JPS6063145A - Laminated board for electricity - Google Patents
Laminated board for electricityInfo
- Publication number
- JPS6063145A JPS6063145A JP17166883A JP17166883A JPS6063145A JP S6063145 A JPS6063145 A JP S6063145A JP 17166883 A JP17166883 A JP 17166883A JP 17166883 A JP17166883 A JP 17166883A JP S6063145 A JPS6063145 A JP S6063145A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- resin
- electricity
- electrical
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005611 electricity Effects 0.000 title 1
- 238000000465 moulding Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000004760 aramid Substances 0.000 claims description 4
- 229920003235 aromatic polyamide Polymers 0.000 claims description 4
- 239000004745 nonwoven fabric Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電子機器、電気機器、計算機、コンピューター
等に用いられる多層印刷配線板用電気用積層板の分野に
属するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention belongs to the field of electrical laminates for multilayer printed wiring boards used in electronic equipment, electrical equipment, calculators, computers, and the like.
従来の電気用積層板はフェノール樹脂、エポキシ樹脂、
不飽和ポリエステル樹脂等の積層板用樹脂ワニスを紙、
布、ガラス布等の積層板用基材に含浸、乾燥したプリプ
レグを所要枚数重ね、更に必要に応じてその上、下面に
金属箔を載置した積層体を積層成形してなるものである
が積層板加工時のパンチング加工、ドリル加工時に層間
剥離することがあり更にプリプレグを複数枚重ねる手間
が問題となっていた。Conventional electrical laminates are made of phenolic resin, epoxy resin,
Paper, resin varnish for laminates such as unsaturated polyester resin, etc.
It is made by stacking the required number of impregnated and dried prepreg sheets on a laminate base material such as cloth or glass cloth, and then, if necessary, placing a metal foil on the bottom surface to form a laminate. Delamination may occur during punching and drilling during laminated board processing, and the labor involved in stacking multiple sheets of prepreg has become a problem.
本発明の目的はパンチング加工性、層間接着性に優れ且
つ生産性のよい電気用積層板を提供することにある。An object of the present invention is to provide an electrical laminate that has excellent punching processability and interlayer adhesion and is highly productive.
本発明は積層板用基材として芳香族ポリアミド繊維・ガ
ラス繊維不織布１枚を用いたことを特徴とする電気用積
層板で、以下本発明の詳細な説明する。本発明に用いる
積層板用樹脂としてはフェノール樹脂、クレゾール樹脂
、エポキシ樹脂、不飽和ポリエフ７−ル樹脂、メラミン
樹脂、ポリイミド、ポリブタジェン、ポリアミド、ポリ
アミドイミド、ポリスルフォン、ポリブチレンテレフタ
レート、ポリエーテルエーテルケトン、弗化樹脂等の単
独、変性物、混合物等が用いられ必要に応じて枯曳調整
に水、メチルアルコール、アセトン、シクロヘキザノン
、スチレン等の／ＩＦ ｌｌ１＝ 全添加Ｌ ７’ｃも
ので、積層板用基材としては、芳香族ポリアミド倣維と
ガラス繊維からなる不織布を用いるもので、芳香Ｊ％ポ
リアミド繊維とガラス繊維は合撚、合糸、混合各れでも
よいが好ましくはバラツキの少なくなる合撚品を用いる
ことが票ましい。The present invention is an electrical laminate characterized in that a single sheet of aromatic polyamide fiber/glass fiber nonwoven fabric is used as a base material for the laminate, and the present invention will be described in detail below. The resins for laminates used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyethylene resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polybutylene terephthalate, and polyether ether ketone. , fluorinated resins, etc. alone, modified products, mixtures, etc. are used, and if necessary, water, methyl alcohol, acetone, cyclohexanone, styrene, etc. /IF ll1 = total addition L 7'c are used, A nonwoven fabric made of aromatic polyamide imitation fibers and glass fibers is used as the base material for the laminate, and the aromatic J% polyamide fibers and glass fibers may be plied, twisted, or mixed, but preferably with minimal variation. It is recommended to use a ply-twisted product.
実施例
芳香族ポリアミド繊維５０Ｍ量部、ガラス繊維の重量部
からなる厚さ２．０３端の合撚不織布に硬化剤含有エポ
キシ樹脂を樹脂量がω重量％になるように含浸、乾燥し
たプリプレグ１枚の上、下面に厚さ３５ミクロンの銅箔
を重ねた積層体を成形プレートに挾み成形圧力６０−成
形温度１６５”Ｃで１２０分間積ル１成形して厚さ１．
６藺の電気用積層板を得た。Example: Prepreg 1 which was prepared by impregnating a curing agent-containing epoxy resin into a twisted non-woven fabric of 2.03 mm thick and consisting of 50 M parts of aromatic polyamide fibers and glass fibers so that the amount of the resin was ω% by weight, and then drying it. A laminate of copper foil with a thickness of 35 microns on the upper and lower surfaces of the sheet was sandwiched between molding plates and molded for 120 minutes at a molding pressure of 60"C and a molding temperature of 165"C to a thickness of 1.
A 6-inch electrical laminate was obtained.
従来例
１ｖさ０．１８ ＪｌｊＩのガフヌ布に実施例と同じ
エポキシ樹脂を樹脂量がω重量％になるように含浸、乾
燥したプリプレグ８枚を重ねた上、下面に厚さあミクロ
ンの銅箔を重ねた積層体を成形プレートに挾み成形圧力
６０ ｋｇ／（Ｊ、成形温度１６５℃で１２０分間積層
成形して厚さ１．６ｍの電気用積層板を得た。Conventional example 1v 0.18 Same as the example on JljI gafnu cloth
A laminate consisting of 8 sheets of prepreg impregnated with epoxy resin such that the resin amount is ω% by weight and dried, and a layer of micron-thick copper foil layered on the bottom surface was sandwiched between molding plates, and a molding pressure of 60 kg/( J. Laminate molding was performed for 120 minutes at a molding temperature of 165° C. to obtain an electrical laminate having a thickness of 1.6 m.
実施例及び従来例で得られた電気用積層板のパンチング
加工性及び生産性を比較した結果は第１表に明白なよう
に本発明の電気用＠層板はよく本発明の電気用積層板の
優れていることを確認した。The results of comparing the punching workability and productivity of the electrical laminates obtained in Examples and Conventional Examples are shown in Table 1, as is clear from Table 1. Confirmed that it is excellent.
第 １ 表 注 来１ パンチング用金型により評価する。Table 1 note 1 Evaluation using a punching die.
帯２ 従来の生産性を１００とした場合の比較である。Band 2: This is a comparison when the conventional productivity is set as 100.
Claims (1)
リプレグを所要枚数重ね、更に必要に応じてその上、下
面に金属箔を載置した積層体を積層成形してなる電、気
用債層板において、積層板用基材として芳香族ポリアミ
ド繊維・ガラス繊維不織布１枚を用いたことを特徴とす
る電気用積層板。(1) A laminate formed by layer-molding a laminate in which a required number of prepregs are impregnated with a laminate resin and dried on a laminate base material, and if necessary, a metal foil is placed on the bottom surface. An electrical laminate, characterized in that an aromatic polyamide fiber/glass fiber nonwoven fabric is used as a base material for the laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17166883A JPS6063145A (en) | 1983-09-17 | 1983-09-17 | Laminated board for electricity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17166883A JPS6063145A (en) | 1983-09-17 | 1983-09-17 | Laminated board for electricity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6063145A true JPS6063145A (en) | 1985-04-11 |
Family
ID=15927480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17166883A Pending JPS6063145A (en) | 1983-09-17 | 1983-09-17 | Laminated board for electricity |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6063145A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010201170A (en) * | 2009-03-03 | 2010-09-16 | Dyson Technology Ltd | Floor tool |
-
1983
- 1983-09-17 JP JP17166883A patent/JPS6063145A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010201170A (en) * | 2009-03-03 | 2010-09-16 | Dyson Technology Ltd | Floor tool |
| US8214967B2 (en) | 2009-03-03 | 2012-07-10 | Dyson Technology Limited | Floor tool |
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