JPS6070182A - Electroless copper plating method - Google Patents
Electroless copper plating methodInfo
- Publication number
- JPS6070182A JPS6070182A JP17955083A JP17955083A JPS6070182A JP S6070182 A JPS6070182 A JP S6070182A JP 17955083 A JP17955083 A JP 17955083A JP 17955083 A JP17955083 A JP 17955083A JP S6070182 A JPS6070182 A JP S6070182A
- Authority
- JP
- Japan
- Prior art keywords
- copper plating
- electroless copper
- plated
- metal
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000010949 copper Substances 0.000 title abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract description 12
- 229910052802 copper Inorganic materials 0.000 title abstract description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 10
- 239000010959 steel Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 3
- 239000004744 fabric Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 239000012535 impurity Substances 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 239000005909 Kieselgur Substances 0.000 abstract 1
- 239000003086 colorant Substances 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- WXHIJDCHNDBCNY-UHFFFAOYSA-N palladium dihydride Chemical compound [PdH2] WXHIJDCHNDBCNY-UHFFFAOYSA-N 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 description 5
- 235000019441 ethanol Nutrition 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- MSWZFWKMSRAUBD-IVMDWMLBSA-N 2-amino-2-deoxy-D-glucopyranose Chemical compound N[C@H]1C(O)O[C@H](CO)[C@@H](O)[C@@H]1O MSWZFWKMSRAUBD-IVMDWMLBSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000013040 bath agent Substances 0.000 description 1
- MSWZFWKMSRAUBD-UHFFFAOYSA-N beta-D-galactosamine Natural products NC1C(O)OC(CO)C(O)C1O MSWZFWKMSRAUBD-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229960002442 glucosamine Drugs 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】 不発明は無電解鋼めっ＠法に関する。[Detailed description of the invention] The non-invention relates to the electroless steel plating method.
無電解鋼めっきは印刷配線板の分野で積層板等の絶縁基
板ＶＣ曲路τ形成するために広（用いらｎている。この
場合無電解鋼めっきが施さ扛ゐ閣は活性化、すなわち無
電解銅めっきのための触媒核が形成さｎゐ。この触媒核
忙中心にして、無電解鋼めっき液中の銅イオンが析出し
。Electroless steel plating is widely used in the field of printed wiring boards to form VC curves on insulating substrates such as laminates. In this case, the electroless steel plating is applied to activate, that is, to Catalyst nuclei for electrolytic copper plating are formed.Copper ions in the electroless steel plating solution precipitate around these catalyst nuclei.
成長して銅膜とな！ｌｌＬｇｌ路となる。絶縁基或を活
性化すゐために、無電解鋼めっきのための触媒となる金
属Ｐｄ’ｉｚ絶縁基板表面に形成さ一＋！：々。It grows into a copper film! It becomes llLgl path. In order to activate an insulating group, a metal Pd'iz that serves as a catalyst for electroless steel plating is formed on the surface of an insulating substrate. : etc.
従来この金ｆ４Ｐｄは、
Ｈ（ＩＩ
Ｐ ｄ Ｃ１−＋５ｎＣ１１−−Ｐｄ （０） ＋５ｎ
Ｃ１４の反応で侍らｎており、砂礫土などの担体に担持
さ扛触媒作用勿果すよう工夫されている。そのためＳｎ
、 Ｃｌ、などの不純ｖ！Ｊ忙多（宮むうえに担体τ
使用すゐため、接着剤などτさらに使用して、こＡＫａ
人さ一＋！：るため、アディティブ印刷配線板用の触媒
入Ｖ接瘤卸」付績膚板を製造する場合、そり、ねじｎが
発生し絶縁性に離点かありＳまたマルチワイヤ配想仮の
絶縁皮ふくした鋼線の絶縁皮膜には混入さゼゐことがで
きな刀・つた０
本発明は、このような点に鑑みてなさｒしたもので、１
価ノアル＝ −ルＫ Ｐ ｄ （ＩＩ） 、Ａｇ （１
） ｓ Ｃ可■）。Conventionally, this gold f4Pd is H(II P d C1-+5nC11--Pd (0) +5n
It is used in the reaction of C14, and is devised to achieve catalytic action when supported on a carrier such as sand and gravel. Therefore, Sn
, Cl, and other impurities v! J busy (Miyamuueni carrier τ
In order to use it, please use adhesive etc.
People are the best! : When manufacturing catalyst-containing V-joint plates for additive printed circuit boards, warping and screws occur, resulting in poor insulation properties. The present invention has been made in view of these points, and has the following features:
Value noal=-K P d (II), Ag (1
) s C possible■).
Ｃｕ （ＩＩ） 、Ｎｉ （ＩＩ） 化合物の少なくと
も−ｍｖｍ 解し得らｆ′した錯体荀混入した被めっき
物を無電解鋼めっき液に浸漬することτ特徴とす／ｂ無
篭解銅めっ＠法である。Characterized by immersing the object to be plated mixed with at least -mvm complexes of Cu (II) and Ni (II) compounds into an electroless steel plating solution. @ method.
すなわち不発明は、Ｐｄ （ＩＩ） 、 Ａｇ （＋）
、 Ｃ鳳１（１ハＣｕ （ＩＩ） 、 Ｎｉ （ＩＩ
） の化付物を単独または混合してメチルアルコール、
エチルアルコールナトの１価アルコールに溶解し錯体と
なした溶液盆用い。In other words, non-invention is Pd (II), Ag (+)
, C Otori 1 (1ha Cu (II), Ni (II
), either singly or in combination with methyl alcohol,
Uses a solution basin in which ethyl alcohol is dissolved in monohydric alcohol to form a complex.
この溶液を被めっき物の内部にあらかじめ混しておき、
こ几らの金属ｖ（０月曲となし、銅めっきの触媒となす
ことτ主眼とするもので６．６ｏこの溶液は、こ几らの
金属化合物の浴牌τ促進したり、また（０）価への還元
を促進するため也の添加物を言んでもよい０たとえは、
溶解盆促進するために水、酸、アルカリなどｔ添加して
もよい。また（０）倫に還元すること？促進する目的で
任意の還元剤τさらに加えることかでさる。たとえはグ
ルコース、アミノシラン、グルコサミン、アルデヒド類
などτ加えてもよい０こ扛らの金属と１１１１ｔｌアル
コールとの錯体の１価アルコールＫｆｃいす７）溶解度
は通常約１％程度であるか、こｎよジ少（でも十分なめ
っきの活性て付与することが可能であゐ０
アルコール溶液から（０）価の金属に還元式ｎゐ機構は
、たとえはＰｄ では
Ｈ
などのよつな戊応〒へてＰｄＣ１ｍがＣＨｘＣ）ｉＵ
Ｋ ＬＶ還元さｎ Ｐｄ （０） Ｖ（なるものと考え
ら７ｔていゐ。Mix this solution inside the object to be plated in advance,
The main purpose of this solution is to act as a catalyst for copper plating. ) may be used as an additive to promote the return to value.
Water, acid, alkali, etc. may be added to promote dissolution. Also (0) Giving back to Lun? An optional reducing agent τ may be further added for promoting purposes. For example, a monohydric alcohol Kfc of a complex of 0 metals such as glucose, aminosilane, glucosamine, and aldehydes to which τ may be added and 1111 tl alcohol7) The solubility is usually about 1%. However, it is possible to impart sufficient plating activity with a small amount of plating activity. PdC1m is CHxC)iU
K LV is reduced to n Pd (0) V (7t).
仮めっきｍｖｃ混入さゼゐとさは逸肖な方法または段階
で被めっき物にこの浴液で混入してセｆＬばよいＯ
Ｐｄ （ｎ） 、Ａｇ （１） 、 Ｃｕ （１）、Ｃ
ｕ （Ｉｌｌ 、 Ｎｉ叩の堪（例えば塩化物）’ｅ１
ｇｓ メタノール２００ｇ、水５０ｇτビーカーに佇框
し常伽で５０分撹拌し、そｎぞｎリイオン時有り倉色τ
肩すゐ俗敢を得、この溶液を例えば、次のようにして、
扱めっき物に混入する。If the temporary plating mvc is mixed in, the bath solution should be mixed into the object to be plated using a special method or step.
u (Ill, resistance to Ni attack (e.g. chloride)'e1
gs 200g of methanol, 50g of water τ Place in a beaker and stir for 50 minutes at a constant temperature.
For example, with this solution as follows,
Contaminates the plating materials being handled.
（１） この浴液τゴムーフェノール糸などの接層剤に
金属が０，１％となるよう権力ロ分散し、この接瘤剤ｔ
ガラス布にエポキシを含浸した接層仮に塗布し、加熱乾
燥し溶剤を揮散させる。(1) Power is dispersed in this bath solution τ rubber to a bonding agent such as phenolic thread so that the metal content is 0.1%, and this bonding agent t
Temporarily apply an adhesive layer impregnated with epoxy to glass cloth and heat and dry to evaporate the solvent.
この段階で上記金属は（（］）価となる。At this stage, the metal has a (()) valence.
（２）上記俗峨ダエボキシ樹脂のアセトン浴液中に金絹
が０．１％となるよう分散させたフェスτガラス布など
の基材に含浸させ通常の方法により槓７ｆｉＩ＆電製造
すゐとプリプレグの乾燥時、ま１ζは積層板の成形時に
１こｎらの金属は（０）１曲となり。(2) Gold silk is dispersed in the acetone bath solution of the above-mentioned Zokuada epoxy resin to a concentration of 0.1%, and impregnated into a base material such as Fes τ glass cloth, and prepreg is prepared using the usual method. When drying, 1ζ becomes 1 when forming a laminate. These metals become (0) 1 piece.
（５ン 上記溶液〒飽オロポリエステル街脂の有磯浴剤
欣甲に、金）！Ａ濃度が０．１％となるよう分散させ流
処法でフィルムを作ゐ。有機溶料の加熱味去中のカロ熱
により、金属（０）となる。(5 ml of the above solution: saturated oropolyester street oil bath agent, gold)! A film was made by dispersing the A concentration to 0.1% and using a flow process method. Metal (0) is produced by Calorhythm during heating and removal of the organic solvent.
（４）上記浴液〒ポリイミドのテトラヒドロ７ラン浴液
申Ｋ （４）項と同様分散させ銅線に被覆する０燭付け
と同時に金属（０）が住成し無電解鋼めっきＫたいする
活性が得らｎゐ。(4) The above bath solution is a polyimide tetrahydro-7 run bath solution, which is dispersed in the same manner as in item (4) and coated on the copper wire. At the same time as the candle is lit, the metal (0) is formed and becomes active for electroless steel plating. I can't get it.
＝５−
無電解鋼めっき液としては、例えは、銅イオン０．００
４〜０．２モル／ｌ、＠イオンの錯化剤０．００４〜１
モル／ｌ、還元剤０．０１〜０．２５モル／ｌおよびｐ
Ｈ２ｚ、ｏ〜１＆５にするに心安な倉の…調整剤、τ基
本組成として宮む、通常の無電解銅めっき腋が使用出来
ゐ○
浴液中ＶＣ含りｎ／）アルコールなどの物質は別個など
の工程により放散することかで′＠ゐ。この場合金鵬宮
有童は１％（ＴＬ重以下同じ）以下で特Ｋ Ｏ，１％以
下でも十分にその機能が発揮で＠ゐ０
以上納したように、不弘哨鶴求ｉ（ゞ４嚇・（１）生成
する金属（０）の粒子が細か（１溶液で卯合するので分
散もよい。このためすぐ扛た無電解銅めっ＠が侍らｎる
。=5- As an electroless steel plating solution, for example, copper ion 0.00
4-0.2 mol/l @ ion complexing agent 0.004-1
mol/l, reducing agent 0.01-0.25 mol/l and p
H2z, O ~ 1 & 5, safe...adjusting agent, τ as the basic composition, normal electroless copper plating armpit can be used ○ Contains VC in the bath liquid n/) Substances such as alcohol are separate Because it is dissipated through processes such as '@ゐ. In this case, Kinpeng Miya Yudo has a special KO with less than 1% (same as TL weight and below), and even with less than 1%, its function is fully demonstrated and it has delivered more than @゠0. (1) The particles of the metal (0) produced are fine (they are combined in one solution, so they are easily dispersed. For this reason, the electroless copper plating that is immediately removed is suitable).
（２）硅礫土のような担体が不安で、不純物の混入が少
ぐなる。(2) Supports such as quartz clay are unstable, and the contamination of impurities is reduced.
（５）酸性が強（ないので被めっき物に害となら６−(5) If the acidity is strong (it is not harmful to the plated object, 6-
Claims (1)
１） 、 Ｃｕ （Ｉ） −Ｃｕ （ｎ） 、 Ｎｉ
（ｎＪ 化合物（ｏ 少ｆｘ （７！：４ Ｍ ’ｃ
ｆ’６解し侍らｎた錯体盆混入した僅めっきｅ！Ｊ領無
電解鋼めっき液に浸漬することｔ時機とすめ無電′ｓｓ
ｌめっき法。1. Pd (II), Ag (
1), Cu(I)-Cu(n), Ni
(nJ compound (o small fx (7!:4 M'c
A small amount of plating mixed with f'6 and samurai complex tray! It is time to immerse the electroless steel in the J area electroless steel plating solution.
l plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17955083A JPS6070182A (en) | 1983-09-28 | 1983-09-28 | Electroless copper plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17955083A JPS6070182A (en) | 1983-09-28 | 1983-09-28 | Electroless copper plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6070182A true JPS6070182A (en) | 1985-04-20 |
Family
ID=16067702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17955083A Pending JPS6070182A (en) | 1983-09-28 | 1983-09-28 | Electroless copper plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6070182A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04235285A (en) * | 1990-10-30 | 1992-08-24 | Internatl Business Mach Corp <Ibm> | Novel method for seeding and plating polyimide |
-
1983
- 1983-09-28 JP JP17955083A patent/JPS6070182A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04235285A (en) * | 1990-10-30 | 1992-08-24 | Internatl Business Mach Corp <Ibm> | Novel method for seeding and plating polyimide |
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