JPH03183194A - Multilayer printed-circuit board - Google Patents

Abstract

PURPOSE:To provide a multilayer printed-circuit board having high-frequency characteristics by laminating inner layers each having, on its upper and/or lower side, a resin layer that includes resin-impregnated fluororesin paper. CONSTITUTION:A desired number of inner layers are laminated and covered with cladding to form a multilayered printed-circuit board. The inner layer has, on its upper and/or lower side, a resin layer that includes fluororesin paper impregnated with resin. The fluororesin fiber may be made of resin: for example, trifluorochloroethylene, tetrafluoroethylene, tetrafluoroethylene- hexafluoropropylene copolymer, or tetrafluoroethylene-perfluorovinyl ether copolymer. The paper preferably has an elongation percentage of 150-350%. Below 150% the paper is liable to breaking, while above 350% it may have a residual strain, causing instability in dimension.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a multilayer wiring board used in nausea equipment, electronic equipment, computers, communication equipment, etc.

[Conventional technology]

Conventional multilayer wiring boards use paper or woven glass cloth, 7-enol resin, epoxy resin, etc. between inner layer materials and between inner layer materials and outer layer materials.
This multilayer wiring board is made by laminating and molding a laminate with a resin-impregnated base material made by impregnating and drying a polyimide resin. 5.0 when using glass cloth
1 Polyimide resin-impregnated glass cloth has a relatively large size of 4.0, so when used as a multilayer wiring board, the high frequency characteristics are insufficient, and restrictions are imposed on high frequency arithmetic circuits and communication equipment circuits. . For this reason, attempts have been made to use 79-element resin-impregnated kraft paper or glass woven cloth impregnated with 2-I resin, which are made by impregnating kraft paper or glass woven cloth with 79-element resin, but the Founo-element resin liquid is supplied in the form of an emulsion. Therefore, in order to attach the required resin to the base material, it takes time and effort to repeat the impregnation and drying process, and furthermore, it is necessary to heat the product to a temperature higher than the melting point of the fluororesin during product molding, so high temperature molding at 250°C or higher is required. There was a necessary problem.

[Problem that the invention seeks to solve]

As described in the conventional technology, a resin-impregnated base material in which kraft paper or glass woven cloth is impregnated with epoxy resin or polyimide resin is disposed between the inner layer materials and between the inner layer material and the outer layer material. The multilayer wiring board lacks high frequency characteristics.That's right, 1A
A multilayer wiring board formed by disposing a resin-impregnated base material in which kraft paper or glass woven cloth is impregnated with fluororesin in -q has low productivity h0 The present invention was made in view of the above problems in the conventional technology. The purpose of this is to provide a multilayer wiring board 4f that has excellent high frequency characteristics while maintaining its inherent properties.

[Means for solving problems]

The present invention provides resin 1-1 containing at least one resin-impregnated fluororesin paper on the upper and/or lower surfaces of the required number of inner layer materials.
This is a multilayer wiring board characterized by being made by integrating a laminate with an outer layer material interposed therebetween, so it has good high frequency characteristics and is highly productive except for the use of fluororesin as the impregnating resin. The present invention will be described in detail below.

Inner layer materials used in the present invention include woven fabrics, nonwoven fabrics, mats, paper, and other base materials made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. Materials include phenolic resin, cresol resin, epoxy resin, and unsaturated polyester mil! .

Impregnation and drying of resins such as melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, and other resins such as single, modified products, and mixtures of Tsukumoto resin. An electric circuit is formed on the metal foil of the electrical laminate, which is made by integrally disposing metal foil on the upper and/or lower surfaces of the required number of resin-impregnated base materials. As the resin layer, the above-mentioned resin-impregnated base material used in the production of electrical laminates can be used as is, and a coated sheet or film of the above-mentioned resin may also be used. At least 1 in the Tsukishima layer
It is necessary to use two sheets of resin-impregnated fluororesin paper. As a fluororesin paper, it is 37. Ethylene chloride resin, ethylene tetrafluoride resin, ethylene 9-tetrafluoride 67
Fluorocarbon paper made from fluororesin fibers such as ##propylene copolymer resin, tetrafluoroethylene perfluorohinyl ether copolymer resin, etc., and preferably has an elongation of 150 to 350%. Preferably eight.

If it is less than 150%, it will be easily damaged during handling (,
This is because if it exceeds 3504, distortion will remain during handling and dimensional stability will decrease. The outer layer material is copper, aluminum,
Single, alloy, or composite foils of iron, nickel, zinc, etc. are used, and if necessary, an adhesive layer can be provided on one side of the metal foil. In addition to metal foil, a single-sided metal-clad laminated sheet metal can also be used, and there is no particular limitation. As for the lamination and integration means, any method such as press, multi-stage press, multi-roll, double belt, pressureless heating, etc. can be selected, and is not particularly limited. This will be explained in part.

Example: A glass cloth base epoxy resin with a thickness of 0.5H An electric circuit is formed on both sides of the double-sided steel clad laminate.The upper and lower surfaces of the inner layer are made of a 47-J ethylene purple orovinyl ether copolymer resin. One sheet of resin-impregnated fluororesin paper obtained by impregnating a fluororesin paper with a polish of 400 microns and an elongation rate of 250 with an epoxy resin varnish containing a hardening agent so that the resin opening becomes 45 by weight after drying and drying. A 4-layer wiring board was obtained by lamination-molding at 170° C. for 90 minutes at 170° C. for a laminate with a fi-type specific strength of 30 kg/pp, in which steel foil with a thickness of 0.035 nm was interposed as an outer layer material.

Comparative Example 1 A glass woven fabric having a thickness of 0.2 fl was impregnated with a curing agent-containing epoxy resin varnish on the upper and lower surfaces of the same inner layer material as in Example so that the resin opening became 45 times thick after drying, and then dried. Two sheets of resin-impregnated glass woven cloth obtained by
A 4-layer wiring board & was obtained in the same manner as in the example except that an 8-layer body in which fl copper foil was disposed as an outer layer material was used.

Comparative Example 2 Tetra-1-p ethylene #
After drying, the fat emulsion was impregnated into a 2 ml+ glass woven cloth so that the resin opening became 45 layers thick, and two resin-impregnated glass woven cloths obtained by drying were interposed between each cloth. A rectangular body with a thickness of 0.035 m and provided as an outer layer of copper was molded at a specific force of 30 Kg/d and a temperature of 6 at 335°C.
A 4-layer wiring board was obtained by forming the layer for 0 minutes.

The performances of the multilayer wiring boards of Examples and Comparative Examples 1 and 2 are shown in Table 1.

note *This is the ratio when Comparative Example 1'11OO is used.

〔Effect of the invention〕

The present invention is constructed as described above. A multilayer wiring board having the configuration described in the claims has the effect of improving high frequency characteristics while maintaining productivity.

Claims (2)

[Claims] (1) It is characterized by being formed by integrating a laminate in which an outer layer material is arranged with a resin layer containing at least one resin-impregnated fluororesin paper interposed on the upper and/or lower surfaces of a required number of inner layer materials. multilayer wiring board. (2) The multilayer wiring board according to claim 1, wherein the fluororesin paper has an elongation rate of 150 to 350%.