JPS6068657U - Cooling structure for semiconductor integrated circuit devices - Google Patents

Cooling structure for semiconductor integrated circuit devices

Info

Publication number
JPS6068657U
JPS6068657U JP1983161643U JP16164383U JPS6068657U JP S6068657 U JPS6068657 U JP S6068657U JP 1983161643 U JP1983161643 U JP 1983161643U JP 16164383 U JP16164383 U JP 16164383U JP S6068657 U JPS6068657 U JP S6068657U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
cooling
cooling structure
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983161643U
Other languages
Japanese (ja)
Inventor
正和 北川
牧野　好男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1983161643U priority Critical patent/JPS6068657U/en
Publication of JPS6068657U publication Critical patent/JPS6068657U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はクーリング・プレートを利用してプリント基板
に搭載した半導体集積回路装置を冷却する従来の構造を
概念的に示した断面図、第２図は本考案に基づいたプリ
ント基板搭載の半導体集積回路装置の冷却構造の一実施
例を概念的に示した側面図、第３図は本考案に基づいた
半導体集積回路装置の冷却構造の一実施例の内の冷却枝
の構造を示す断面図である。 図において、１はプリント基板、２は半導体集積回路装
置、３はクーリング・プレート、４は冷媒、５は伝熱コ
ンパウンド、６，７はクニリゾグ・プレートの継手、１
０は冷却枝、１１は冷却校本体、１２．１６は気密ゴム
リング、１３は可動体、１４は蔓巻きばね、１５は冷却
素子をそれぞれ示す。Figure 1 is a cross-sectional view conceptually showing a conventional structure for cooling a semiconductor integrated circuit device mounted on a printed circuit board using a cooling plate, and Figure 2 is a cross-sectional view of a semiconductor integrated circuit device mounted on a printed circuit board based on the present invention. FIG. 3 is a side view conceptually showing an embodiment of a cooling structure for a circuit device, and FIG. be. In the figure, 1 is a printed circuit board, 2 is a semiconductor integrated circuit device, 3 is a cooling plate, 4 is a refrigerant, 5 is a heat transfer compound, 6 and 7 are Kunilizog plate joints, 1
0 is a cooling branch, 11 is a cooling tube main body, 12, 16 is an airtight rubber ring, 13 is a movable body, 14 is a helical spring, and 15 is a cooling element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 冷媒により冷却されるクーリング・プレートと該クーリ
ング・プレートのの表面に、冷却対象の半導体集積回路
装置の各々に対応して設けられた冷却枝とより構成され
た冷却構造であって、前記冷却枝の各々がその軸方向に
滑動する自由継手と球座継手を備え、かつ前記冷却対象
の半導体集積回路装置の表面に熱的に接触する熱接触面
を有し、前記自由継手と球状継手により前記冷却枝の熱
接触面が冷却対象の前記半導体集積回路装置の表面に熱
的に密着するようにしたことを特徴とする半導体集積回
路装置の冷却構造。A cooling structure comprising a cooling plate cooled by a refrigerant and a cooling branch provided on the surface of the cooling plate corresponding to each semiconductor integrated circuit device to be cooled, the cooling branch each includes a free joint and a spherical joint that slide in the axial direction thereof, and has a thermal contact surface that thermally contacts the surface of the semiconductor integrated circuit device to be cooled, and the free joint and the spherical joint 1. A cooling structure for a semiconductor integrated circuit device, characterized in that a thermal contact surface of a cooling branch is in close thermal contact with a surface of the semiconductor integrated circuit device to be cooled.
JP1983161643U 1983-10-18 1983-10-18 Cooling structure for semiconductor integrated circuit devices Pending JPS6068657U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983161643U JPS6068657U (en) 1983-10-18 1983-10-18 Cooling structure for semiconductor integrated circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983161643U JPS6068657U (en) 1983-10-18 1983-10-18 Cooling structure for semiconductor integrated circuit devices

Publications (1)

Publication Number Publication Date
JPS6068657U true JPS6068657U (en) 1985-05-15

Family

ID=30355185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983161643U Pending JPS6068657U (en) 1983-10-18 1983-10-18 Cooling structure for semiconductor integrated circuit devices

Country Status (1)

Country Link
JP (1) JPS6068657U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135495U (en) * 1986-02-20 1987-08-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135495U (en) * 1986-02-20 1987-08-26

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