JPS6073255U - flat semiconductor device - Google Patents
flat semiconductor deviceInfo
- Publication number
- JPS6073255U JPS6073255U JP16623683U JP16623683U JPS6073255U JP S6073255 U JPS6073255 U JP S6073255U JP 16623683 U JP16623683 U JP 16623683U JP 16623683 U JP16623683 U JP 16623683U JP S6073255 U JPS6073255 U JP S6073255U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- flat semiconductor
- leaf spring
- indicator
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａとｂは平形半導体装置の断面を含む正面図と側
面図である。第２図ａとｂは従来の平形半導体装置に用
いる加圧用板バネとインジケータの加圧前の正面図と側
面図である。第３図ａとｂは従来の平形半導体装置に用
いる加圧用板バネとインジケータの加圧後の正面図と側
面図である。
第４図ａとｂは本考案による一実施例の加圧用板バネと
インジケータの加圧前の正面図と側面図である。第５図
は本考案の一実施例による加圧用板バネとインジケータ
の加圧後の正面図と側面図である。
１・・・・・・平形半導体素子、２・・・・・・放熱体
、３・・・・・・絶縁板、４・・・・・・取付足、５・
・・・・・締付クランプ、６・・・・・・加圧用板バネ
、７′、７″・・・・・・締付ナツト、 。
８・・・・・・覗き穴、１０．１１・・・・・・インジ
ケータ、１２・・・・・・ケガキ線、１３・・・・・・
定規。1A and 1B are a front view and a side view including a cross section of a flat semiconductor device. FIGS. 2a and 2b are a front view and a side view of a pressurizing leaf spring and an indicator used in a conventional flat semiconductor device before being pressurized. 3A and 3B are a front view and a side view of a pressurizing leaf spring and an indicator used in a conventional flat semiconductor device after being pressurized. FIGS. 4a and 4b are a front view and a side view of the pressurizing leaf spring and indicator before pressurization according to an embodiment of the present invention. FIG. 5 is a front view and a side view of a pressurizing leaf spring and an indicator after being pressurized according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Flat semiconductor element, 2... Heat sink, 3... Insulating plate, 4... Mounting foot, 5...
...Tightening clamp, 6...Press plate spring, 7', 7''...Tightening nut, 8...Peep hole, 10.11 ...Indicator, 12...Scrib line, 13...
ruler.
Claims (1)
板バネを用いて加圧接触させた平形半導体装置において
、前記板バネは少なくとも板バネ本体とインジケータか
ら構成され、前記インジケータはゼロ（０）検出を板バ
ネ本体の下部で、また加圧検出を板バネ本体の上部で可
能な様にしたことを特徴とする平形半導体装置。' In a flat semiconductor device in which a flat semiconductor element and a plurality of heat radiators are brought into pressure contact in one direction using a leaf spring, the leaf spring is composed of at least a leaf spring body and an indicator, and the indicator is zero ( 0) A flat semiconductor device characterized in that detection is possible at the lower part of the leaf spring body, and pressure detection is possible at the upper part of the leaf spring body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16623683U JPS6073255U (en) | 1983-10-27 | 1983-10-27 | flat semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16623683U JPS6073255U (en) | 1983-10-27 | 1983-10-27 | flat semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6073255U true JPS6073255U (en) | 1985-05-23 |
Family
ID=30363986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16623683U Pending JPS6073255U (en) | 1983-10-27 | 1983-10-27 | flat semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6073255U (en) |
-
1983
- 1983-10-27 JP JP16623683U patent/JPS6073255U/en active Pending
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