JPS604228A - Die bonding device for semiconductor - Google Patents

Abstract

PURPOSE:To eliminate time loss at bonding of semiconductor chips onto a plurality of lead frames and to improve accuracy in die bonding by standing plural arms for transporting the semiconductor chips in periphery of a rotator which rotates at a constant angular velocity. CONSTITUTION:The bonding device is provided with, e.g. eight arms 20a-20h which adsorb and hold semiconductor chips 12a, 12b... by vacuum and so on at each end of the arms and are arranged radially in periphery of a rotator 21. The rotator 21 rotates in one direction and with a constant angular velocity R, as shown in the arrow C, and said plural arms are arranged corresponding to the angular velocity R of the rotator 21. A transfer device 22 of the lead frames 13a, 13b... is arranged corresponding to the direction in which one of the arms 20g extends and the lead frames 13a, 13b,... are transferred in a constant interval for each rotation of the rotator 21 at a constant angular velocity R.

Description

Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to semiconductor guide bonding in which a large number of semiconductor chips on which circuit networks are formed are die-bonded onto a lead frame or stem in the process of manufacturing a semiconductor device such as an LSI. Regarding equipment.

[Technical background of the invention]

Generally, a die bonding apparatus as shown in FIG. 1 is normally used to bond a semiconductor chip on which an integrated circuit network, such as an LSI, is formed onto a lead frame or stem.

This die bonding apparatus is equipped with an arm 11 that rotates reciprocally at a rotation angle of 90 degrees as shown by arrow A, for example, and the tip of arm II is attached to semiconductor chips 12a, 12b, . . . It has the function of adsorbing each.

That is, in this die bonding process, a large number of semiconductor chips 12a, 12b, .
The arm 11 reciprocates between a and b every time this die bonding operation is performed. In this case, a series of operations during which arm II reciprocates from 3 to 6 is defined as one cycle, and is called, for example, a 1-second index or a 05-second index.

FIG. 2 shows a Gui bonding device in which the arm 11 moves reciprocatingly between a and b as shown by the arrow B. In this case, as well as in FIG.
Semiconductor chips 12a, 12b, . . . are adsorbed at the point,
One cycle is the series of operations from Gui bonding at point b to returning to point a.

[Problems with background technology]

However, in such a Gui bonding device, the above-mentioned first
In the case of the example shown in FIGS. and 2 as well, since the arm II reciprocates, a large time loss occurs for each cycle of the bonding operation. Also - semiconductor chip 12a.

12b, . . . during suction and bonding, the arm 11 itself vibrates little by little due to the reciprocating movement, so in practice, the lead frame 1
Semiconductor chips 12a, 1 for 3a, 13b, .
The die bonding position setting accuracy of 2b, . . . is poor, reducing the product yield of semiconductor devices.

[Purpose of the invention]

This invention was made in view of the problems mentioned above.
For example, an object of the present invention is to provide a semiconductor die bonding device that can improve die bonding accuracy without causing time loss when die bonding a large number of manufactured semiconductor chips onto a large number of lead frames. .

[Summary of the invention]

That is, in the semiconductor guide bonding device according to the present invention, a plurality of arms for adsorbing and punching semiconductor chips are arranged radially around the outer periphery of a rotating body that rotates in one direction at a constant angle, corresponding to the rotation angle. , the die bonding of the semiconductor chip is performed every time it rotates at the above-mentioned fixed angle.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 shows its configuration, and this bonding device includes, for example, eight arms 2oa to 20h. The arms 20a to 2oh are provided with semiconductor chips 12a, 12b, .
・These multiple arms 208~
20h are provided radially around the outer periphery of the rotating body 21, respectively. In this case, the rotating body 2I rotates in one direction at a constant angle R as shown by arrow C, and the plurality of arms 2
0a to 2oh are the rotation angles R of the rotating body 21, respectively.
It is set up correspondingly.

For example, the lead frame 13a corresponds to the extension direction of any one arm 20g.

A transfer device 22 of 7 J b , , . .

That is, in the apparatus configured as described above, a large number of semiconductor chips 12a, 12b are manufactured.

..., a large number of lead frames 13a, respectively.

To perform die bonding on 13b,..., first,
Semiconductor chip 12a supplied at point a.

12b, . . . are sequentially attracted by respective arms 20a to 2oh which rotate at a constant angle as shown by arrow C. Thereby, the plurality of arms 20a to 20h have a large number of semiconductor chips 12a.

12b, . . . are transported from point a to point b, respectively, and a large number of lead frames 13a, 13b.

...Die bonding is performed one after another at each predetermined position.

In this case, the momentum of each of the arms 20a to 20h corresponding to one cycle of Gui bonding work is only a constant rotation angle R (45 degrees in the case of these eight arms 208 to 20h), which is different from the conventional rotation angle in FIG. The amount of momentum is very small compared to the reciprocating motion at an angle of 90 degrees and the reciprocating telescopic motion in FIG. That is, a large number of semiconductor chips 12a, 12b, . . . are successively connected to lead frames IJa, Z; In order to significantly reduce the time required for one cycle of work when bonding to the arm 20a, etc.
With the movement of ~2oh, each arm 208~2
Vibrations generated in the oh itself can be suppressed to an extremely low level.

Therefore, for example, assuming that the movement time of the arm 11 corresponding to one cycle of the conventional die bonder interworking in FIGS. 1 and 2 is approximately 2 seconds, one cycle of the arms 2θa to 20h according to this embodiment exercise time 75
It can be shortened to about 0.5 seconds, and the semiconductor chip 12
a.

The time-related die bonding workability of Z2b, . . . can be improved by as much as 75% compared to the conventional method. Also, arm 2
0 a , 201) , . . . Since the vibration generated in the semiconductor chips 12 a , 12 b , . . . Bonding accuracy will be improved.

In the above embodiment, the rotating body 21 has eight arms 2OA.
〜zoh is provided, but this arm 20a〜
For example, 20h may be composed of four wires, which is one-half of the number of wires.

In this case, the die bonding workability of the semiconductor chips 12a, 12b, . . . can be improved by 50% compared to the conventional method.

〔Effect of the invention〕

As described above, according to the present invention, when die bonding a large number of manufactured semiconductor chips one after another onto a large number of lead frames, the workability is improved by 50 to 75 times without causing any time loss. In addition, the positioning accuracy of the guide bonding with respect to the lead frame can be greatly improved. Therefore, the operating rate of this die bonding equipment itself is improved, and
Product yield of semiconductor devices can be improved.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a conventional die bonding device, FIG. 2 is a diagram showing a conventional die bonding device different from the above die bonding device, and FIG. 3 is a semiconductor die bonding device according to an embodiment of the present invention. FIG. 12a, 12b, -semiconductor chip, 20a~
2θh...arm, 2no...rotating body.

Claims (1)

[Claims] In a semiconductor die bonding apparatus that conveys and performs die bonding on a large number of semiconductor chips to respective predetermined positions, there is provided a rotating body that rotates at a constant angle in one direction, and a rotary body provided on the outer periphery of the rotating body corresponding to the constant rotation angle. A semiconductor die bonding device characterized by comprising a plurality of arms that each transport a large number of semiconductor chips.