JPS6061729U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6061729U
JPS6061729U JP1983154249U JP15424983U JPS6061729U JP S6061729 U JPS6061729 U JP S6061729U JP 1983154249 U JP1983154249 U JP 1983154249U JP 15424983 U JP15424983 U JP 15424983U JP S6061729 U JPS6061729 U JP S6061729U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
bonding wire
wire
view
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983154249U
Other languages
Japanese (ja)
Inventor
江村　羊一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983154249U priority Critical patent/JPS6061729U/en
Publication of JPS6061729U publication Critical patent/JPS6061729U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の樹脂封止集積回路の内部断面図、第２図
は、従来のボンディング線の断面図、第３図は本考案の
一実施例を示す集積回路の内部断面図、第４図は本考案
の一実施例を示すホンディング線の断面図である。 １．１１・・・・・・絶縁樹脂、２，２２・・・・・・
外部引出しリード線、３，３３・・・・・・金属板、４
，４４・・・・・・半導体ペレット、５，５５・・曲ボ
ンディング線、６・・・・・・アルミニウム。　７FIG. 1 is an internal sectional view of a conventional resin-sealed integrated circuit, FIG. 2 is a sectional view of a conventional bonding line, FIG. 3 is an internal sectional view of an integrated circuit showing an embodiment of the present invention, and FIG. The figure is a sectional view of a honding wire showing an embodiment of the present invention. 1.11...Insulating resin, 2,22...
External drawer lead wire, 3, 33...Metal plate, 4
, 44... Semiconductor pellet, 5, 55... Curved bonding wire, 6... Aluminum. 7

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子の電極をボンディング線を介してリード線に
接続した半導体装置に於いて、前記ボンディング線の表
面部分に水分に対して溶解する物質を被覆したことを特
徴とする半導体装置。1. A semiconductor device in which an electrode of a semiconductor element is connected to a lead wire via a bonding wire, wherein a surface portion of the bonding wire is coated with a substance that dissolves in moisture.
JP1983154249U 1983-10-04 1983-10-04 semiconductor equipment Pending JPS6061729U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983154249U JPS6061729U (en) 1983-10-04 1983-10-04 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983154249U JPS6061729U (en) 1983-10-04 1983-10-04 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6061729U true JPS6061729U (en) 1985-04-30

Family

ID=30341032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983154249U Pending JPS6061729U (en) 1983-10-04 1983-10-04 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6061729U (en)

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