JPS60438B2 - Manufacturing method for perforated plated products - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a perforated plated product, and particularly to a method of manufacturing a thick plated product that is unimaginable using conventional methods.

A conventional method for manufacturing thick perforated products, such as mesh plates and screen plates, is shown, for example, in FIGS. 1a-d.

That is, using a conductive material such as metal as the substrate 1,
On top of that, a non-conductive resist film 2 is applied using an exposure method or a printing method.
is formed into a pattern, and metal is deposited on the exposed surface of the substrate 1 by electroplating to form an electrodeposited layer 3. Thereafter, as shown in FIG. 1C, the lightning attachment layer 3 is peeled off and separated from the substrate 1. Thereafter, as shown in FIG. 1d, an electroplated layer 4 is deposited on the surface of the bonded layer 3 to a required thickness to obtain a predetermined thickness. However, when trying to obtain thick plated products using such conventional methods,
As the thickness increases, the distortion of the product becomes more severe, and the variation in dimensions and thickness increases, making it impossible to manufacture products of uniform quality.

The present invention is a new method for manufacturing thick perforated plated products that solves the problems of the conventional method as described above. Then, a metal different from that of the base plate is formed in a pattern in areas other than the areas that will become the postholes to form a first plating layer, and the base plate is etched using this first plating layer as a corrosion-resistant film. This is a method for producing a perforated plated product, in which a through hole is formed by using a metal plate, and then the entire plate is plated to form a second plating layer that covers both the base plate and the first plating layer.

Hereinafter, a more detailed explanation will be given with reference to FIGS. 2a to 2f of the drawings showing an embodiment of the present invention. Photosensitive resin films 6, 6' are coated and formed on both surfaces of the metal base plate 5.

Next, pattern exposure is performed on both surfaces to form resist patterns 7 and 7'.

The shapes of the resist patterns 7, 7' correspond to the shapes that will become the openings in the future. According to the example of FIG. 2b, the resist patterns 7 and 7' on both sides have the same symmetrical shape. Alternatively, the shapes of the resist patterns 7 and 7' can be made different by shifting their positions. Next, first plating layers 8, 8' are formed by depositing metal by electroplating on the exposed surface of the base plate 5 on which the resist patterns 7, 7' are not applied, as shown in FIG. 2d. Then, resist patterns 7 and 7' are dissolved and removed. This figure 2d
In other words, the first plating layers 8, 8 are on both sides of the base plate 5.
The method of creating the state formed by forming ' is shown in Figures 2 a to d.
In addition to carrying out the process according to the method shown in FIG. It can also be in the state of Thereafter, the base plate 5 is etched by chemical etching or the like, using the first plating layers 8, 8' as a corrosion-resistant film, to form the openings 9. In the final step, the obtained open-hole plated product is fully plated in an electrolytic plating chamber to form a second plating layer 10, and the base plate 5 and the first plating layers 8, 8 are plated.
' and the barrier part 9 created by etching.
This method covers the rough condition of the inner wall surface of the plated product and adjusts the thickness of the plated product to the required value. In addition, to add a little bit, the metals used for the base plate 5 are as follows:
Materials that are relatively easily attacked by chemicals such as acids pass through, such as copper, iron, aluminum, and zinc. on the other hand,
The metals used for the first plating layer, which should be made of a metal different from that of the base plate, include precious metals such as platinum and gold, materials that are not easily attacked by acids and other chemicals such as nickel, chromium, and tin, solder, etc. It is possible to give alloy plating of
In short, when etching holes in the base plate, the combination of metals that will corrode only the metal of the base plate without corroding the first plating layer is selected based on the etching solution. . The present invention is as described above, and since a metal base plate is present in the perforated plated product and haze deposited layers are provided on both sides of the base plate, each electrodeposition layer is The resulting internal stresses act in opposite directions and cancel each other out. Therefore, even if a considerably thick plated product is manufactured using the manufacturing method of the present invention, distortion will not occur. Moreover, since the base plate is provided, the thickness of the plated product can be increased by the thickness of the base plate, making it possible to manufacture plated products with a thickness that was impossible to achieve with the conventional method. Depending on the selection, it is possible to create products with greater mechanical strength than products made only by plating. In addition, being able to make the thickness of the product uniform,
This is different from conventional methods, and since the pattern of the barrier holes is etched using a metal layer as a corrosion-resistant film, the shape can be faithfully reproduced and sharp patterned holes can be created. Furthermore, since a second plating layer is formed, a plated product with a smooth surface, excellent chemical resistance, and gloss can be obtained. In addition, the present invention has the advantage that the product can be manufactured at low cost due to the shortening of the time required for plating and the simple process.

[Brief explanation of the drawing]

1A to 1D are cross-sectional views showing an example of a conventional manufacturing method for a perforated product in the order of steps, and FIGS. It is sectional drawing shown in order. 1...Substrate, 2...Resist film, 3...Exposed layer, 4...Electroplated layer, 5...Base plate,
6...Photosensitive resin film, 7...Resist pattern, 8...First plating layer, 9...
- Opening part, 10... second plating layer. Figure 1 Figure 2

Claims (1)

[Claims] 1 Form a pattern of metal different from the metal of the base plate on both sides of the metal base plate to form a first plating layer, and use the first plating layer as a corrosion-resistant film to etch the base plate to form through holes. After that, the metal base plate and the first plating layer are covered with a second plating layer formed by plating the entire product.