JPS6047314B2 - Binder composition for paste - Google Patents
Binder composition for pasteInfo
- Publication number
- JPS6047314B2 JPS6047314B2 JP57154496A JP15449682A JPS6047314B2 JP S6047314 B2 JPS6047314 B2 JP S6047314B2 JP 57154496 A JP57154496 A JP 57154496A JP 15449682 A JP15449682 A JP 15449682A JP S6047314 B2 JPS6047314 B2 JP S6047314B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- binder
- added
- polyvinyl butyral
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】
(1)発明の技術分野
本発明は多層セラミック基板又は多層セラミックコンデ
ンサ等の多層構造物を形成するペーストを製造する際に
用いるバインダー系組成に関するものてある。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a binder composition used in producing a paste for forming a multilayer structure such as a multilayer ceramic substrate or a multilayer ceramic capacitor.
(2)技術の背景
従来より誘電体層および導体層をスクリーン印刷により
形成し、印刷乾燥を繰り返すことによつて多層化を行な
つた後、焼成する印刷多層法によつてセラミック多層基
板、多層セラミックコンデンサを得る方法がある。(2) Background of the technology Traditionally, dielectric layers and conductor layers are formed by screen printing, multilayered by repeated printing and drying, and then fired. There is a way to obtain ceramic capacitors.
この方法における誘電体および導体ペーストには下記の
ような性質が要求される。1 乾燥時に割れが発生せず
、印刷時に用いた台(例えば枠にはつたアルミ箔)より
取りはずしたときに適当な柔軟性を有し取扱易いこと。The dielectric and conductor pastes used in this method are required to have the following properties. 1. It should not crack when drying, and should have appropriate flexibility and be easy to handle when removed from the stand used for printing (for example, an aluminum foil frame).
2 乾燥時にピンホールが発生しないこと。2. No pinholes should occur during drying.
3 乾燥が速く、かつ印刷時に粘度が変化しにくいこと
。3. It dries quickly and the viscosity does not easily change during printing.
4 レベリング性がよいこと。4. Good leveling properties.
一般に厚膜用ペーストの結合剤にはエチルセルロース、
ニトロセルロースなどが用いられているがこれらの結合
剤だけでは上記性質を得ることはできない。Generally, ethyl cellulose is used as a binder for thick film pastes.
Although nitrocellulose and the like are used, the above properties cannot be obtained with these binders alone.
このため上記性質を有する結合剤が要求されている。(
3)発明の目的
本発明は上記要求の基づいて、ペーストに加えたとき印
刷のレベリング性が良好で、乾燥時に割れ、ピンホール
等が発生せず、且つ適当な柔軟性があるようなバインダ
ー系組成を提供することを目的とするものである。Therefore, a binder having the above-mentioned properties is required. (
3) Purpose of the Invention Based on the above requirements, the present invention provides a binder system that, when added to a paste, has good leveling properties in printing, does not cause cracks or pinholes when drying, and has appropriate flexibility. The purpose is to provide a composition.
(4)発明の構成
そしてこの目的は本発明によればエチルセルロース、ポ
リビニルブチラール、フタル酸−n−ジブチルよりなる
結合剤に分散剤としてポリオキシエチレンアルキルアミ
ン界面活性剤を加え、溶剤としてテルピネオールを加え
たペースト用バインダー系において前記結合剤はエチル
セルロース60〜75重量%、ポリビニルブチラール5
〜17.5重量%、フタル酸−n−ジブチル10〜3鍾
量%よりなることを特徴とするペースト用バインダー系
組成を提供することによつて達成される。(4) Structure and object of the invention According to the present invention, a polyoxyethylene alkylamine surfactant is added as a dispersant to a binder consisting of ethyl cellulose, polyvinyl butyral, and n-dibutyl phthalate, and terpineol is added as a solvent. In the binder system for paste, the binder contains 60 to 75% by weight of ethyl cellulose and 5% by weight of polyvinyl butyral.
This is achieved by providing a binder system composition for a paste characterized by comprising ~17.5% by weight of n-dibutyl phthalate and 10-3% by weight.
(5)発明の実施例 以下本発明実施例について詳細に説明する。(5) Examples of the invention Examples of the present invention will be described in detail below.
実施例1誘電体粉末としてBaTiO3(平均粒径1.
3μm)、電極粉末としてPd(平均粒径0.9μm)
を用い第1表に示すA上のバインダー系により誘電体ペ
ーストを作成した。Example 1 Dielectric powder was BaTiO3 (average particle size 1.
3 μm), Pd as electrode powder (average particle size 0.9 μm)
A dielectric paste was prepared using the binder system A shown in Table 1.
ただし結合剤のy数は原料粉末100y当りの添加量で
あり、(%)は結合剤全量に対する各成分の割合である
。またPdペーストのバインダ系添加量は誘電体ペース
トのそれの0.咋とした。またテルピネオールの添加量
は結合剤の種類により異なる。この添加はペーストの粘
度が50000CpS(於27℃)になるように調節し
た。However, the y number of the binder is the amount added per 100 y of raw material powder, and (%) is the ratio of each component to the total amount of the binder. Furthermore, the amount of binder added to the Pd paste is 0.0% of that of the dielectric paste. It was like that. Further, the amount of terpineol added varies depending on the type of binder. This addition was adjusted so that the viscosity of the paste was 50,000 CpS (at 27°C).
なおエチルセルロース、ポリビニルブチラールは高分子
であるため分子量に特性よりが変化する。Note that since ethyl cellulose and polyvinyl butyral are polymers, their molecular weights and properties vary.
ここではエタノール/トルエンニ1ハの10%溶液の粘
度が30〜6CCpSのものを用いた。上記ペーストを
用いてアルミ箔上に誘電体ペーストを印刷しその上に導
体のPdペーストと厚さ25pm(7)誘電体ペースト
とを交互に10層印刷したのち120゜Cで6分間乾燥
を行なつた。その結果は第2表の如くであつた。即ち試
料Aは誘電体層にピンホールが発生し、試料Eは取扱性
が悪く且つ導体が移動し位置ずれを生じたが、本発明の
特許請求範囲内の組成のバインダー系を用いた試料B,
C,Dは何ら問題は生じなかつた。Here, a 10% ethanol/toluene solution having a viscosity of 30 to 6 CCpS was used. Using the above paste, print dielectric paste on aluminum foil, then alternately print 10 layers of conductive Pd paste and 25 pm thick (7) dielectric paste on top of that, and then dry at 120°C for 6 minutes. Summer. The results were as shown in Table 2. That is, sample A had pinholes in the dielectric layer, sample E was difficult to handle, and the conductor moved and misaligned, but sample B used a binder system with a composition within the scope of the claims of the present invention. ,
No problems occurred with C and D.
なお、ポリビニルブチラール樹脂およびフタル酸−n−
ジブチルは主結合剤であるエチルセルロースの性質を改
善するもので、ともに割れの防止および取扱い性の向上
のために添加しているものであるが、ポリビニルブチラ
ールが5%より少ない場合は割れが発生し易くなる。In addition, polyvinyl butyral resin and phthalic acid-n-
Dibutyl improves the properties of ethylcellulose, which is the main binder, and is added to prevent cracking and improve handling. However, if polyvinyl butyral is less than 5%, cracking will occur. It becomes easier.
フタル酸−n−ジブチルが10%より少ない場合は柔軟
性がなくなり取扱性が悪くなり、35%より多い場合は
乾燥速度が遅くなる。また結合剤の添加量が原料粉末1
00y当り17yより少ない場合は割れが発生し易くな
り、35yより多い場合は乾燥速度が遅くなり、また焼
成収縮率が大きくなり過ぎる。乾燥速度が遅くなると同
一乾燥条件で多層化を行なつた場合、導体すれ発生する
可能性か大きくなる。実施例2第1表の試料cのバイン
ダー系をBaTiO3lOOy゛に対して0.6,0.
8,1.2,1.4倍添加した誘電体ペーストを作成し
導体ペーストPdlOOyに対し試料cのバインダー系
を0.9倍添加したものを用いて、前実施例と同様に多
層化を行なつた。If n-dibutyl phthalate is less than 10%, flexibility will be lost and handling will be poor, and if it is more than 35%, the drying rate will be slow. Also, the amount of binder added is 1 part of the raw material powder.
When it is less than 17y per 00y, cracks are likely to occur, and when it is more than 35y, the drying rate becomes slow and the firing shrinkage rate becomes too large. As the drying speed becomes slower, there is a greater possibility that conductor rubbing will occur when multiple layers are formed under the same drying conditions. Example 2 The binder system of sample c in Table 1 was adjusted to 0.6,0.
Dielectric pastes containing 8, 1.2, and 1.4 times the amount of the binder system of sample c were added to the conductor paste PdlOOy by 0.9 times, and multilayering was performed in the same manner as in the previous example. Summer.
その結果0.皓の場合は多層化中に割れが発生し、1.
4倍の場合は導体の位置ずれが発生したが、他は問題が
発生しなかつた。上記の実施例1,2で多層化上問題が
生じなかつたものをバーンアウト後、1350℃で焼成
した結果、目的とする多層構造物が得られた。The result is 0. In the case of Hao, cracks occurred during multilayering, and 1.
In the case of 4 times as much, misalignment of the conductor occurred, but no problem occurred in the other cases. As a result of burning out the samples in Examples 1 and 2 that did not cause any problem in multilayer structure and firing them at 1350° C., the desired multilayer structure was obtained.
この時の”焼成収縮率は20〜25%であつた。実施例
3
実施例1,2では溶剤としてテルピネオールを用いてい
るがテルピネオールの代りにブチルカルビトール、ブチ
ルカルビトールアセテートなどのカルビトール、カルビ
トールアセテート類の溶剤を用いても多層化に問題は生
じなかつた。The firing shrinkage rate at this time was 20 to 25%.Example 3 In Examples 1 and 2, terpineol was used as the solvent, but instead of terpineol, carbitol such as butyl carbitol or butyl carbitol acetate, etc. Even when carbitol acetate solvents were used, no problem occurred in multilayering.
(6)発明の効果
以上詳細に説明したように本発明のペースト用バインダ
ー系組成は、セラミックペーストの取扱性を良好となし
、且つピンホール、割れ等の発生がなく、印刷多層法に
よる多層セラミック基板、多層セラミックコンデンサを
歩留りよく製造することができ、且つ誘電体のピンホー
ルを皆無にすることができるため信頼性も向上されると
いつた効果大なるものである。(6) Effects of the Invention As explained in detail above, the binder composition for paste of the present invention makes the ceramic paste easy to handle, does not cause pinholes, cracks, etc. The substrate and the multilayer ceramic capacitor can be manufactured with high yield, and since pinholes in the dielectric can be completely eliminated, reliability is improved, which is a great effect.
Claims (1)
酸−n−ジブチルよりなる結合剤に分散剤、としてポリ
オキシエチレンアルキルアミン界面活性剤を加え、溶剤
としてテルピネオールを加えたペースト用バインダー系
において、前記結合剤はエチルセルロース60〜75重
量%、ポリビニルブチラール5〜17.5重量%、フタ
ル酸−n−ジブチル10〜30重量%よりなることを特
徴とするペースト用バインダー系組成。1. In a paste binder system in which a polyoxyethylene alkylamine surfactant is added as a dispersant to a binder consisting of ethyl cellulose, polyvinyl butyral, and n-dibutyl phthalate, and terpineol is added as a solvent, the binder is ethyl cellulose 60. 75% by weight of polyvinyl butyral, 5-17.5% by weight of polyvinyl butyral, and 10-30% by weight of n-dibutyl phthalate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57154496A JPS6047314B2 (en) | 1982-09-07 | 1982-09-07 | Binder composition for paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57154496A JPS6047314B2 (en) | 1982-09-07 | 1982-09-07 | Binder composition for paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5945373A JPS5945373A (en) | 1984-03-14 |
| JPS6047314B2 true JPS6047314B2 (en) | 1985-10-21 |
Family
ID=15585512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57154496A Expired JPS6047314B2 (en) | 1982-09-07 | 1982-09-07 | Binder composition for paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6047314B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015107811A1 (en) * | 2014-01-17 | 2015-07-23 | 昭栄化学工業株式会社 | Method for producing binder resin, method for producing resin composition, binder resin, and resin composition |
| KR101847362B1 (en) | 2015-07-22 | 2018-04-09 | 소에이 가가쿠 고교 가부시키가이샤 | Binder resin for inorganic particle-dispersed pastes and inorganic particle-dispersed paste |
| JP7119454B2 (en) * | 2018-03-16 | 2022-08-17 | 住友金属鉱山株式会社 | Method for producing organic vehicle and method for producing conductive paste |
-
1982
- 1982-09-07 JP JP57154496A patent/JPS6047314B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5945373A (en) | 1984-03-14 |
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