JPS6049587B2 - Manufacturing method for laminated ceramic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for manufacturing a multilayer ceramic component, mainly a multilayer ceramic capacitor.

Generally, this type of multilayer ceramic capacitor is manufactured, for example, in the following manner.

That is, first, a ceramic sheet (layer) having a predetermined thickness is formed from a mixed member containing ceramic powder, a binder, and a solvent by a doctor blade method, and then punched into a predetermined size. On this ceramic punched sheet, an electrode layer is formed by printing a mixed member containing, for example, palladium powder, a binder, and a solvent to a predetermined thickness. Then, a plurality of sheets with electrode layers are stacked so that the electrode layers are alternated. Next, on these upper and lower surfaces,
A protective layer made of green sheets, which is set to be sufficiently thicker than the ceramic layer, is laminated and integrated by hot pressing to form a laminate. Next, the laminate is fixed to the substrate using an adhesive applied to the entire surface of one of the protective layers, and the laminate is cut into a predetermined size. Next, the capacitor element formed by cutting is peeled off from the substrate. Thereafter, the capacitor element is manufactured by sintering the capacitor element and forming an electrode lead layer on the exposed end surface of the electrode. By the way, before cutting the laminate to the predetermined dimensions, the laminate is fixed to the substrate using adhesive as described above, so there is no displacement during the cutting operation, and the desired dimensions are ensured. It can be cut into

However, after cutting, all capacitor elements are fixed to the board with adhesive, so
Peeling from the substrate becomes extremely troublesome, and workability is significantly impaired.

In particular, if adhesive remains on the capacitor elements, the capacitor elements tend to adhere to each other, which not only makes handling difficult, but also requires the temperature of the capacitor elements themselves to be heated during the part-out operation in the sintering process. Because of this increase, there is a drawback that peeling occurs between the electrode layer and the ceramic layer, resulting in a significant loss of moisture resistance. In view of these points, the present invention provides a method for manufacturing a laminated ceramic component that can prevent misalignment during cutting of the laminate and also allows the component to be easily separated from the substrate without any adhesive remaining thereon. An example suitable for laminated ceramic capacitors will be explained below.

First, as shown in Figures 1 and 2, ceramic powder,
A ceramic sheet (layer) 1 having a predetermined thickness is formed from a mixed material containing a binder, a plasticizer, a dispersant, and a solvent by a doctor blade method, and after drying, it is punched into a predetermined size.

On this ceramic punched sheet 1, palladium powder,
The electrode layer 2 is formed by printing a mixed material containing a binder and a solvent to a predetermined thickness, and is dried with hot air or the like. Note that the electrode layer 2 is formed on the ceramic sheet 1 so that a margin (corresponding to an ear portion to be described later) is formed at the outer peripheral portion. Thereafter, a plurality of sheets with electrodes are stacked so that the electrode layers are alternated.
Then, protective layers 3 and 4 made of green sheets are laminated on these upper and lower surfaces, and the protective layers, electrode layers, and ceramic layers are integrated by hot pressing to form a laminate 5. Incidentally, a cutting line 6 for cutting the laminate 5 is printed on the upper surface of the protective layer 4, and an ear portion 7 on which the electrode layer is not formed is formed on the outer periphery of the cutting line 6 at the outermost periphery. ing. Next, adhesive 8 is applied only to the ears 7 of the protective layer 3 of this laminate 5, and the laminate 5 is fixed to the first substrate 9, and the first substrate 9 is attached to the second substrate 10. Fixed to. Note that, although a resin film is suitable for the first substrate 9, the second substrate 10 can also be used instead. Next, as shown in FIG. 3, the capacitor element 11 is formed by cutting the laminate 5 vertically and horizontally along the cutting lines 6 using a cutter. Next, as shown in FIG. 4, the second substrate 10 is reversed so that the laminate 5 is on the bottom! Therefore, the capacitor element 11 surrounded by the ears 7 easily falls away from the first substrate 9. After that, the capacitor element 11 is sintered, and electrode lead layers 12 and 1 are formed on the exposed end surface of the electrode layer 2.
By forming 2, a multilayer ceramic capacitor shown in FIG. 5 is obtained. In this way, the first
is fixed to the substrate 9 by the adhesive 8 applied only to the ears 7. Therefore, when the cutting is completed, the ears 7 are fixed to the substrate 9.
The capacitor element 11 except for the capacitor element 11 is in a free state with respect to the first substrate 9.

Therefore, by inverting the second substrate 10, for example, the capacitor element 11 can be separated from the first substrate 9 very efficiently. Moreover, since the adhesive 8 is not applied at all to the protective layer 3 constituting a part of the capacitor element 11, no adhesive remains after cutting and separation.

Therefore, during the burnout operation in the sintering process of the capacitor element 11, an abnormal temperature rise of the capacitor element itself due to "abnormal heat generation of the adhesive" does not occur at all, but is caused by peeling between the ceramic layer 1 and the electrode layer 2. Furthermore, since the laminate 5 is adhesively fixed to the first substrate 9 using the ears 1, the ears 7 are also cut when it is cut. , which is itself fixed, acts as a stopper for the capacitor element 11.For this reason, it is possible to prevent the position from shifting during cutting, and it is possible to reliably cut the desired portion. For example, the multilayer ceramic component can be applied not only to a multilayer ceramic capacitor but also to a varistor, etc., without being limited to the above embodiments.

Further, the protective layer and the ceramic layer can also be formed by a printing method. As described above, according to the present invention, it is possible to reliably prevent positional misalignment when cutting a laminate, and also to easily separate components from the substrate without leaving any adhesive, and to remove the electrode layer from the ceramic during the burnout process. The occurrence of peeling from the layer can be effectively suppressed.

[Brief explanation of the drawing]

The figures are explanatory diagrams of the method of the present invention, in which Fig. 1 is a plan view showing a state in which the laminate is fixed to a substrate, Fig. 2 is a side sectional view of Fig. 1, and Fig. 3 is a cutaway of the laminate. FIG. 4 is a plan view showing the state in which the capacitor element is separated, and FIG. 5 is a side sectional view showing the completed state. In the figure, 1 is a ceramic layer, 2 is an electrode layer, 5 is a laminate, and 7
8 is an adhesive, and 9 and 10 are substrates.

Claims (1)

[Claims] 1. A step of forming a laminate by mainly laminating electrode layers and ceramic layers alternately so that ears are formed on the outer periphery of the electrode layer, and integrating them under pressure, and using the laminate as a substrate. By applying adhesive only to the ears and fixing it, and by cutting the laminate to predetermined dimensions,
1. A method for manufacturing a laminated ceramic component, comprising the step of separating a portion excluding an ear portion from a substrate.