JPS6047342U - solid state relay - Google Patents
solid state relayInfo
- Publication number
- JPS6047342U JPS6047342U JP14001683U JP14001683U JPS6047342U JP S6047342 U JPS6047342 U JP S6047342U JP 14001683 U JP14001683 U JP 14001683U JP 14001683 U JP14001683 U JP 14001683U JP S6047342 U JPS6047342 U JP S6047342U
- Authority
- JP
- Japan
- Prior art keywords
- solid state
- state relay
- element circuit
- circuit section
- main element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thyristor Switches And Gates (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のＳＳＲの半導体主素子回路の回路図、第
２図は従来の凹部を密封したＳＳＲの断面図、第３図は
従来の凹部を密封していないＳＳＲの断面図、第４図ａ
は本考案の一実施例による ＳＳＲの断面図、第４
図す、 ｃはそのふたの空気抜礼、溶栓部分を示す拡大
断面図、第４図ｄはそ、のふたの取付溝部部分を示す拡
大断面図で坐る。Figure 1 is a circuit diagram of the semiconductor main element circuit of a conventional SSR, Figure 2 is a cross-sectional view of a conventional SSR with a sealed recess, Figure 3 is a cross-sectional view of a conventional SSR with an unsealed recess, and Figure 4 is a cross-sectional view of a conventional SSR with an unsealed recess. Diagram a
is a cross-sectional view of an SSR according to an embodiment of the present invention, No. 4
Figure 4c is an enlarged sectional view showing the air vent and fusible plug part of the lid, and Figure 4d is an enlarged sectional view showing the mounting groove part of the lid.
Claims (1)
を備えたソリッドステートリレーであって、上記半導体
主素子回路部はソリッドステートリレ一本体ケースの下
面に固着されたベース板上に固着され、上記ソリッドス
テートリレ一本体ケースとベース板とで形成される凹部
には上記半導体主素子回路部を封入する封入樹脂が充填
され、該封入樹脂層の上方には上記凹部を該封入樹脂層
上面との間に空気層を介して密封するふたが設けられて
いることを特徴とするソリッドステートリレー。A solid state relay equipped with a semiconductor main element circuit section that directly connects the supply of AC power to a load, wherein the semiconductor main element circuit section is fixed on a base plate fixed to the bottom surface of the solid state relay main body case. The recess formed by the solid state relay main body case and the base plate is filled with an encapsulating resin for encapsulating the semiconductor main element circuit section, and the recess is filled with the encapsulating resin layer above the encapsulating resin layer. A solid state relay characterized by a lid that is sealed with an air layer between it and the top surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14001683U JPS6047342U (en) | 1983-09-08 | 1983-09-08 | solid state relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14001683U JPS6047342U (en) | 1983-09-08 | 1983-09-08 | solid state relay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6047342U true JPS6047342U (en) | 1985-04-03 |
Family
ID=30313635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14001683U Pending JPS6047342U (en) | 1983-09-08 | 1983-09-08 | solid state relay |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6047342U (en) |
-
1983
- 1983-09-08 JP JP14001683U patent/JPS6047342U/en active Pending
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