JPS6045095A - Method of producing thick film multilayer board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to a method for manufacturing a thick film multilayer substrate.

[Technical background of the invention and its problems]

The conventional manufacturing process for thick-film multilayer substrates is shown in Figure 1 (a), for example.
), (b), after printing and baking the first wiring conductor layer 2 with silver-baladium paste etc. on an insulating substrate 1 made of alumina or the like, a part of the conductor circuit is covered with glass as shown in FIG. 1(C). The insulating layer 3 is printed and fired using paste or the like. Furthermore, as shown in FIG. 1(d), after printing and firing a second wiring conductor layer 4 using silver or baradium-based paste, etc., as shown in FIG. 1(e), between the electrodes formed by the first wiring conductor layer 2, A resistor 5 made of ruthenium oxide paste or the like is printed and fired.

However, in the conventional manufacturing method described above, when forming the second wiring conductor layer 4 and the resistor 5, it is necessary to use two different types of screens and pastes (silver-baladium paste and ruthenium oxide paste). However, there was a problem with the manufacturing process involving multiple axes.

Furthermore, the above-mentioned silver and palladium-based wiring conductor layer is formed by silver microbrake 1, that is, the silver of the first or second wiring conductor layer 2 or 4 is ionized through an insulating layer with a thickness of several tens of microns. Insulation deterioration is likely to occur due to migration, and there are also problems in terms of reliability.

[Purpose of the invention]

SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a method for manufacturing a thick film multilayer substrate that simplifies the manufacturing process and improves the reliability of interlayer insulation.

[Summary of the invention]

The present invention provides a method for manufacturing a thick film multilayer board by printing and firing a first wiring conductor layer, an insulating layer, a second wiring conductor layer, and a resistor, when forming the second wiring conductor layer and the resistor. Using the same screen and paste,
The above object is achieved by printing and firing the wiring conductor layer and the resistor at the same time.

[Embodiments of the Invention] Hereinafter, one embodiment of the method for manufacturing a thick film multilayer substrate of the present invention will be described. FIG. 2 is a diagram showing an embodiment of the method for manufacturing a thick film multilayer substrate of the present invention. First, as shown in FIG. 2(a), Φ), a first wiring conductor layer 2 is printed and fired using a silver-baladium paste or the like on a substrate 1 made of ceramic or the like.
As shown in Figure (C), the insulating layer 3 is printed and fired using glass paste or the like. Thereafter, as shown in FIG. 2(d), the second wiring conductor layer 4 and the resistor 5 are simultaneously printed and fired using the same screen and resistor paste (ruthenium oxide paste, etc.) to complete the manufacturing process. In the above embodiment, since the resistor paste is used as the second wiring conductor layer 4, the conductor resistance increases. Therefore, for example, the resistance value R shown in FIG. If you want to have it, divide it into parts with resistance holes and resistance values as shown in Figure 4 (2), and set R>R++.
Make sure that condition B is satisfied. Then, as shown in FIG. 4, the resistance value is corrected by trimming the portion 6 of the resistance value R1 formed in series with the second wiring conductor layer 4 having a resistance value R1, and the desired resistance value is obtained. All you have to do is get R.

According to this embodiment, the second wiring conductor layer 4 and the resistor 5 are simultaneously printed and fired using the same screen and the same resistor paste, thereby reducing the number of steps and simplifying the manufacturing process compared to the conventional method. can do. Furthermore, regarding interlayer migration of silver, which is a problem with conventional silver-baladium-based pastes, by using a ruthenium oxide-based resistance paste for the second wiring conductor layer 4, the migration is suppressed and the interlayer insulation is improved. Reliability can be improved.

〔Effect of the invention〕

As described above, the method for manufacturing a thick film multilayer substrate of the present invention has the effect of simplifying the manufacturing process and improving the reliability of interlayer insulation.

[Brief explanation of drawings]

Figure 1 is a process diagram showing a conventional method for manufacturing a thick film multilayer board;
FIG. 2 is a process diagram showing an embodiment of the thick film multilayer board manufacturing method of the present invention, FIG. 3 is a partial wiring diagram of the thick film multilayer board shown in FIG. 2, and FIG. FIG. 2 is a partial plan view of a thick film multilayer substrate manufactured by the method of FIG. 1... Insulating substrate, 2... First wiring conductor layer, 3- Insulating layer, 4...- Second wiring conductor layer, 5- Resistor agent Patent attorney Noriyuki Chika (and 1 other person) 31゛A Figure 2. )22 = I Figure 4

Claims (1)

[Scope of claims] In a method for manufacturing a thick film multilayer board, which includes a step of printing and baking a layer, and a step of printing and baking a resistor between electrodes formed by the first wiring conductor layer, a paste having the same composition as that of the resistor is added to a second layer. A method for manufacturing a thick film multilayer board, which is used as a wiring conductor layer and is characterized by simultaneously printing and firing these resistors and a second wiring conductor layer. (2) A resistor in series with the second wiring conductor layer. The thick film multilayer substrate according to claim 1, characterized in that by trimming the resistor, a composite value of the resistor and the second wiring conductor layer is set to a desired value. Production method.