JPH02155292A - How to solder a flexible board - Google Patents
How to solder a flexible boardInfo
- Publication number
- JPH02155292A JPH02155292A JP63309482A JP30948288A JPH02155292A JP H02155292 A JPH02155292 A JP H02155292A JP 63309482 A JP63309482 A JP 63309482A JP 30948288 A JP30948288 A JP 30948288A JP H02155292 A JPH02155292 A JP H02155292A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- solder
- flexible substrate
- conductor pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、アルミナ基板等にフレキシブル基板を半田付
けする半田付は方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a soldering method for soldering a flexible substrate to an alumina substrate or the like.
従来の技術
従来、アルミナ基板等にフレキシブル基板を半田付けす
る場合第３図、第４図に示すようにして半田付けされて
いた。2. Description of the Related Art Conventionally, when a flexible substrate is soldered to an alumina substrate or the like, the soldering process is as shown in FIGS. 3 and 4.
第３図、第４図において、１はアルミナ基板、２はフレ
キシブル基板、３はアルミナ基板１上に形成した銀−パ
ラジウムからなる電極、４は基板端部の電極３を残して
形成した保護ガラス、６嬬共晶半田のフィレット、６は
フレキシブル基板２の表面に形成した銅による導体パタ
ーン、７はアルミナ基板１の電極３とフレキシブル基板
２の導体パターン６を接続する共晶半田である。In Figures 3 and 4, 1 is an alumina substrate, 2 is a flexible substrate, 3 is an electrode made of silver-palladium formed on the alumina substrate 1, and 4 is a protective glass formed by leaving the electrode 3 at the edge of the substrate. , 6 eutectic solder fillets, 6 a copper conductor pattern formed on the surface of the flexible substrate 2, and 7 eutectic solder connecting the electrode 3 of the alumina substrate 1 and the conductor pattern 6 of the flexible substrate 2.
発明が解決しようとする課題
従来の半田付は方法では、フレキシブル基板２の導体パ
ターン６とアルミナ基板１の銀−パラジウムの電極３と
の間にできる共晶半田７のフィレット６が小さいため、
半田付は性が悪く、又強度も小さい。Problems to be Solved by the Invention In the conventional soldering method, the fillet 6 of the eutectic solder 7 formed between the conductor pattern 6 of the flexible substrate 2 and the silver-palladium electrode 3 of the alumina substrate 1 is small.
Soldering is poor and the strength is also low.
本発明は、これらの問題を解決し、半田付は性を向上さ
せ、半田付は強度を強くすることを目的とする。The present invention aims to solve these problems, improve soldering properties, and increase soldering strength.
課題を解決するための手段
この課題を解決するために本発明は、フレキシブル基板
の端部を導体パターンが外側Ｋ〈るように折り曲げ、基
板の電極に半田付けしたものである。Means for Solving the Problems In order to solve this problem, the present invention is such that the ends of a flexible substrate are bent so that the conductor pattern is on the outside, and soldered to the electrodes of the substrate.
作用
この方法により、共晶半田のフィレットが大きくなり、
半田付は性が向上し、半田付は強度も強くなることとな
る。This method increases the fillet size of the eutectic solder,
The soldering properties are improved, and the soldering strength is also increased.
実施例
第１図、第２図に本発明の一実施例を示しており、第１
図、第２図において第３図、第４図に示す部分と同一部
分については同一番号を付している。８はフレキシブル
基板２の端部を導体パターン６が外側にくるように折り
曲げて構成した接続部、９はこれによりできた共晶半田
のフィレットである。Embodiment FIGS. 1 and 2 show an embodiment of the present invention.
In FIGS. 3 and 2, the same parts as those shown in FIGS. 3 and 4 are designated by the same numbers. Reference numeral 8 indicates a connection portion formed by bending the end of the flexible substrate 2 so that the conductor pattern 6 is placed on the outside, and reference numeral 9 indicates a fillet of eutectic solder formed thereby.
この実施例によれば、フレキシブル基板２の端部を導体
パターン６が外側にくるように折り曲げることにより、
フレキシブル基板２の端部に導体パターン６の一部が表
出した接続部８が構成され、共晶半田７のフィレット９
が太きくなって半田付は性が向上し、半田付は強度も強
くなる。父、フィレット９が大きいため、目視による半
田付は作業も容易になるという効果も得られる。なお、
共晶半田７は、熱圧着による半田付は前に、あらかじめ
電極３、導体パターン６の少なくとも一方に付着させる
予備半田をしておくのが好ましい。According to this embodiment, by bending the end of the flexible substrate 2 so that the conductor pattern 6 is on the outside,
A connection part 8 in which a part of the conductor pattern 6 is exposed is formed at the end of the flexible substrate 2, and a fillet 9 of the eutectic solder 7 is formed.
The thicker the solder, the better the solderability and the stronger the solder. Since the fillet 9 is large, visual soldering can also be done easily. In addition,
Preferably, the eutectic solder 7 is pre-soldered to at least one of the electrode 3 and the conductor pattern 6 before soldering by thermocompression bonding.
発明の効果
以上のように本発明によれば、フレキシブル基板の端部
を導体パターンが外側にくるように折り曲げることによ
り、熱圧着方法で半田付けを行っても共晶半田のフィレ
ットが犬きくなるため、半田付けが簡単になり、半田付
は強度が強くなる。Effects of the Invention As described above, according to the present invention, by bending the end of the flexible board so that the conductor pattern is on the outside, the fillet of the eutectic solder becomes sharp even when soldering is performed by thermocompression bonding. Therefore, soldering becomes easier and the soldering becomes stronger.
これにより狭いピッチ間隔（ｏ、ｓ ｔｘピッチ）のパ
ターンでも半田付けが可能になる。This makes it possible to solder even patterns with narrow pitch intervals (o, stx pitch).
第１図は本発明の一実施例による半田付は方法を示す斜
視図、第２図は同断面図、第３図は従来の半田付は方法
による半田付は状態を示す斜視図、第４図は同断面図で
ある。
１・・・・・・アルミナ基板、２・・・・・・フレキシ
ブル基板、３・・・・・・電極、４・・・・・・保護ガ
ラス、６・・・・・・導体パターン、７・・・・・・共
晶半田、８・・・・・・接続部。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名１−
−アルミナ基板儀
２− フレ苓シプル暮伝
３−電 量
７−・−共晶子９
６８−−− ？ｌｌ郡
部３図
図FIG. 1 is a perspective view showing a soldering method according to an embodiment of the present invention, FIG. 2 is a sectional view of the same, FIG. 3 is a perspective view showing a conventional soldering method, and FIG. The figure is a sectional view of the same. DESCRIPTION OF SYMBOLS 1... Alumina substrate, 2... Flexible substrate, 3... Electrode, 4... Protective glass, 6... Conductor pattern, 7 ......eutectic solder, 8......connection part. Name of agent: Patent attorney Shigetaka Awano and 1 other person1-
-Alumina substrate 2-Furei Shipuru Kureden 3-Electrical capacity 7-・-eutectic 9 68----? ll county 3 map
Claims (1)
を導体パターンが外側にくるように折り曲げ、その端部
の導体パターンを別の基板の電極に半田により接続する
フレキシブル基板の半田付け方法。A method for soldering a flexible substrate, in which the end of a flexible substrate having a conductive pattern on its surface is bent so that the conductive pattern is on the outside, and the conductive pattern at the end is connected to an electrode of another substrate by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309482A JPH02155292A (en) | 1988-12-07 | 1988-12-07 | How to solder a flexible board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309482A JPH02155292A (en) | 1988-12-07 | 1988-12-07 | How to solder a flexible board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02155292A true JPH02155292A (en) | 1990-06-14 |
Family
ID=17993519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63309482A Pending JPH02155292A (en) | 1988-12-07 | 1988-12-07 | How to solder a flexible board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02155292A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1283664A3 (en) * | 2001-08-06 | 2004-10-20 | Delphi Technologies, Inc. | Flat conductor and process for making a solder connection therewith |
| JP2006245108A (en) * | 2005-03-01 | 2006-09-14 | Omron Corp | Flexible wiring board connection method and connection structure |
| JP2012195538A (en) * | 2011-03-18 | 2012-10-11 | Ricoh Co Ltd | Flexible wiring member, actuator, liquid discharge head, and image forming apparatus |
| JP2021028132A (en) * | 2019-08-09 | 2021-02-25 | キヤノン株式会社 | Liquid discharge head and liquid discharge device |
-
1988
- 1988-12-07 JP JP63309482A patent/JPH02155292A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1283664A3 (en) * | 2001-08-06 | 2004-10-20 | Delphi Technologies, Inc. | Flat conductor and process for making a solder connection therewith |
| JP2006245108A (en) * | 2005-03-01 | 2006-09-14 | Omron Corp | Flexible wiring board connection method and connection structure |
| JP2012195538A (en) * | 2011-03-18 | 2012-10-11 | Ricoh Co Ltd | Flexible wiring member, actuator, liquid discharge head, and image forming apparatus |
| JP2021028132A (en) * | 2019-08-09 | 2021-02-25 | キヤノン株式会社 | Liquid discharge head and liquid discharge device |
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