JPS6065539A - ヒ−トシンクの製造方法 - Google Patents

ヒ−トシンクの製造方法

Info

Publication number
JPS6065539A
JPS6065539A JP59071655A JP7165584A JPS6065539A JP S6065539 A JPS6065539 A JP S6065539A JP 59071655 A JP59071655 A JP 59071655A JP 7165584 A JP7165584 A JP 7165584A JP S6065539 A JPS6065539 A JP S6065539A
Authority
JP
Japan
Prior art keywords
groove
heat sink
power transistor
tapered surface
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59071655A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0338746B2 (cs
Inventor
Kikuo Isoyama
磯山　貴久雄
Akira Kazami
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP59071655A priority Critical patent/JPS6065539A/ja
Publication of JPS6065539A publication Critical patent/JPS6065539A/ja
Publication of JPH0338746B2 publication Critical patent/JPH0338746B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59071655A 1984-04-10 1984-04-10 ヒ−トシンクの製造方法 Granted JPS6065539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59071655A JPS6065539A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59071655A JPS6065539A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Publications (2)

Publication Number Publication Date
JPS6065539A true JPS6065539A (ja) 1985-04-15
JPH0338746B2 JPH0338746B2 (cs) 1991-06-11

Family

ID=13466838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59071655A Granted JPS6065539A (ja) 1984-04-10 1984-04-10 ヒ−トシンクの製造方法

Country Status (1)

Country Link
JP (1) JPS6065539A (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128279A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Heat sink for resin-sealed semiconductor device and its manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128279A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Heat sink for resin-sealed semiconductor device and its manufacture

Also Published As

Publication number Publication date
JPH0338746B2 (cs) 1991-06-11

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