JPS60500110A - マイクロ波パツケ−ジ - Google Patents

マイクロ波パツケ−ジ

Info

Publication number
JPS60500110A
JPS60500110A JP59500272A JP50027284A JPS60500110A JP S60500110 A JPS60500110 A JP S60500110A JP 59500272 A JP59500272 A JP 59500272A JP 50027284 A JP50027284 A JP 50027284A JP S60500110 A JPS60500110 A JP S60500110A
Authority
JP
Japan
Prior art keywords
microwave
package
base plate
substrate
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59500272A
Other languages
English (en)
Japanese (ja)
Inventor
スパロウ,ジヨン アンドリユー
Original Assignee
プレツシ− オ−バ−シ−ズ リミテツド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by プレツシ− オ−バ−シ−ズ リミテツド filed Critical プレツシ− オ−バ−シ−ズ リミテツド
Publication of JPS60500110A publication Critical patent/JPS60500110A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/134Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00Electrical arrangements for controlling or matching impedance
    • H10W44/20Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]

Landscapes

  • Semiconductor Lasers (AREA)
  • Casings For Electric Apparatus (AREA)
JP59500272A 1982-12-24 1983-12-16 マイクロ波パツケ−ジ Pending JPS60500110A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8236783 1982-12-24
GB8236783 1982-12-24

Publications (1)

Publication Number Publication Date
JPS60500110A true JPS60500110A (ja) 1985-01-24

Family

ID=10535247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59500272A Pending JPS60500110A (ja) 1982-12-24 1983-12-16 マイクロ波パツケ−ジ

Country Status (3)

Country Link
EP (1) EP0131004A1 (fr)
JP (1) JPS60500110A (fr)
WO (1) WO1984002612A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990010308A1 (fr) * 1989-03-02 1990-09-07 Explosive Fabricators, Inc. Paquets d'electrons formes par explosion et procede de fabrication correspondant
GB2319668B (en) * 1996-11-23 2001-09-12 Marconi Gec Ltd Housing for electrical apparatus
CN114121823A (zh) * 2021-11-19 2022-03-01 中国电子科技集团公司第二十九研究所 一种内嵌金属基复合基板的气密封装结构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495597B1 (fr) * 1969-10-17 1974-02-07
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
US3767979A (en) * 1971-03-05 1973-10-23 Communications Transistor Corp Microwave hermetic transistor package
US4266090A (en) * 1978-09-14 1981-05-05 Isotronics, Incorporated All metal flat package

Also Published As

Publication number Publication date
WO1984002612A1 (fr) 1984-07-05
EP0131004A1 (fr) 1985-01-16

Similar Documents

Publication Publication Date Title
US6114635A (en) Chip-scale electronic component package
JP3129288B2 (ja) マイクロ波集積回路マルチチップモジュール、マイクロ波集積回路マルチチップモジュールの実装構造
US4649416A (en) Microwave transistor package
US5783464A (en) Method of forming a hermetically sealed circuit lead-on package
EP0503200B1 (fr) Empaquetage pour circuit intégré à micro-ondes
GB2292010A (en) Ceramic package for a semiconductor device
JPH08501659A (ja) 導電キャップアンカーを備えた気密密閉回路モジュール
US6559728B1 (en) Miniature ovenized crystal oscillator
JPH03225854A (ja) 半導体デバイス及びその製造方法
JP3209183B2 (ja) 高周波信号用集積回路パッケージ及びその製造方法
US7482678B2 (en) Surface-mounted microwave package and corresponding mounting with a multilayer circuit
GB1514595A (en) Package for hermetically sealing electronic circuits
KR100482888B1 (ko) Saw 필터
CN103426844B (zh) 宽带全密封微波器件封装
US3852690A (en) Microwave transmission line to ground plane transition
JPH0680746B2 (ja) マイクロ波用チツプキヤリヤ
JPS60500110A (ja) マイクロ波パツケ−ジ
JPH0239097B2 (fr)
JPH0752759B2 (ja) パツケ−ジ
JP2511136Y2 (ja) 電子部品用メタルパッケ―ジ
GB2132413A (en) Microwave device package
JP2000183488A (ja) ハイブリッドモジュール
JP2664774B2 (ja) 高周波回路モジュール
JPS63110756A (ja) トランジスタの容器
JPH02291140A (ja) 超高周波帯実装構造