JPS6045663B2 - Thermosetting resin molding material - Google Patents
Thermosetting resin molding materialInfo
- Publication number
- JPS6045663B2 JPS6045663B2 JP5667079A JP5667079A JPS6045663B2 JP S6045663 B2 JPS6045663 B2 JP S6045663B2 JP 5667079 A JP5667079 A JP 5667079A JP 5667079 A JP5667079 A JP 5667079A JP S6045663 B2 JPS6045663 B2 JP S6045663B2
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- molding material
- resin molding
- resin
- oligomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 title claims description 49
- 239000011347 resin Substances 0.000 title claims description 49
- 239000012778 molding material Substances 0.000 title claims description 39
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 35
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 239000004014 plasticizer Substances 0.000 claims description 5
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000004640 Melamine resin Substances 0.000 claims 1
- 229920001807 Urea-formaldehyde Polymers 0.000 claims 1
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 239000000155 melt Substances 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- -1 curing accelerator Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 この発明は熱硬化性樹脂成形材料に関するものである。[Detailed description of the invention] This invention relates to a thermosetting resin molding material.
一般に、熱硬化性樹脂成形材料は、熱可塑性樹脂成形材
料に比べて、耐熱性、例えば熱時の機械強度等が優れて
いるため、その特徴を生かした用途に広く用いられてい
る。ところで、最近は、熱硬化性樹脂成形材料を、熱可
塑性樹脂成形材料と同様に射出成形により成形して成形
の自動化、省力化を図ることが行われている。このよう
に射出成形を行うためには、成形材料が、射出成形機の
シリンダ中において容易に軟化して溶けがよく、かつ化
学変化（硬化反応）を起こさずシリンダ安定性に優れ、
しかも金型内においてその金型温度における粘度が適正
であつて充填性がよいことが要求される。一般に、熱硬
化性樹脂成形材料は、硬化反応を伴うため、シリンダ内
で硬化しないように、シリンダの温度を下げた状態で射
出成形される。しかしながら、このようにシリンダの温
度を下げると成形材料の溶けが悪くなる。これを回）避
するには、軟化点の低い熱硬化性樹脂を使用する必要が
ある。しかし、軟化点の低い樹脂は、通常低分子量であ
り、溶融時の粘度が小さい。したがつて、これを用いた
成形材料は、金型内においてその金型温度における粘度
が小さく、充填性が悪いため、成形時にバリの発生が多
くなつたり、いわゆるひけが生じたりする。この充填性
を向上させるには、成形材料の金型温度における粘度を
高くする必要があり、そのような粘度の高い樹脂を用い
る必要が生じる。しかしながら、通常、そのような粘度
の高い樹脂は、軟化点が高く、高分子量であり、これを
用いると成形材料のシリンダ内における溶けが悪くなる
ため、シリンダ温度を高める必要が生ずる。ところがそ
のようにすると、今度はシリンダ内において硬化反応が
起こつてしまいシリンダ安定性が損なわれるという問題
が生じるのである。このように、従来は、溶けがよく、
低温での成形ができてシリンダ安定性がよく、しかも充
填性の優れている熱硬化性樹脂成形材料は得られていな
かつた。この発明者らは、このような問題を全て解消し
、溶けがよく、低温での成形ができてシリンダ安定性が
よく、しかも充填性のよい熱硬化性樹脂成形材料を得る
ために研究を重ねた結果、軟化点が高く、かつ溶融時の
粘度が高い熱硬化性樹脂を成形材料用樹脂として用い、
かつこのような樹脂を用いた成形材料に、可塑剤として
下記の一般式（式中Ｍ，ｎはそれぞれ１〜１０の整数、
ｘは５〜１０の整数を示す）て表わされるオリゴマーを
含有させると、目的とする熱硬化性樹脂成形材料が得ら
れることを見いた七、この発明を完成した。In general, thermosetting resin molding materials have better heat resistance, such as mechanical strength under heat, than thermoplastic resin molding materials, and are therefore widely used in applications that take advantage of these characteristics. Incidentally, recently, thermosetting resin molding materials have been molded by injection molding in the same manner as thermoplastic resin molding materials in order to automate molding and save labor. In order to perform injection molding in this way, the molding material must be easily softened and melted in the cylinder of the injection molding machine, and must have excellent cylinder stability without causing chemical changes (hardening reactions).
Moreover, it is required that the viscosity within the mold at the mold temperature be appropriate and that the filling properties be good. In general, thermosetting resin molding materials involve a curing reaction, so they are injection molded in a state where the temperature of the cylinder is lowered so as not to harden within the cylinder. However, when the temperature of the cylinder is lowered in this way, the melting of the molding material becomes worse. To avoid this, it is necessary to use a thermosetting resin with a low softening point. However, resins with low softening points usually have low molecular weights and low viscosity when melted. Therefore, a molding material using this material has a low viscosity in a mold at the temperature of the mold, and has poor filling properties, resulting in increased occurrence of burrs or so-called sink marks during molding. In order to improve this filling property, it is necessary to increase the viscosity of the molding material at the mold temperature, and it is necessary to use a resin with such high viscosity. However, such highly viscous resins usually have a high softening point and a high molecular weight, and when used, the molding material becomes difficult to melt in the cylinder, making it necessary to raise the cylinder temperature. However, if this is done, a curing reaction will occur within the cylinder, resulting in a problem that the stability of the cylinder will be impaired. In this way, conventionally, it melts well,
A thermosetting resin molding material that can be molded at low temperatures, has good cylinder stability, and has excellent filling properties has not yet been obtained. The inventors have conducted extensive research in order to solve all of these problems and obtain a thermosetting resin molding material that melts well, can be molded at low temperatures, has good cylinder stability, and has good filling properties. As a result, a thermosetting resin with a high softening point and high viscosity when melted was used as a molding material resin,
In addition, the following general formula (where M and n are each an integer of 1 to 10,
This invention was completed after discovering that the desired thermosetting resin molding material could be obtained by incorporating an oligomer represented by (x represents an integer from 5 to 10).
すなわち、この発明は、軟化点が高く、かつ溶融時の粘
度が高い熱硬化性樹脂が用いられている熱硬化性樹脂成
形材料であつて、可塑剤として上記の一般式で表わされ
るオリゴマーを含有していることを特徴とする熱硬化性
樹脂成形材料をその要旨とするものてある。That is, the present invention provides a thermosetting resin molding material using a thermosetting resin having a high softening point and high viscosity when melted, and which contains an oligomer represented by the above general formula as a plasticizer. The gist of this article is a thermosetting resin molding material characterized by:
つぎに、この発明を詳しく説明する。Next, this invention will be explained in detail.
この発明は、軟化点が高く、溶融時の粘度（溶融粘度）
が高い熱硬化性樹脂が用いられている熱硬化性樹脂成形
材料を対象とする。This invention has a high softening point and a viscosity at the time of melting (melt viscosity).
Targets thermosetting resin molding materials that use thermosetting resins with high
すなわち、このような樹脂を用いた成形材料は、金型内
における流動粘度が大きく充填性に富んでいる。そのよ
うな樹脂として、例えば、軟化点および溶融粘度が高い
フェノール樹脂、メラミン樹脂、エリヤ樹脂があげられ
る。しかしながら、そのような樹脂を用いた成形材料は
、充填性には富んでいるものの溶けおよびシリンダ安定
性が悪い。そこで、この発明は、そのような樹脂が用い
られている熱硬化性樹脂成形材料に、上記の一般式で示
されるオリゴマーを可塑剤として含有させることにより
、そのような樹脂が用いられている成形材料の溶融温度
を下げ、それによつてそのような樹脂が用いられている
熱硬化性樹脂成形材料の溶けを向上させ、低温において
成形できるようにしてシリング安定性を向上させるよう
にするものてある。すなわち、このようにして得られた
成形材料は、溶けがよく、低温において成形できるため
にシリンダ安定性がよく、しかも充填性にも富んでいる
ため極めて有用なものである。可塑剤として用いられる
上記の一般式をもつオリゴマーは、ナイロン系のもので
あり、熱硬化性樹脂、特にフェノール樹脂との相溶性が
よい。That is, a molding material using such a resin has a high flow viscosity in a mold and is highly filling. Examples of such resins include phenol resins, melamine resins, and Elijah resins that have high softening points and high melt viscosity. However, although molding materials using such resins have good filling properties, they have poor melting and cylinder stability. Therefore, the present invention provides a thermosetting resin molding material in which such a resin is used, by containing an oligomer represented by the above general formula as a plasticizer. It lowers the melting temperature of the material, thereby improving the melting of thermosetting resin molding materials in which such resins are used, allowing them to be molded at lower temperatures and improving their shilling stability. . That is, the molding material thus obtained is extremely useful because it melts well, can be molded at low temperatures, has good cylinder stability, and has excellent filling properties. The oligomer having the above general formula used as a plasticizer is nylon-based and has good compatibility with thermosetting resins, especially phenolic resins.
この発明者らは、各種の化合物（ナイロン系のものも含
めて）について検討を加えた結果、特に、上記の一般式
をもつオリゴマーがフェノール樹脂のような熱硬化性樹
脂との相溶性がよく、かつフェノール樹脂のような熱硬
化性樹脂と加熱混練することによりフェノール樹脂のよ
うな熱硬化性樹脂の軟化点を低下させることを見いだし
たものである。そして、この効果は、成形材料化した場
合においても同様に発揮するのである。このオリゴマー
は、通常ホットメルト接着剤として市販されており、常
温において固体（軟化点１００℃前後）である。したが
つて、使用の際に粉砕して用いることが好ましいのであ
る。このようなオリゴマーの使用量は、オリゴマーが、
成形材料中に、０．１〜５．鍾量％含有されるように選
ぶことが必要である。As a result of studying various compounds (including nylon-based compounds), the inventors found that oligomers having the above general formula have particularly good compatibility with thermosetting resins such as phenolic resins. , and it has been discovered that the softening point of a thermosetting resin such as a phenolic resin can be lowered by heating and kneading it with a thermosetting resin such as a phenolic resin. This effect is similarly exhibited when it is made into a molding material. This oligomer is usually commercially available as a hot melt adhesive, and is solid at room temperature (softening point around 100° C.). Therefore, it is preferable to crush it before use. The amount of such oligomer used is
In the molding material, 0.1 to 5. It is necessary to select so that the content is %.
すなわち、オリゴマーの使用量が、上記の範囲を下まわ
ると可塑化効果か小さくなり、逆に上まわると可塑化効
果は大きくなるもののそれを用いて得られた成形品の性
能、特に熱時の機械強度を低下させる傾向があるからで
ある。このようなオリゴマーを成形材料中に含有させる
には、成形材料用の各原料（樹脂、硬化剤、硬化促進剤
、充填剤、顔料等）を配合し混合する際にオリゴマーを
添加して混合したり、各原料の混合物を加熱ロールまた
はニーグ等で混練する際に、オリゴマーを添加したりす
ることが行われる。In other words, if the amount of oligomer used is below the above range, the plasticizing effect will be small, and if it is above the above range, the plasticizing effect will be large, but the performance of the molded product obtained using it will be affected, especially when heated. This is because it tends to reduce mechanical strength. In order to incorporate such oligomers into the molding material, the oligomers are added and mixed when the raw materials for the molding material (resin, curing agent, curing accelerator, filler, pigment, etc.) are blended and mixed. Alternatively, oligomers may be added when kneading the mixture of raw materials using heated rolls, kneads, or the like.
このようにして得られた熱硬化性樹脂成形材料は、溶融
時の粘度が高い熱硬化性樹脂が用いられているため、流
動粘度が高く成形時に圧力を加えてもバリとして金型か
ら逃げすに充填性がよい。The thermosetting resin molding material obtained in this way uses a thermosetting resin that has a high viscosity when melted, so it has a high flow viscosity and does not escape from the mold as burrs even if pressure is applied during molding. Good filling properties.
しかも、オリゴマー可塑剤により、成形材料の溶Ｍ融温
度がひき下げられているため、シリング内での材料の溶
けがよくシリンダ安定性も良好である。つぎに、実施例
について比較例と併せて説明する。Moreover, since the melting temperature of the molding material is lowered by the oligomer plasticizer, the material melts well within the cylinder and the cylinder stability is also good. Next, examples will be described together with comparative examples.
〔実施例１〕
熱硬化性樹脂として、平均分子量９００、遊離フェノー
ル５重量％を含むフェノール樹脂を用い、これに下記の
原料を下記のように配合した。[Example 1] A phenol resin having an average molecular weight of 900 and containing 5% by weight of free phenol was used as a thermosetting resin, and the following raw materials were blended therein as follows.
フェノール樹脂 旬重量部木 粉５３〃 ヘキサミン６ 〃 ステアリン酸亜鉛１ 〃 つぎに、上記の配合物を混合機に入れて混合した。Phenolic resin Shunkaibeki powder 53 Hexamine 6 Zinc stearate 1 Next, the above formulation was placed in a mixer and mixed.
このとき、その混合機中に、平均組成が、で表わされる
オリゴマーを１重量部添加して充分混合した。ついで、
得られた混合物を、加熱ロールて混練し冷却したのち、
粉砕機を用いて粉砕して熱硬化性樹脂成形材料を得た。
〔実施例２〕
実施例１で用いたオリゴマーに代えて下記の組成をもつ
オリゴマーを１重量部使用した。At this time, 1 part by weight of an oligomer having an average composition represented by was added to the mixer and thoroughly mixed. Then,
The resulting mixture was kneaded with heated rolls and cooled, then
The mixture was crushed using a crusher to obtain a thermosetting resin molding material.
[Example 2] In place of the oligomer used in Example 1, 1 part by weight of an oligomer having the following composition was used.
それ以外は実施例１と同様にして熱硬化性樹脂成形材料
を得た。A thermosetting resin molding material was obtained in the same manner as in Example 1 except for the above.
〔実施例３〕
オリゴマーの添加量を、オリゴマーが全体中の０．５重
量％になるようにした。[Example 3] The amount of oligomer added was set to 0.5% by weight based on the total amount.
それ以外は実施例１と同様にして熱硬化性樹脂成形材料
を得た。〔実施例４〕オリゴマーの添加量を、オリゴマ
ーが全体中の５重量％になるようにした。A thermosetting resin molding material was obtained in the same manner as in Example 1 except for the above. [Example 4] The amount of oligomer added was 5% by weight based on the total weight.
それ以外は実施例１と同様にして熱硬化性樹脂成形材料
を得た。〔比較例１〕オリゴマーの添加を中止した。A thermosetting resin molding material was obtained in the same manner as in Example 1 except for the above. [Comparative Example 1] Addition of oligomer was discontinued.
それ以外は実施例１と同様にして熱硬化性樹脂成形材料
を得た。〔比較例２〕熱硬化性樹脂として、平均分子量
４５０）軟化点８０’Ｃの樹脂を用いた。A thermosetting resin molding material was obtained in the same manner as in Example 1 except for the above. [Comparative Example 2] A resin having an average molecular weight of 450 and a softening point of 80'C was used as the thermosetting resin.
それ以外は比較例１（使用樹脂：平均分子量９０仄遊離
フェノール５重量％含有）と同様にして熱硬化性樹脂成
形材料を得た。以上の実施例および比較例で得られた熱
硬化性樹脂成形材料の性能を試験し、その結果を次表に
示した。Otherwise, a thermosetting resin molding material was obtained in the same manner as in Comparative Example 1 (resin used: average molecular weight 90, containing 5% by weight of free phenol). The performance of the thermosetting resin molding materials obtained in the above Examples and Comparative Examples was tested, and the results are shown in the following table.
Claims (1)
樹脂、メラミン樹脂、ユリヤ樹脂またはこれらのブレン
ド樹脂が熱硬化性樹脂として用いられている熱硬化性樹
脂成形材料であつて、可塑剤として、下記の一般式▲数
式、化学式、表等があります▼ （式中ｍ、ｎはそれぞれ１〜１０の整数、ｘは５〜１０
の整数を示す）であられされるオリゴマ−を０．１〜５
．０重量％含有していることを特徴とする熱硬化性樹脂
成形材料。[Scope of Claims] 1 A thermosetting resin molding material in which a phenol resin, melamine resin, urea resin, or a blend resin thereof, which has a high softening point and high viscosity when melted, is used as a thermosetting resin. As a plasticizer, there are the following general formulas ▲ mathematical formulas, chemical formulas, tables, etc. ▼ (In the formula, m and n are each integers from 1 to 10, and
(representing an integer of 0.1 to 5)
．． A thermosetting resin molding material characterized by containing 0% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5667079A JPS6045663B2 (en) | 1979-05-08 | 1979-05-08 | Thermosetting resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5667079A JPS6045663B2 (en) | 1979-05-08 | 1979-05-08 | Thermosetting resin molding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55147556A JPS55147556A (en) | 1980-11-17 |
| JPS6045663B2 true JPS6045663B2 (en) | 1985-10-11 |
Family
ID=13033846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5667079A Expired JPS6045663B2 (en) | 1979-05-08 | 1979-05-08 | Thermosetting resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6045663B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003042250A (en) * | 2001-08-01 | 2003-02-13 | Mitsubishi Agricult Mach Co Ltd | Belt transmitting structure |
-
1979
- 1979-05-08 JP JP5667079A patent/JPS6045663B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55147556A (en) | 1980-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01146958A (en) | Thermoplastic resin composition | |
| JPS591422B2 (en) | Polyphenylene sulfide resin composition | |
| JPS6045663B2 (en) | Thermosetting resin molding material | |
| US5571854A (en) | Phenolic resin molding material including a crystalline phenolic compound having plural hydroxyphenyl groups and a compound having plural hydroxyl groups in a benzene ring | |
| JPS5953301B2 (en) | Thermosetting resin molding material | |
| JPH09174548A (en) | Phenol resin molding material and production thereof | |
| JPH07113035A (en) | Phenolic resin molding material | |
| JP3792094B2 (en) | Molding | |
| JPH0276708A (en) | Manufacture of phenolic molding material | |
| JPH07278409A (en) | Phenolic resin molding material | |
| JPH0463858A (en) | Phenolic resin molding material | |
| JPH06322239A (en) | Phenol resin molding material and its molded article | |
| JPH11323080A (en) | Production of phenolic resin composition | |
| JP3152924B2 (en) | Melamine / phenol resin composition | |
| JPH0517673A (en) | Thermoplastic resin composition | |
| JPH0625509A (en) | Phenol resin molding material for low-pressure molding | |
| JPS62192453A (en) | Unsaturated polyester resin molding material | |
| JPH03131057A (en) | Semiconductor device | |
| JPH09169029A (en) | Phenol resin molding material and production thereof | |
| JPS6228980B2 (en) | ||
| JPH0657098A (en) | Phenol resin molding material for low-pressure molding | |
| JPH0925390A (en) | Phenol resin molding material | |
| JP2771457B2 (en) | Injection molding method of phenolic resin molding material | |
| JPS61171758A (en) | Production of phenolic resin composition | |
| JP2755902B2 (en) | Injection molding method of phenolic resin molding material |