JPS6061193A - Laser inscribing method - Google Patents
Laser inscribing methodInfo
- Publication number
- JPS6061193A JPS6061193A JP58170118A JP17011883A JPS6061193A JP S6061193 A JPS6061193 A JP S6061193A JP 58170118 A JP58170118 A JP 58170118A JP 17011883 A JP17011883 A JP 17011883A JP S6061193 A JPS6061193 A JP S6061193A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- transparent object
- laser
- transparent
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の属する技術分野〕
この発明は、使用するレーザ光が透過してしまうような
物体へ、レーザ光を使用して刻印する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] This invention relates to a method of marking an object using a laser beam through which the laser beam used is transmitted.
従来レーザ光を用いてレーザ光が透過する物体(以下透
明物体という)に刻印しようとする場合には、当該レー
ザ光に対して高反射率を有する反射膜(以下反射膜とい
う)を透明物体の表面に形成して詔き反射膜と透明物体
との界面にレーザ光を集光させて行う、熱的加工方法が
採用されていることは知られている。かかる従来技術に
よれば、反射膜をあらかじめ透明物体に形成しておくこ
と、およびレーザ光照射後すなわち刻印後反射膜を除去
することが必要であった。またそのほかに透明物体の表
面仕上された側からレーザ光を入射して物体裏面に集光
させ物体の裏面からレーザ光線入射方向に向けてレーザ
加工を進行させる方法も知られている。Conventionally, when using a laser beam to mark an object through which the laser beam passes (hereinafter referred to as a transparent object), a reflective film (hereinafter referred to as a reflective film) that has a high reflectance for the laser beam is applied to the transparent object. It is known that a thermal processing method is employed in which laser light is focused on the interface between a reflective film formed on the surface of a transparent object and a transparent object. According to such prior art, it is necessary to form a reflective film on a transparent object in advance and to remove the reflective film after laser beam irradiation, that is, after marking. In addition, there is also known a method in which laser light is incident on the surface-finished side of a transparent object, focused on the back surface of the object, and laser processing proceeds from the back surface of the object in the direction in which the laser beam is incident.
しかしながらこの従来技術には、レーザ光の吸収率が小
さい透明物体を加工する場合、エネルギー損失が大きく
本質的に大きなエネルギーを透明物体の加工部に集中さ
せる必要があった。However, in this conventional technique, when processing a transparent object with a low absorption rate of laser light, there is a large energy loss and it is necessary to essentially concentrate a large amount of energy on the processing portion of the transparent object.
そのためにこの場合、たとえば波長1.06μmのYA
Gレーザを用いて、石英ガラスのような熱膨張率の小さ
い物体を加工することは可能であっても、ソーダガラス
や鉛ガラスを含む多成分系ガラスのような熱膨張率が大
きく熱伝導度の小さい物質では、熱歪が蓄積し、加工中
あるいは、加工後に破損が起こることになり実際上、こ
のような高熱膨張率でかつ高脆性の物体へ刻印すること
は不可能であった。Therefore, in this case, for example, YA with a wavelength of 1.06 μm
Although it is possible to process objects with a low coefficient of thermal expansion such as quartz glass using a G laser, it is possible to process objects with a low coefficient of thermal expansion such as quartz glass, but objects with a high coefficient of thermal expansion and low thermal conductivity such as multi-component glasses including soda glass and lead glass In materials with a small coefficient of thermal expansion, thermal strain accumulates and breakage occurs during or after processing, making it practically impossible to engrave objects with such a high coefficient of thermal expansion and high brittleness.
この発明は上述に鑑みなされたもので、その目的は、レ
ーザ光を用いて透明物体に刻印する際に、透明物体に事
前の反射膜形成を必要とすることなく、しかもレーザ刻
印部へ集中させるエネルギーを小さくして高熱膨張率で
かつ高脆性の物体への刻印が可能なレーザ刻印方法を提
供するにある。This invention was made in view of the above, and its purpose is to make it possible to mark a transparent object using a laser beam without requiring a reflective film to be formed on the transparent object in advance, and to concentrate the laser beam on the marking part. An object of the present invention is to provide a laser engraving method capable of engraving a highly brittle object with a high coefficient of thermal expansion by using a small amount of energy.
この発明は上述の目的を達成するために、レーザ光を透
過する物体と前記レーザ光を吸収する物質を実効的に間
隙を設けて配置し、前記レーザ光を熱源として前記レー
ザ光を吸収する物質を蒸発あるいは昇華させて前記レー
ザ光を透過する物体に被着せしめると同時に、前記レー
ザ光によって前記レーザ光を透過する物体の前記レーザ
光を吸収する物質の被着したる部分の少なくとも一部に
照射することにより、前記レーザ光を透過する物体の前
記吸収物質の被覆している部分で、かつレーザ光が照射
されている部分に、溶融あるいは軟化による変形さらに
は、変質を生ぜしめるようにしようとするものである。In order to achieve the above object, the present invention arranges an object that transmits a laser beam and a substance that absorbs the laser beam with an effective gap therebetween, and uses the laser beam as a heat source to absorb the laser beam. At the same time, the laser beam is applied to at least a portion of the object that transmits the laser beam to which the substance that absorbs the laser beam is adhered. By irradiating the object, the portion of the object that transmits the laser beam that is coated with the absorbing substance and is irradiated with the laser beam is caused to undergo deformation or alteration due to melting or softening. That is.
第1図および第2図はこの発明によるレーザ刻印方法の
一実施例を示す概念図で、図において1はレーザ光、2
は透明物体、3は吸収物質台、4はテーブル、5は刻印
部、6はギャツプモして7は透明物体2に吸着された吸
収物質であり、テーブル4上に吸収物質台3と透明物体
2が設置され、ギャップ6は吸収物質台の凹所として形
成されている。1 and 2 are conceptual diagrams showing an embodiment of the laser engraving method according to the present invention. In the figures, 1 indicates a laser beam, 2
3 is the transparent object, 3 is the absorbing material table, 4 is the table, 5 is the stamping part, 6 is the absorbing material, and 7 is the absorbing material adsorbed to the transparent object 2. The absorbing material table 3 and the transparent object 2 are placed on the table 4. is provided, and the gap 6 is formed as a recess in the absorbent material platform.
この構成において透明物体2の上方側から入射するレー
ザ光1を移動(走査)するか、または、レーザ光1に対
してテーブル4を移動するかにより、透明物体2ヘレー
ザ刻印(刻印部5)するのである。そしてギャップ6は
、透明物体2の上方側からレーザ光1が透明物体2を透
過し、吸収物質台3に照射されるとき、吸収物質台3を
蒸発あるいは昇華させて、透明物体2の対向面に蒸発あ
るいは昇華させた吸収物質7の一部分を可及的にレーザ
光1のビーム径に近い範囲に被着させる程度のものであ
ればよい。このことによりレーザ光lは透明物体2を透
過して吸収物質台3に照射が可能となり、同時に吸収物
質台3の被照射部はレーザ光1のエネルギーを吸収し、
加熱され、蒸発あるいは昇華して透明物体2の対向面に
一部分被着する。透明物体2に被着した吸収物質7の部
分の少なくとも一部はレーザ光1を吸収し、高熱を発生
して吸収物質を溶融あるいは軟化状態に至らしめ、レー
ザ光1の照射が止むと透明物体2のレーザ光1が照射さ
れていた刻印部5は急速に冷却凝固する。また、かかる
透明物体2のレーザ光1が照射されている部分では、溶
融あるいは軟化状態 5−
にいたらぬまでも同相反応あるいは吸収物質7の拡散が
起り、透明物体2に変質を起させる。In this configuration, the transparent object 2 is laser engraved (engraved part 5) by moving (scanning) the laser beam 1 incident from above the transparent object 2 or by moving the table 4 with respect to the laser beam 1. It is. Then, the gap 6 is formed so that when the laser beam 1 passes through the transparent object 2 from the upper side of the transparent object 2 and is irradiated onto the absorbing material stage 3, the absorbing material stage 3 is evaporated or sublimated, and the opposite surface of the transparent object 2 is It is sufficient that a portion of the absorbing substance 7 evaporated or sublimated is deposited in a range as close to the beam diameter of the laser beam 1 as possible. This allows the laser beam 1 to pass through the transparent object 2 and irradiate the absorbing material table 3, and at the same time, the irradiated part of the absorbing material table 3 absorbs the energy of the laser beam 1,
It is heated, evaporates or sublimates, and partially adheres to the opposing surface of the transparent object 2. At least a part of the absorbing material 7 attached to the transparent object 2 absorbs the laser beam 1, generates high heat, melts or softens the absorbing material, and when the laser beam 1 stops irradiating the transparent object The marking portion 5, which was irradiated with the laser beam 1 of No. 2, rapidly cools and solidifies. Furthermore, in the portion of the transparent object 2 that is irradiated with the laser beam 1, an in-phase reaction or diffusion of the absorbing substance 7 occurs even if the transparent object 2 is not in a melted or softened state 5-, causing the transparent object 2 to change in quality.
これにより、当該凝固あるいは変質した部分すなわち刻
印部5は、レーザ光1照射前の透明物体2の面とは異な
った形状を有する面か、あるいは、屈折率の異なった部
分を形成する。As a result, the solidified or altered portion, that is, the stamped portion 5 forms a surface having a shape different from the surface of the transparent object 2 before irradiation with the laser beam 1, or a portion with a different refractive index.
このように上述の方法でレーザ光1を照射することによ
り透明物体2に刻印部5が形成されることとなり、そし
てレーザ刻印を可能とする吸収物質7の透明物体2に対
する被着量は、透明物体2に被着した吸収物質7によっ
てレーザ光lが完全に遮断する程多量である必要はない
。By irradiating the laser beam 1 with the above-described method, the marking portion 5 is formed on the transparent object 2, and the amount of the absorbing material 7 that makes laser marking possible is deposited on the transparent object 2. The amount does not need to be so large that the laser beam l is completely blocked by the absorbing substance 7 deposited on the object 2.
蒸発あるいは昇華により吸収物質7は解放面上の立体角
全域にわたって放出されるが、実質的には、レーザ刻印
を可能とする吸収物質7の被着量は透明物体2の外観上
はとんど影響を及ぼさない程度の微少量でよいことがこ
の発明の発明者によって明らかにされている。そして用
途上極微少量の吸収物質といえども除去する必要のある
場合に、化学的腐蝕のような過激な方法 6−
を用いなくても、たとえば乾いた布などで拭くだけの容
易な作業で除去できることも確められている。The absorbing substance 7 is released over the entire solid angle on the open surface by evaporation or sublimation, but in reality, the amount of the absorbing substance 7 deposited to enable laser marking is almost the same as the appearance of the transparent object 2. The inventor of the present invention has clarified that a very small amount is sufficient to have no effect. When it is necessary to remove even a very small amount of absorbed material due to the application, it can be removed by simply wiping it with a dry cloth, without using extreme methods such as chemical etching. It is confirmed that it is possible.
また、刻印部5の濃淡度は、単にレーザ光の出力を変え
るだけでなく、ギャップ6の大小や、あるいは、同一箇
所への刻印操作を繰返すことによっても調整可能である
。さらに、高速高精度で制御性が良く、かつ非接触加工
が可能なレーザ光加工の特性を生かすことができるので
、多種少量生産が可能なだけでなく被刻印物への接触に
よる損傷もなく汚損のない品質良好なレーザ刻印を行い
つる。Further, the density of the marking portion 5 can be adjusted not only by simply changing the output of the laser beam, but also by changing the size of the gap 6, or by repeating the marking operation at the same location. Furthermore, since it is possible to take advantage of the characteristics of laser beam processing, which allows for high speed, high precision, good controllability, and non-contact processing, it is possible not only to produce a wide variety of products in small quantities, but also to avoid damage and stains caused by contact with the engraved object. The quality of the vines is good and laser engraving is done.
なおこの発明は本実施例に示したような平板透明物体に
その適用が限定されるものではなく、ガラスのコツプや
瓶類のような曲間に対する刻印にもなんらの支障をとも
なうことなく適用しつるものである。また吸収物質台3
は透明物体2の支え台と透明物体2へ被着される吸収物
質7とを兼用しているので、通常は透明物体2の支え台
あるいは位置決め治具として使用できる。Note that the application of this invention is not limited to flat transparent objects as shown in this embodiment, but can also be applied to engravings on curved objects such as glass cups and bottles without any problems. It is a vine. Also absorbing material table 3
Since it serves both as a support for the transparent object 2 and as an absorbing material 7 to be applied to the transparent object 2, it can normally be used as a support for the transparent object 2 or as a positioning jig.
そしてまたたとえばQスイッチ付YAG レーザで透明
ガラスに刻印する場合、従来技術である透明物体の表面
仕上された側からレーザ光を入射させて被刻印物体裏面
に集光させる方法では、レーザの平均出力を50ワツト
(’w )にしても全く刻印できないのに対しこの発明
によるレーザ刻印方法を用いると、レーザの平均出力が
8ワツ)(W)程度あれば十分に刻印でき、レーザ刻印
の適用範囲を大幅に拡大できる。For example, when marking transparent glass with a Q-switched YAG laser, the average output of the laser is However, when using the laser engraving method according to the present invention, an average laser output of about 8 watts (W) is enough to engrave, which extends the applicable range of laser engraving. can be expanded significantly.
この発明によれば透明物体と吸収物質を間隙を設けて配
置し、レーザ光により吸収物質を蒸発あるいは昇華させ
て透明物体に被着させると同時に、レーザ光によって透
明物体の吸収物質の被着した部分の少なくとも一部が照
射されるので、事前に透明物体に反射膜を形成して詔く
必要がない。また透明物体に被着した吸収物質でレーザ
光の照射を受けている部分はそのほとんどが効果的に刻
印に関与するので、透明物体のレーザ光の吸収率に関係
なく有効にレーザ光のエネルギーを利用することができ
、大きな衝撃的エネルギーを投入する必要がなく熱歪の
蓄積による加工部の破損を防ぐことができる。才た透明
物体への刻印がレーザ光の透過する部分だけなので、刻
印を望まない部分に影響を与えることはない。According to this invention, a transparent object and an absorbing material are arranged with a gap between them, and the absorbing material is evaporated or sublimated by a laser beam to adhere to the transparent object. Since at least a portion of the area is irradiated, there is no need to form a reflective film on the transparent object in advance. In addition, most of the absorbing material attached to the transparent object that is irradiated with the laser beam is effectively involved in marking, so the energy of the laser beam can be effectively absorbed regardless of the absorption rate of the laser beam of the transparent object. There is no need to input large impact energy, and damage to the machined part due to accumulation of thermal strain can be prevented. Since the engraving on a transparent object is limited to the part through which the laser beam passes, it does not affect the parts that are not desired to be engraved.
第1図はこの発明によるレーザ刻印方法の一実施例の概
念を示す斜視図、第2図は第1図の1−I線に沿う断面
図である。
1・・・レーザ光、2・・・透明物体、3・・・吸収物
質台、5・・・刻印部、6・・・間隙、7・・・吸収物
質。
9−
2
71 図
T 2 口FIG. 1 is a perspective view showing the concept of an embodiment of the laser marking method according to the present invention, and FIG. 2 is a sectional view taken along line 1-I in FIG. DESCRIPTION OF SYMBOLS 1... Laser beam, 2... Transparent object, 3... Absorbing material stand, 5... Marking part, 6... Gap, 7... Absorbing material. 9-2 71 Figure T 2 mouth
Claims (1)
る物質を実効的に間隙を設けて配置し、前記レーザ光を
熱源として前記レーザ光を吸収する物質を蒸発あるいは
昇華させて前記レーザ光を透過する物体に被着せしめる
と同時に、前記レーザ光によって前記レーザ光を透過す
る物体の前記レーザ光を吸収する物質の被着したる部分
の少なくとも一部に刻印することを特徴とするレーザ刻
印方法。1) An object that transmits the laser beam and a substance that absorbs the laser beam are arranged with an effective gap between them, and the laser beam is used as a heat source to evaporate or sublimate the substance that absorbs the laser beam, thereby emitting the laser beam. A laser engraving method characterized in that, at the same time, the laser beam is applied to an object that transmits the laser beam, and at the same time, the laser beam is inscribed on at least a part of the adhered part of the object that absorbs the laser beam, using the laser beam. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58170118A JPS6061193A (en) | 1983-09-14 | 1983-09-14 | Laser inscribing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58170118A JPS6061193A (en) | 1983-09-14 | 1983-09-14 | Laser inscribing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6061193A true JPS6061193A (en) | 1985-04-08 |
| JPH0323273B2 JPH0323273B2 (en) | 1991-03-28 |
Family
ID=15898970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58170118A Granted JPS6061193A (en) | 1983-09-14 | 1983-09-14 | Laser inscribing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6061193A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000073604A (en) * | 1999-05-12 | 2000-12-05 | 이낙천 | Laser color marking method |
| US6442974B1 (en) | 1994-03-24 | 2002-09-03 | Laserplus Oy | Method and device for making visually observable markings onto transparent material |
| US6709720B2 (en) | 1997-03-21 | 2004-03-23 | Kabushiki Kaisha Yaskawa Denki | Marking method and marking material |
| CN100436155C (en) * | 2006-08-15 | 2008-11-26 | 北京工业大学 | A rapid laser sublimation printing method based on transparent materials |
| JP2016515944A (en) * | 2013-03-21 | 2016-06-02 | コーニング レーザー テクノロジーズ ゲーエムベーハーCORNING LASER TECHNOLOGIES GmbH | Apparatus and method for cutting a contour shape from a flat substrate using a laser |
-
1983
- 1983-09-14 JP JP58170118A patent/JPS6061193A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6442974B1 (en) | 1994-03-24 | 2002-09-03 | Laserplus Oy | Method and device for making visually observable markings onto transparent material |
| US6709720B2 (en) | 1997-03-21 | 2004-03-23 | Kabushiki Kaisha Yaskawa Denki | Marking method and marking material |
| KR20000073604A (en) * | 1999-05-12 | 2000-12-05 | 이낙천 | Laser color marking method |
| CN100436155C (en) * | 2006-08-15 | 2008-11-26 | 北京工业大学 | A rapid laser sublimation printing method based on transparent materials |
| JP2016515944A (en) * | 2013-03-21 | 2016-06-02 | コーニング レーザー テクノロジーズ ゲーエムベーハーCORNING LASER TECHNOLOGIES GmbH | Apparatus and method for cutting a contour shape from a flat substrate using a laser |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0323273B2 (en) | 1991-03-28 |
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