JPS6064441A - 耐熱樹脂膜の形成方法 - Google Patents

耐熱樹脂膜の形成方法

Info

Publication number
JPS6064441A
JPS6064441A JP58171193A JP17119383A JPS6064441A JP S6064441 A JPS6064441 A JP S6064441A JP 58171193 A JP58171193 A JP 58171193A JP 17119383 A JP17119383 A JP 17119383A JP S6064441 A JPS6064441 A JP S6064441A
Authority
JP
Japan
Prior art keywords
resin film
heat
solution
resistant resin
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58171193A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0216007B2 (de
Inventor
Ken Ogura
謙 小椋
Yasushi Nakabo
中坊　康司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58171193A priority Critical patent/JPS6064441A/ja
Priority to US06/581,365 priority patent/US4528216A/en
Publication of JPS6064441A publication Critical patent/JPS6064441A/ja
Publication of JPH0216007B2 publication Critical patent/JPH0216007B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP58171193A 1983-02-24 1983-09-19 耐熱樹脂膜の形成方法 Granted JPS6064441A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58171193A JPS6064441A (ja) 1983-09-19 1983-09-19 耐熱樹脂膜の形成方法
US06/581,365 US4528216A (en) 1983-02-24 1984-02-17 Process for forming heat-resistant resin films of polyimide and organosilicic reactants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58171193A JPS6064441A (ja) 1983-09-19 1983-09-19 耐熱樹脂膜の形成方法

Publications (2)

Publication Number Publication Date
JPS6064441A true JPS6064441A (ja) 1985-04-13
JPH0216007B2 JPH0216007B2 (de) 1990-04-13

Family

ID=15918730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58171193A Granted JPS6064441A (ja) 1983-02-24 1983-09-19 耐熱樹脂膜の形成方法

Country Status (1)

Country Link
JP (1) JPS6064441A (de)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140973A (en) * 1977-05-13 1978-12-08 Sanyo Electric Co Ltd Forming method of semiconductor insulation film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140973A (en) * 1977-05-13 1978-12-08 Sanyo Electric Co Ltd Forming method of semiconductor insulation film

Also Published As

Publication number Publication date
JPH0216007B2 (de) 1990-04-13

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