JPS6057152U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS6057152U JPS6057152U JP6291783U JP6291783U JPS6057152U JP S6057152 U JPS6057152 U JP S6057152U JP 6291783 U JP6291783 U JP 6291783U JP 6291783 U JP6291783 U JP 6291783U JP S6057152 U JPS6057152 U JP S6057152U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- chip component
- slit portion
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案を示す図で、第1図はプリント配線板の要
部拡大図、第2図は第1図のプリント配線板に対し外部
応力が加わわった状態を示すA矢視方向からの側面図、
第3図は他の実施例を示すプリント配線板の要部拡大図
、第4図は第3図のプリント配線板に外部応力が加わわ
った状態を示すB矢視方向からの側面図で、第5図は更
に他の実施例を示すプリント配線板の要部拡大図である
。・
1・・・プリント配線板、2,12・・・プリント配線
基板、2ae12a・・・パターン、3,13・・・チ
ップ部品、4.14・・・スリット部、5・・・半田層
。
“° ノ・
」11
男4図
(′4 X
55国
○” ■−4■The drawings show the present invention. Figure 1 is an enlarged view of the main parts of the printed wiring board, and Figure 2 is a view taken from the direction of arrow A, showing the printed wiring board in Figure 1 with external stress applied. Side view,
FIG. 3 is an enlarged view of the main parts of a printed wiring board showing another embodiment, and FIG. 4 is a side view from the direction of arrow B showing a state in which external stress is applied to the printed wiring board of FIG. 3. FIG. 5 is an enlarged view of the main parts of a printed wiring board showing still another embodiment. 1... Printed wiring board, 2, 12... Printed wiring board, 2ae12a... Pattern, 3, 13... Chip component, 4.14... Slit portion, 5... Solder layer. “°ノ・” 11 Man 4 figures ('4 x 55 countries ○” ■-4■
Claims (1)
記プリント配線基板にスリット部を設けたことを特徴と
するプリント配線板。1. A printed wiring board, characterized in that a slit portion is provided in the printed wiring board near a chip component placed on a surface of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6291783U JPS6057152U (en) | 1983-04-28 | 1983-04-28 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6291783U JPS6057152U (en) | 1983-04-28 | 1983-04-28 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6057152U true JPS6057152U (en) | 1985-04-20 |
Family
ID=30193106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6291783U Pending JPS6057152U (en) | 1983-04-28 | 1983-04-28 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6057152U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01145197A (en) * | 1987-06-11 | 1989-06-07 | Dainippon Printing Co Ltd | Ic card and manufacture thereof |
| JPH02137280U (en) * | 1989-04-21 | 1990-11-15 | ||
| JP2009545143A (en) * | 2006-07-21 | 2009-12-17 | オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング | Printed circuit board with electronic components generating vibration |
| JP2012216566A (en) * | 2011-03-31 | 2012-11-08 | Brother Ind Ltd | Circuit board |
| JP6065119B2 (en) * | 2013-09-05 | 2017-01-25 | 株式会社村田製作所 | Multilayer board |
| JP2017117919A (en) * | 2015-12-24 | 2017-06-29 | 株式会社デンソー | Circuit board |
| WO2021206122A1 (en) * | 2020-04-10 | 2021-10-14 | 株式会社デンソー | Electronic device |
-
1983
- 1983-04-28 JP JP6291783U patent/JPS6057152U/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01145197A (en) * | 1987-06-11 | 1989-06-07 | Dainippon Printing Co Ltd | Ic card and manufacture thereof |
| JPH02137280U (en) * | 1989-04-21 | 1990-11-15 | ||
| JP2009545143A (en) * | 2006-07-21 | 2009-12-17 | オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング | Printed circuit board with electronic components generating vibration |
| US9119299B2 (en) | 2006-07-21 | 2015-08-25 | Osram Gesellschaft Mit Beschrankter Haftung | Printed circuit board with vibration-generating electronic component |
| JP2012216566A (en) * | 2011-03-31 | 2012-11-08 | Brother Ind Ltd | Circuit board |
| JP6065119B2 (en) * | 2013-09-05 | 2017-01-25 | 株式会社村田製作所 | Multilayer board |
| JP2017117919A (en) * | 2015-12-24 | 2017-06-29 | 株式会社デンソー | Circuit board |
| WO2021206122A1 (en) * | 2020-04-10 | 2021-10-14 | 株式会社デンソー | Electronic device |
| JP2021168356A (en) * | 2020-04-10 | 2021-10-21 | 株式会社デンソー | Electronic device |
| CN115280905A (en) * | 2020-04-10 | 2022-11-01 | 株式会社电装 | Electronic device with a detachable cover |
| US12185467B2 (en) | 2020-04-10 | 2024-12-31 | Denso Corporation | Electronic device |
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