-08-29 1983-08-29 ガラス封止型ケ−ス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983133295U JPS6041044U (ja) 1983-08-29 1983-08-29 ガラス封止型ケ−ス

Publications (1)

Publication Number Publication Date
JPS6041044U true JPS6041044U (ja) 1985-03-23

Family

ID=30300733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983133295U Pending JPS6041044U (ja) 1983-08-29 1983-08-29 ガラス封止型ケ−ス

Country Status (1)

Country Link
JP (1) JPS6041044U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201893A (ja) * 1995-01-31 1995-08-04 Sony Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201893A (ja) * 1995-01-31 1995-08-04 Sony Corp 半導体装置

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