JPS6065591A - Jumper for connection - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a connection jumper used to connect conductor patterns provided on a substrate.

[Technical background of the invention]

When wiring a thick film hybrid IC board that crosses the conductor pattern provided on the board, it is necessary to solder a wire (conductor wire) as a jumper wire so as to straddle the conductor pattern. This is done by soldering connection jumpers made of metal pieces.

The cross-sectional view in FIG. 1 shows the state in which the jumper made of this metal piece is mounted. Conductor patterns 2 and 2' are formed on the board 1, and the conductor pattern ? 7. 2/ A jumper 3 made of a metal piece bent into a bridge shape at an appropriate height is soldered to the top using solder 4 to form intersecting wiring.

FIG. 2 is a perspective view showing the shape of this jumper 3.

In the figure, reference numeral 31 denotes a soldering surface, which is on the same plane and has a certain planar area (so that it can be self-aligned) for easy handling when soldering onto a board. The back surface of the soldering surface 31.31 is plated with solder, for example, to facilitate soldering to the conductor pattern. Between these soldering surfaces 31 and 31,
The bent portion 32 is bent into a draft shape so that other conductor patterns can pass through. This is because the jumper 3 made of such a metal piece can be soldered with the jumper 3 placed on the conductor pattern 21, z/ of the board 1.

Soldering is easier to work with than cross-wiring with wires.

[Problems with background technology]

By the way, in the jumper 3 as shown in FIG. 2, the conductor pattern that can be connected by this jumper 3 depends on the distance and width between the soldering surfaces 31 and 31. The distance and size of / and 2/ are determined.

However, the conductor patterns 2 that intersect with the jumpers 3 on the substrate I often vary in thickness and number. Therefore, when using the jumper 3 made of a metal piece, it is necessary to prepare a plurality of types of jumpers 3, resulting in an increase in the number of five-component types, complicating component management, and an increase in product cost.

For this reason, there are cases where the jumper 3 used is limited to the lfM type, but in such a case, the wiring may become long due to design constraints of the conductor patterns 2 and 21. A lot.

This also led to an increase in the area of the substrate, so it was preferable to carry it out.

[Purpose of the invention]

The present invention has been made in view of the above points, and provides a connection jumper that can support the connection of two types of conductors with one type of jumper, thereby increasing the number of component types and increasing the number of conductor/conductor connections. This is an attempt to ease the design limitations of the turn.

[Summary of the invention]

That is, in the connecting jack according to the present invention, a pair of first soldering surfaces provided at both ends of the metal piece, and first and second soldering surfaces provided on the metal piece between the first soldering surfaces are provided. 2 protrusions and a recessed part connecting the first and second medical exit parts, and the height from the first soldering surface to the first and second protrusions is equal to the height of the protrusions. The first and second protrusions form a second narrow solder surface higher than the height from the bottom of the recess to the bottom of the recess.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 is a perspective view showing an example of a connecting jack according to the present invention, in which a pair of flat first soldering surfaces 3a and Ja are provided at both ends of the metal piece, and this soldering surface ,9a
, 3a is bent toward the top of the figure, and a pair of first
and second protrusions 3b, 3b are formed. A recess 3C connecting the first and second protrusions 3b, 3b is formed in the middle of the first and second protrusions 3b, 3b.

The recessed portion 3C is connected to the first and second protrusions, 9b, 3
The first soldering surface 3a is bent shallower than the first soldering surface 3a,
The height h□ of the apex of the first and second protrusions 3b, 3b is larger than the height of the recessed part 3C as seen from the apex of the first and second protrusions 3b, 3b. Also, of course, the width E of the recessed portion 3C is smaller than the distance between the first soldering surface 3a and Ba.

FIG. 4 shows a state in which such a jumper 3 is mounted on the board 1. What is shown in Fig. 4 (a).

conductor pattern 2' to be connected by jumper 3;
2' is approximately 12, and the first soldering surface 3a
, 3a are soldered to the conductor patterns 2', 2'. At this time, the first and second protrusions Jb, ? Since the height of the bent portion of the recessed portion 3C is lower than that of the recessed portion 3C, the conductor pattern 2 passes between the first and second protrusions 3b and 3b without touching the recessed portion 3C.

On the other hand, FIG. 4(b) shows a case where the interval between the conductor patterns 2', 2' to be connected to the jumper 3 is about 1!1, and the first and the second
The peak of the protruding portion Jb, 3b is connected to the second Ushida attachment portion 3d, 3
d is soldered onto the conductor pattern 21°2'.

In this way, in the jumper 3 shown in FIG. 3, one jumper has a distance of 18 between the conductor patterns 7 and l! It becomes possible to connect conductor patterns at a distance of two.

Here, in order to facilitate attachment of the connection jumper 30 to the board 1, the connection jumper/3 has first soldering surfaces 3a, 3a and second soldering surfaces sd, 3d, or the entire surface of the jumper 3. It is good to apply solder plating to the parts etc. as appropriate.

Note that in a metal piece having a bent portion shaped as shown in FIG. 4, stress within the metal piece is likely to be alleviated. Therefore, the one shown in FIG. 4 can easily absorb stress such as thermal stress after soldering, and has high reliability as a jumper 3.

FIG. 5 shows a second embodiment of the invention. In this way, the cross section of the jumper 3 does not necessarily have to be bent into a rectangular shape, and although the soldering workability is inferior to that in FIG. 3, the curved eleventh second protrusion 3b,
3b or a recessed portion 3c may be provided.

Further, as shown in FIG. 6, the metal piece may be bent at an angle of 90'' or more.

Further, the planar shape of the jumper 3 is not limited to that shown in FIG. 3, and the width of the soldering surface portion may be made wider, for example.

In addition, in the above embodiment, the board on which the connection jumper is attached is assumed to be an M-film board for hybrid IC, but if the board has a conductor layer pattern on an insulating board, it can be used as a thick-film board for hybrid IC. It's not limited to the board.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to provide a connection jumper that can be used to connect two types of conductor patterns with one jumper, thereby achieving both standardization of component types and improvement in the degree of freedom in the design of conductor patterns. can do.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view showing how a conventional jumper is mounted on a board, Figure 2 is a perspective view showing the shape of a conventional jumper,
FIG. 3 is a perspective view showing a connection jumper according to an embodiment of the present invention, FIG. 4 is a sectional view showing a state in which the connection jumper shown in FIG. 3 is mounted on a board, and FIGS. 5 and 6 2A and 2B are cross-sectional views of connection jumpers according to other embodiments of the present invention, respectively. ! ...Substrate, 2,2'...Conductor pattern, 3...
Connection jumper? a, 9a...first soldering surface, 3b...protrusion, 3C...recess, 3d, 3d
...Second soldering surface. Applicant's agent Patent attorney Takehiko Suzue No. 4 (a) Figure 5 (b) Figure 6

Claims (1)

[Claims] a pair of first soldering surfaces provided at both ends of the metal piece; first and second protrusions provided on the metal piece between the first thin solder surfaces; a recessed portion connecting the protrusion of the first soldering surface to the first soldering surface.
and the height to the apex of the second protrusion is higher than the height from the apex of the protrusion to the bottom of the recess, and the first and second protrusions serve as a second soldering surface. A connection jumper characterized by: