JPS604307A - Production of mic circulator - Google Patents

Abstract

PURPOSE:To obtain a low-cost MIC (microwave integrated circuit) circulator which is easy to work and is suitable for mass production by joining stripe- shaped dielectric substrates and ferrite substrates and forming patterns on the surface of this composite substrate and cutting the composite substrate to separate individual MIC circulators from one another. CONSTITUTION:Stripe-shaped dielectric substrates 8 consisting of non-magnetic materials are arranged on the same plane in parallel through stripe-shaped ferrite substrates 9, and respective end faces are joined with an adhesive to constitute a striped composite substrate 10 in a floor plan. Parallel junction patterns 4 are formed on ferrite substrates 9, and input/output patterns 5 connected to individual junction patterns 4 are formed on dielectric substrates 8. Earth conductor patterns are formed on the rear face of the composite substrate 10. The composite substrate is cut along a long and short dash alternating line Y-Y, which is the center line of the dielectric substrate, and long and short dash alternating lines X-X orthogonal to the line Y-Y so that junction patters 4 are in approximate centers of rectangles, thus separating individual MIC circulators from one another.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method of manufacturing a MIC (microwave integrated circuit) circulator.

(b) Background of the Technology In recent years, with advances in microwave built-in circuit technology, circulators have also been formed on dielectric substrates.

There is a MIC circulator in which an input/output cover pattern having a junction pattern and a matching pattern is formed on the surface of a ferrite substrate, and a magnetic field perpendicular to the ferrite substrate is applied to the junction part by an external magnet to form an irreversible circuit.

However, the Ferrite 14 plate has a larger dielectric loss than a non-magnetic dielectric substrate such as an alumina substrate or a sapphire substrate. Furthermore, since the ferrite substrate is a porous crystal and brittle material, the strength of the metallization is poor, and the reliability of connection with external circuits by bonding or soldering is poor.

For this reason, a ferrite substrate is used at the junction,
Another MIC circulator using an alumina substrate for the input/output cover turn part is provided, which eliminates the above-mentioned drawbacks.

(C) Prior art and problems (a) and (b) in Figure 1 are perspective views showing the manufacturing process of a conventional MIC circuit, and (a) and (b) in Figure 2 are perspective views showing the manufacturing process of a conventional MIC circuit.
2A and 2B are cross-sectional views showing a method of inserting the ferrite disk shown in FIG. 1, respectively.

In FIG. 1(A), a round hole 1a is located approximately in the center of a thin square plate-shaped non-magnetic dielectric substrate (for example, an alumina substrate).
is provided. A ferrite disk 2 having a thickness equal to that of the dielectric substrate 1 has an outer diameter CJ formed to a size that can be fitted into the circular hole 1a of the dielectric substrate 1. A composite substrate is constructed by fitting such a ferrite disk 2 into the round hole 1a of the dielectric substrate 1 as shown in (b), and a portion of the surface of the composite substrate corresponding to the ferrite I and the disk 2 is The junction pattern 4 is connected to the junction pattern 4 to form three input/output cover turns 5 radially at equal angles. In addition, a ground conductor pattern layer (the ground conductor pattern layer in Fig. 2) is formed on the entire back surface of the composite board, and the MIC
A circulator 3 is configured.

There are two methods shown in FIG. 2 for fitting this ferrite disk into the round hole of the dielectric substrate.

The method shown in FIG. 2A is a method in which an adhesive 7 is applied to the outer peripheral end surface of the ferrite disk 2, and the adhesive 7 is inserted into the round hole 1a of the dielectric substrate 1 and fixed. In the method (b), the round hole 1b of the dielectric substrate 1 is made into a tapered hole, the outer peripheral end surface of the ferrite disk 2a is processed into a tapered shape that fits into the round hole 1b, and the ferrite disk 2a is pushed into the round hole 1b and fitted. This is a way of discouraging them.

However, since the method of (a) applies pressure to the adhesive surface of the ferrite disk 2, the thickness of the adhesive layer is such that the round hole 1a and the ferrite disk 2 are There is a problem in that the gap must be processed with high precision. In addition, the means (mouth) is to taper the ferrite disk 2a and the round hole 1b, and the ferrite disk 2
There is a problem in that the surface of the ferrite disk 2a must be processed with high precision so that the surface of the ferrite disk 2a coincides with the surface of the dielectric substrate I in the state in which the ferrite disk 2a is fitted.

As described above, both methods involve processing a thin plate into a circular shape with high precision, resulting in low productivity and high cost.

(d) Purpose of the Invention The purpose of the present invention is to solve the problems described in 2.
An object of the present invention is to provide a method for manufacturing an IC circulator.

(e) Structure of the Invention In order to achieve this object, the present invention provides a short ferrite material, which constitutes the junction part of the MIC Curator, between the end faces of a rectangular dielectric substrate made of a non-magnetic material. The substrates are bonded to an adhesive to form a striped composite substrate in plan view, and the surface of the waste substrate has a junction pattern parallel to the ferrite substrate and a junction pattern on the dielectric substrate. After forming input and output cover turns connected to the junction pattern and forming a ground conductor pattern on the back surface, the composite substrate is cut and separated into individual MIC circulators.

(f) Embodiments of the Invention The present invention will be described in detail below with reference to illustrated embodiments.

3(a), (b), and (c) are perspective views showing the manufacturing process of an embodiment of the present invention. FIG.

As shown in FIG. 5A, a plurality (two in the figure) of strip-shaped ferrite substrates 9 are processed to have a desired width B smaller than the diameter of the junction pattern. A strip-shaped non-magnetic dielectric substrate (for example, an alumina substrate) 8 having the same thickness and length as the ferrite substrate 9 is processed to have a desired width sufficient to form an input/output cover pattern. This dielectric substrate 8 has one more number than the ferrite-based substrate 9 (3 in the figure).
1) prepared.

Then, as shown in (b), the dielectric substrates 8 are arranged in parallel on the same plane through the ferrite substrate 9, and the end faces of each dielectric substrate 8 and the ferrite 1-W handle 9 are joined with adhesive, A striped composite substrate 10 is constructed and shown in plan view.

As shown in t&(c), on the surface of the composite substrate 1o, junction patterns 4 arranged in parallel on each ferrite substrate 9 and input/output cover turns 5 connected to each junction pattern 4 on a dielectric substrate 8 are formed. do. Then, a ground conductor pattern is formed on the back surface of the composite substrate 0.

Then, place each junction pattern 4 approximately at the center of the square. A chain line Y-Y, which is the center line of the h-body substrate 8, and a plurality of chain lines X-X perpendicular to the chain line Y-Y.
Cut the plate 10 into individual MIC circulators.

In this way, each dielectric substance! 12B, since the ferrite 1-μ plate 9 and the part to be cut are all straight lines, it can be easily processed with a high lamination density.Also, the dielectric substrate 8 and the -Lie 1 - Board 9
It is also easy to apply pressure to the adhesive surface with the composite substrate 10, and it is also easy to construct the composite substrate 10.

([) Effects of the Invention -1- As explained, the present invention is easy to process, mass-produced, low cost, has low transmission loss, and has connections.
1-'s degree of nudity is the tradeoff, making the MIC Sea Curator an IS.
There is an excellent practical effect of being able to do this.

[Brief explanation of the drawing]

(A) and (B) in Figure 1 are perspective views showing the manufacturing process of the conventional Dake IC circulator, and (~()(r) in Figure 2).
+) are cross-sectional views showing the method of inserting the disk in the Ferrai 1 shown in FIG. 1, and (A), (CI), and (C) in FIG. 1 is a perspective view. In the figure, 1 and 8 are dielectric substrates, 2 and 2a are 71541 disks,
11 is a junction pattern, 5 is a crowded cover turn,
6 is a ground conductor pattern, 9 is treated as Ferrai 1u, 104;
1 composite substrate is shown, respectively. Male 1 Figure (a) (Ip Boundary 3 Figure (a)

Claims (1)

[Claims] Between the end faces of a rectangular dielectric substrate made of nonmagnetic material, M
I G-') - The strip-shaped ferrite substrates constituting the junction portion of the curator are joined with adhesive to form a striped composite substrate in plan view, and the ferrite substrate portion is on the surface of the composite substrate. After forming junction patterns parallel to each other and input/output cover turns connected to the respective junction patterns on the dielectric substrate, and forming a ground conductor pattern on the back surface, the composite substrate was connected to individual M I C circulators. A method for manufacturing an MIC circulator, which comprises cutting and separating the MIC circulator into two parts.