JPS6059095A - Non-contact gold electroplating - Google Patents
Non-contact gold electroplatingInfo
- Publication number
- JPS6059095A JPS6059095A JP990084A JP990084A JPS6059095A JP S6059095 A JPS6059095 A JP S6059095A JP 990084 A JP990084 A JP 990084A JP 990084 A JP990084 A JP 990084A JP S6059095 A JPS6059095 A JP S6059095A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- oxidizing agent
- added
- plating bath
- electricity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract description 21
- 239000010931 gold Substances 0.000 title abstract description 21
- 229910052737 gold Inorganic materials 0.000 title abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 36
- 238000005341 cation exchange Methods 0.000 claims abstract description 12
- 239000012528 membrane Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000003963 antioxidant agent Substances 0.000 claims description 17
- 230000003078 antioxidant effect Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 230000005611 electricity Effects 0.000 abstract description 7
- 239000002244 precipitate Substances 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 230000003064 anti-oxidating effect Effects 0.000 abstract 7
- 239000007800 oxidant agent Substances 0.000 abstract 7
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 description 5
- 239000010941 cobalt Substances 0.000 description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、陰極面上への金メッキを防止し得るとともに
メッキ浴中の沈殿物の生成を防止し得る無接点電気金メ
ッキ法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a non-contact electrolytic gold plating method that can prevent gold plating on the cathode surface and prevent the formation of precipitates in the plating bath.
基材上への金メッキ伝として金の錯塩をメッキ浴とする
無接点電気金メッキ法が行なわれている。Non-contact electrolytic gold plating using a gold complex salt as a plating bath is used to plate gold onto a substrate.
しかしながら、この方法においては、メッキ処理中に金
が陰極面上へも電析さすることが避けらルなかった。し
たがって、高価な金が無駄に消費さｎるばかりですく、
使用後の陰極の処理も面倒であった。However, in this method, it was inevitable that gold would also be deposited onto the cathode surface during the plating process. Therefore, expensive money is wasted,
Treatment of the cathode after use was also troublesome.
こｆＬらの欠点を解決するために破メッキ材の少なくと
も陰極に面する側に陽イオン交換膜を介在させてメッキ
処理する方法を提案（特願昭５７−５８７２５号）した
が、この方法にかいて、陽極側、陰極側の両方に陽イオ
ン交換膜を介在ζせた場合、陽極室に金の漏ルが生じ金
の損失をまねくおそれがおることを認め、陽極側に陽イ
オン交換膜を介在させず陰極側だけに介在させるよらに
すると、長時間メッキ処理を行なった場合、陽極ではメ
ッキ浴中の陰イオンが分解さ几メッキ浴中に沈殿物の生
成が認めらｒＩた。In order to solve these drawbacks, we proposed a method of plating by interposing a cation exchange membrane at least on the side facing the cathode of the broken plated material (Japanese Patent Application No. 58725/1983), but this method Therefore, it is recognized that if a cation exchange membrane is interposed on both the anode side and the cathode side, there is a risk of gold leakage into the anode chamber and loss of gold. When plating was performed for a long time without intervening and only on the cathode side, anions in the plating bath were decomposed at the anode, and a precipitate was observed to be formed in the plating bath.
本発明者は、このような問題を解決するために研究を夏
ね、陰極側たけに陽イオン交換膜を介在させメッキ浴中
に酸化防止剤を注加することによって目的を達し得るこ
とを認めて本発明をなしたものである。すなわち、本発
明は、被メッキ材と陰極との間に陽イオン交換膜を介在
略せメッキ浴中に酸化防止剤を注入しながら電気メツキ
処理をする無接点電気金メッキ法である。The inventor of the present invention spent a summer conducting research to solve these problems, and recognized that the objective could be achieved by interposing a cation exchange membrane only on the cathode side and adding an antioxidant into the plating bath. Thus, the present invention has been achieved. That is, the present invention is a non-contact electroplating method in which a cation exchange membrane is not interposed between the material to be plated and the cathode, and electroplating is performed while an antioxidant is injected into the plating bath.
本発明において使用する陽イオン変換膜は、陽イオン交
換膜として市販さ几ているものでよい。The cation exchange membrane used in the present invention may be any commercially available cation exchange membrane.
又、酸化防止剤としては、ＫＣＨＮａＣＮがもつとも奸
才しく、次亜リン酸ナトリウム、水素化ホー素ナトリウ
ム、次亜硫酸ナトリウム、亜硫酸ナトリウムなどのよう
な酸化防止剤を１史用し得る。Further, as an antioxidant, KCHNaCN has a unique antioxidant, and antioxidants such as sodium hypophosphite, sodium borohydride, sodium hyposulfite, sodium sulfite, etc. can be used.
さらに、装置は、第１図に例示するような被メッキ材（
１）と陰極（２）との間に陽イオン交換膜（３）を設は
陰柚室（４）とメッキ浴室（５）を形成し、陽極（６）
を設けたような従来の無接点電気メツキ装置が使用可能
であり、メッキ処理条件も従来の条件を適用するもので
おる。Furthermore, the apparatus can be used to coat a material to be plated (as illustrated in FIG.
A cation exchange membrane (3) is installed between 1) and the cathode (2) to form a negative chamber (4) and a plating bath (5), and the anode (6)
It is possible to use a conventional non-contact electroplating device, such as one equipped with a plating device, and apply the conventional plating conditions.
／こだメッキ浴中へ酸化防止剤を江別しながらメッキ処
理を行なうものであり、酸化防止剤の添加量は、流す１
ぽ気量に応じた量を添加するが、実操業上は、一定にな
るように、酸化防止剤添加用のポンプのストロークｔｌ
−Ｉｌ［ず電気損に応じて選定して連続的に供給するも
のである。/ The plating process is carried out while adding the antioxidant into the plating bath, and the amount of antioxidant added is 1.
The amount is added according to the amount of antioxidant, but in actual operation, the stroke tl of the pump for adding antioxidant should be adjusted so that it remains constant.
-Il is selected according to the electrical loss and is supplied continuously.
このためには、酸化防市剤皺加によるメッキ浴の４度の
相違を電気量、酸化防止剤の添加量などを変えて測定し
、電気量に対する酸化防止剤添加量の関係をめ、酸化防
止剤添加量とポンプのストロークとの関係、ひいては電
気量とポンプのストロークとの関係とをめておくことに
より、ポンプのストロークを選定して酸化防止剤の添加
量を一定に保つようにして操業するものでちる。To this end, we measured the four-degree difference in the plating bath due to the wrinkling of the oxidation preventive agent by changing the amount of electricity and the amount of antioxidant added, and determined the relationship between the amount of antioxidant and the amount of oxidation. By keeping in mind the relationship between the amount of antioxidant added and the pump stroke, and the relationship between the amount of electricity and the pump stroke, the pump stroke can be selected to keep the amount of antioxidant added constant. It is the one that operates.
第２図は、このようにし、てめた０、１５Ｎ−ＫＣＮ
）場合のポンプのストロークと電流（Ａｌとの関係の一
例を示す図であり、メッキ処理時に加える電流を決めｎ
はこの図によりポンプのス）ｏ−り数が決まυ、したが
ってＫＣＮの添加が一定月に維持できるものである。Figure 2 shows the 0,15N-KCN obtained in this way.
) is a diagram showing an example of the relationship between pump stroke and current (Al).
This figure determines the number of pump cycles, υ, and therefore the addition of KCN can be maintained at a constant rate.
この操作において、たとえば、シアンの添加が少ない場
合には、金メッキ浴の濁度が多くなり、ＡｕＣＮ が生
成ζ几るのでろ過などによって除去する必曹が生じる。In this operation, for example, if a small amount of cyanide is added, the turbidity of the gold plating bath will increase, and AuCN will be produced and smelted, resulting in carbon dioxide that must be removed by filtration or the like.
又、逆に、シアンの添加が多い場合には、３価のコバル
トが生成さｎ、２価のコバルトが減少し光沢が出にくく
なるので２価のコバルトの定量を行ない補給する必要が
生じる。さらに、３価の金が多くなることがあるので、
分析を行ない多い場合にはイオン交換樹脂による除去が
必要である、
なお、本発明は、金の錯体をメッキ浴とするすべての無
接点電気金メッキ法に適用し得るものであり、ＣＮ−イ
オンセンサーを使用してＣＮ−濃度を測定しながら酸化
防止剤の添加用を調整するようにすることもできる。Conversely, if a large amount of cyanide is added, trivalent cobalt is produced and divalent cobalt decreases, making it difficult to produce gloss, so it is necessary to measure and replenish divalent cobalt. Furthermore, since trivalent gold may increase,
If a large number of analyzes are performed, removal using an ion exchange resin is necessary.The present invention can be applied to all non-contact electrolytic gold plating methods that use a gold complex as a plating bath, It is also possible to adjust the amount of antioxidant added while measuring the CN concentration using a method.
本発明は、抜メッキ柑と陰極との間に陽イオン交換膜を
ブｒ在させメッキ浴中に酸化防止剤を社訓しながらメッ
キ処理するようにしたので、メッキ浴の酸化を防止し得
、沈殿物の生成を防止し得、陰極への金の電析を防止し
得るなど高価な金の浪費や操作の繁雑さなどを防止し得
るなど優五た効呆が認めらｊ−る。In the present invention, a cation exchange membrane is interposed between the plating sample and the cathode, and the plating process is performed while adding an antioxidant to the plating bath, thereby preventing oxidation of the plating bath. It has been recognized that it has excellent effects such as preventing the formation of precipitates and preventing gold from being deposited on the cathode, thereby preventing wastage of expensive gold and complicated operations.
次に、不発明方法の実施例を述べる。Next, an example of the non-inventive method will be described.
実施例
第１図に示すような陽イオン交換膜（３）を介在さ ４
゜ぜて形成した陰極室（４）中に水酸化カリウム液を人
九、メッキ浴室（５２中１１こは、クエン酸１２０ｙ／
ｌ、金（ｌ抽の金として）１５９／ｌ、コバルト（２価
のコバルトとして） ０２９／ｌ 、 ＰＨ３，５のよ
うな組成を有する酸キ浴をノズルを設けて連続的に噴出
；せるようにした長さ６０ｔｙｎの装置ｉｔを使用して
、被メッキ材（１）としてリン宵鋼材を用い電流密度２
０Ａ／ｄｍ’総電流１０Ａで電気メッキを行う場合０Ｊ
５Ｎ−ＫＣＮを０．４ν／分の割合で定量ポンプを使用
して第２図からめたストローク数４２７分で供給しなが
ら連続的に行ない、金メッキ厚０６μの製品を得た。Example 4 A cation exchange membrane (3) as shown in Figure 1 was interposed.
Nine people poured a potassium hydroxide solution into the cathode chamber (4) that had been formed.
A nozzle is installed to continuously spray out an acidic bath having a composition of 159/l, gold (as gold drawn from 1), 029/l cobalt (as divalent cobalt), and pH 3.5. Using a device with a length of 60 tin, and using Rinyoi steel as the material to be plated (1), the current density was 2.
0A/dm' When performing electroplating with a total current of 10A, 0J
A product with a gold plating thickness of 06 μm was obtained by continuously supplying 5N-KCN at a rate of 0.4 μ/min using a metering pump with a stroke number of 427 minutes as shown in FIG.
このような条件で２ケ月間使用したがメッキ浴中への沈
殿物の生成は認めら庇ず、陰極上への金の電析も認めら
庇なかった。Although it was used under these conditions for two months, no precipitation was observed in the plating bath, and no gold was deposited on the cathode.
比較例
酸化防止剤を江別しなかった以外は実施例と同様に行な
った結果、１時間使用後すでにメッキ浴中に沈殿物の生
成が認めらｆシフこ。Comparative Example The same procedure as in Example was carried out except that the antioxidant was not removed. As a result, the formation of a precipitate was already observed in the plating bath after 1 hour of use.
第１図は、本発明に使用する装置の一実施例を示す断面
図、第２図は、ポンプのストロークと電流との関係の一
例を示す図である。FIG. 1 is a cross-sectional view showing one embodiment of a device used in the present invention, and FIG. 2 is a diagram showing an example of the relationship between pump stroke and current.
Claims (1)
せメッキ浴中に酸化防止剤を注加しながら電気メツキ処
理を行なうことを特徴とする無接点電気金メッキ法。1) A non-contact electroplating method characterized by interposing a cation exchange membrane between the material to be plated and the cathode and performing electroplating while adding an antioxidant to the plating bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP990084A JPS6059095A (en) | 1984-01-23 | 1984-01-23 | Non-contact gold electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP990084A JPS6059095A (en) | 1984-01-23 | 1984-01-23 | Non-contact gold electroplating |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5872582A Division JPS58177486A (en) | 1982-04-08 | 1982-04-08 | Contactless electroplating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6059095A true JPS6059095A (en) | 1985-04-05 |
| JPS6218638B2 JPS6218638B2 (en) | 1987-04-23 |
Family
ID=11732985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP990084A Granted JPS6059095A (en) | 1984-01-23 | 1984-01-23 | Non-contact gold electroplating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059095A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0392216A (en) * | 1989-09-05 | 1991-04-17 | Kobe Steel Ltd | Shaving cutter |
-
1984
- 1984-01-23 JP JP990084A patent/JPS6059095A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0392216A (en) * | 1989-09-05 | 1991-04-17 | Kobe Steel Ltd | Shaving cutter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6218638B2 (en) | 1987-04-23 |
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