JPS607468Y2 - Chip type aluminum electrolytic capacitor - Google Patents
Chip type aluminum electrolytic capacitorInfo
- Publication number
- JPS607468Y2 JPS607468Y2 JP13286079U JP13286079U JPS607468Y2 JP S607468 Y2 JPS607468 Y2 JP S607468Y2 JP 13286079 U JP13286079 U JP 13286079U JP 13286079 U JP13286079 U JP 13286079U JP S607468 Y2 JPS607468 Y2 JP S607468Y2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- substrate
- aluminum electrolytic
- type aluminum
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 title claims description 40
- 229910052782 aluminium Inorganic materials 0.000 title claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000003792 electrolyte Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 238000001723 curing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 238000004880 explosion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- -1 benzoin alkyl ether Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
本考案はチップ型アルミニウム電解コンデンサに関する
。[Detailed Description of the Invention] The present invention relates to a chip-type aluminum electrolytic capacitor.
近年、電子回路およびシステムにおける進歩は外部リー
ド線を最少限度にすることにより単位体積当たり最大限
度の容量を有し、かつ回路基板へ自動搭載しうる外形を
有するチップ型コンデンサの開発が要望されてきた。In recent years, advances in electronic circuits and systems have created a need for the development of chip-type capacitors that have maximum capacitance per unit volume by minimizing external lead wires, and have a shape that allows automatic mounting on circuit boards. Ta.
従来、上述の特徴をもつコンデンサとしてタンタル固体
’[解コンデンサやセラミックコンデンサが実用化され
ているが、アルミニウム電解コンデンサのようにペース
ト状の電解液をコンデンサ素子に浸み込ませるものにあ
っては該素子の表面に電解液が付着しているため合成樹
脂での成型がきわめて困難であり、かつ成型時に150
〜200℃の高熱が直接素子に加わるため誘電体酸化皮
膜の劣化や電解液の損失をきたしコンデンサの電気的特
性が不安定となり、しかも構造上防爆機能を付与するこ
とが困難であり、チップ型アルミニウム!解コンデンサ
はまだ実用化されていない。Conventionally, tantalum solid capacitors and ceramic capacitors have been put into practical use as capacitors with the above-mentioned characteristics. Because the electrolyte adheres to the surface of the element, it is extremely difficult to mold it with synthetic resin, and it is difficult to mold it with synthetic resin.
High heat of ~200°C is directly applied to the device, which causes deterioration of the dielectric oxide film and loss of electrolyte, making the electrical characteristics of the capacitor unstable.Moreover, it is difficult to provide an explosion-proof function due to the structure, and chip type aluminum! capacitors have not yet been put into practical use.
また実開昭54−5484吋公報のように電極を積層構
造としたチップ型アルミニウム電解コンデンサも提案さ
れているが、積層構造のため比較的静電容量が小さく大
容量のものが得にくいうえ、製造作業が煩雑で自動化で
きず高価となり、かつこの構成では防爆機能は付与でき
ないなどの欠点があった。In addition, chip-type aluminum electrolytic capacitors with electrodes in a laminated structure have been proposed, as in Japanese Utility Model Application Publication No. 54-84-1983, but because of the laminated structure, the capacitance is relatively small and it is difficult to obtain a large capacity. The manufacturing process is complicated and cannot be automated, making it expensive, and this configuration has drawbacks such as not being able to provide explosion-proof functionality.
本考案は上記のような事情に鑑みてなされたもので、あ
らかじめペースト状の電解液を含浸した巻回型コンデン
サ素子の表面に紫外線硬化樹脂層を形成したのち、基板
上にのせてリード端子を外部端子に接続し合威樹脂威型
で外装を被覆し該外装に溝を設けることによって直接素
子に高熱が加わるのを避けるとともに、防爆機能を有し
大容量で製造が容易な電気的特性の安定したチップ型ア
ルミニウム電解コンデンサを提供せんとするものである
。The present invention was developed in view of the above-mentioned circumstances. After forming an ultraviolet curable resin layer on the surface of a wound capacitor element that has been impregnated with a paste-like electrolyte, it is placed on a substrate and lead terminals are attached. By connecting to external terminals and covering the exterior with a synthetic resin mold, and providing grooves in the exterior, high heat is not directly applied to the element, and the electrical characteristics are explosion-proof, large capacity, and easy to manufacture. The purpose is to provide a stable chip-type aluminum electrolytic capacitor.
以下本考案の一実施例につき図面を参照しながら説明す
る。An embodiment of the present invention will be described below with reference to the drawings.
すなわち第1図および第2図に示すように、あらかじめ
ペースト状の駆動用電解液を含浸した巻回型コンデンサ
素子1を紫外線硬化樹脂に浸漬するかまたはスプレー塗
布により表面に紫外線硬化樹脂層2を形成する。That is, as shown in FIGS. 1 and 2, a wound capacitor element 1 impregnated in advance with a paste-like driving electrolyte is immersed in an ultraviolet curing resin or a UV curing resin layer 2 is applied to the surface by spray coating. Form.
前記紫外線硬化樹脂としては反応性の主要部を受は持つ
アクリル基と硬化後のすぐれた物性を与えるエポキシ樹
脂からなるエポキシアクリレートなどが適しており、硬
化はラジカル重合を主体とし成分中に光増感剤としてベ
ンゾインアルキルエーテル系、アントラキノン系、ベン
ゾフェノン系などを含有するものである。Suitable examples of the UV-curable resin include epoxy acrylate, which is composed of an acrylic group that has a reactive main part and an epoxy resin that provides excellent physical properties after curing. It contains a benzoin alkyl ether type, anthraquinone type, benzophenone type, etc. as a sensitizer.
前記紫外線硬化樹脂層2を形威したのち、直ちに例えば
365nmを主波長とする高圧水銀ランプまたは300
〜450nmの長波長のメタルハライドランプにより紫
外線を照射し8ow/Cmの出力で5〜10秒程度で急
速に硬化させる。Immediately after forming the ultraviolet curable resin layer 2, a high pressure mercury lamp having a main wavelength of 365 nm or a 300 nm
It is irradiated with ultraviolet rays using a metal halide lamp with a long wavelength of ~450 nm, and is rapidly cured in about 5 to 10 seconds at an output of 8 ow/Cm.
この場合、ランプは180°隔てた二方向から同時に照
射するように配置するか、コンデンサ素子1を回転させ
て均一に光があたるようにする。In this case, the lamps may be arranged so that they emit light from two directions 180° apart, or the capacitor element 1 may be rotated so that the light is uniformly applied.
つぎに該コンデンサ素子1を一対の外部端子3を成型、
インサート、溶着または貼付けなどの方法で一体に取着
した合成樹脂またはセラミックスなどからなる基板4に
載置し、前記外部端子3にコンデンサ素子1から導出し
たリード端子5を溶接などの方法で接続する。Next, the capacitor element 1 is molded into a pair of external terminals 3,
It is placed on a substrate 4 made of synthetic resin or ceramics that is integrally attached by inserting, welding, or pasting, and the lead terminal 5 led out from the capacitor element 1 is connected to the external terminal 3 by a method such as welding. .
しかるのち基板4上のコンデンサ素子1をトランスファ
ー成型、注型、射出成型などの方法により合成樹脂で成
型し外装6を被覆してなるものである。Thereafter, the capacitor element 1 on the substrate 4 is molded with synthetic resin by a method such as transfer molding, casting, injection molding, etc., and is covered with an exterior 6.
この場合、該外装6には周囲に凹状またはv字状の溝7
を設け、過電圧印加または温度上昇などによって前記コ
ンデンサ素子1からガスが発生し内部のガス圧が高くな
った際、該溝7に亀裂を生じせしめ爆発を未然に防ぐた
めの防爆機能を付与しておくものである。In this case, the outer sheath 6 has a concave or V-shaped groove 7 on its periphery.
is provided, and when gas is generated from the capacitor element 1 due to overvoltage application or temperature rise, etc., and the internal gas pressure increases, the groove 7 is provided with an explosion-proof function to prevent cracks from forming and an explosion. It is something to keep.
該溝7は外装6の周囲全体に設けてもよいし、基板4と
相対向する上面にだけ設けてもよい。The groove 7 may be provided all around the exterior 6, or may be provided only on the upper surface facing the substrate 4.
また外装6の側面に設けても同効である。Moreover, the same effect can be obtained even if it is provided on the side surface of the exterior 6.
また外部端子3は1フレーム数川端子を有するリードフ
レーム方式を採り、数10フレームを一括して成型し外
装6を被覆し、最後にリードフレームから端子部を切断
するようにすれば量産に好適する。In addition, the external terminal 3 adopts a lead frame method with several terminals per frame, and is suitable for mass production if several tens of frames are molded at once, covered with the exterior 6, and finally the terminal part is cut from the lead frame. do.
さらに基板4は第3図A、 Bに示すように、コンデン
サ素子1の形状に合致する半円柱状の凹部を形威してあ
り、該凹部の両端面に係止部8と両側面に翼部9を設け
てコンデンサ素子1が載置しやすい形状に加工しておけ
ば成型が容易である。Furthermore, as shown in FIGS. 3A and 3B, the substrate 4 has a semi-cylindrical recess that matches the shape of the capacitor element 1, and has locking parts 8 on both end faces of the recess and wings on both sides. Molding is easy if the portion 9 is provided and the capacitor element 1 is shaped into a shape in which the capacitor element 1 can be easily placed.
この場合、翼部9は両側面の一部に1箇所または数箇所
形成してもよい。In this case, the wing portion 9 may be formed at one or several locations on a portion of both side surfaces.
このように構成したチップ型アルミニウム電解コンデン
サは、紫外線硬化樹脂に紫外線を照射し、外面側から急
速に硬化させるものであるから、樹脂と電解液の混合や
、混合によって硬化しなくなったり、またはコンデンサ
素子から樹脂が剥脱したりすることがない。In chip-type aluminum electrolytic capacitors constructed in this way, the ultraviolet curing resin is irradiated with ultraviolet rays and is rapidly cured from the outside surface. The resin will not peel off from the element.
そしてコンデンサ素子1に紫外線硬化樹脂層2を形威し
たので、成型時に直接高熱が加わることがなく誘電体酸
化皮膜の劣化や電解液の損失がほとんどないため、電気
的特性の安定したコンデンサを得ることができる。Since the ultraviolet curing resin layer 2 is formed on the capacitor element 1, high heat is not directly applied during molding, and there is almost no deterioration of the dielectric oxide film or loss of the electrolyte, resulting in a capacitor with stable electrical characteristics. be able to.
万一ガス圧が高くなっても溝7により防爆機能を付与し
ているので、爆発を未然に確実に防ぐことができる。Even if the gas pressure becomes high, the groove 7 provides an explosion-proof function, so an explosion can be reliably prevented.
しかも従来のコンデンサ素子1をそのまま使用すること
ができるため、大容量のチップ型アルミニウム電解コン
デンサが得られる。Furthermore, since the conventional capacitor element 1 can be used as is, a large capacity chip-type aluminum electrolytic capacitor can be obtained.
また製造作業もきわめて簡単で自動化が可能であるため
安価な大量生産に好適するものである。Furthermore, the manufacturing process is extremely simple and can be automated, making it suitable for inexpensive mass production.
以上詳述したように、本考案によればコンデンサ素子に
紫外線硬化樹脂層を形威し外部端子を取着した基板に載
置し、前記コンデンサ素子から導出したリード端子を外
部端子に接続したのち前記基板上のコンデンサ素子を合
成樹脂で成型し外装に溝を設けたことによってコンデン
サの電気的特性が安定腰ガス圧が高くなった場合でも防
爆機能が動作し確実に爆発を防ぐことができ、かつ大容
量のチップ型コンデンサが得られ、しかも自動化が可能
で安価な大量生産に好適するチップ型アルミニウム電解
コンデンサを提供することができる。As described in detail above, according to the present invention, a capacitor element is coated with an ultraviolet curing resin layer, placed on a substrate with external terminals attached, and the lead terminals led out from the capacitor element are connected to the external terminals. By molding the capacitor element on the substrate with synthetic resin and providing grooves on the exterior, the electrical characteristics of the capacitor are stable.Even if the gas pressure becomes high, the explosion-proof function operates and can reliably prevent an explosion. Furthermore, it is possible to provide a chip-type aluminum electrolytic capacitor that can be automated, is suitable for mass production at low cost, and has a large capacity.
第1図は本考案の一実施例に係るチップ型アルミニウム
電解コンデンサを示す断面図、第2図はその側断面図、
第3図A、 Bは本考案の他の実施例における基板を示
すものでAは断面図、Bは側断面図である。
1・・・・・・コンデンサ素子、2・・・・・・紫外線
硬化樹脂層、3・・・・・・外部端子、4・・・・・・
基板、5・・・・・・リード端子、6・・・・・・外装
、7・・・・・・溝、8・・・・・・係止部、9・・・
・・・翼部。FIG. 1 is a sectional view showing a chip-type aluminum electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is a side sectional view thereof,
3A and 3B show a substrate according to another embodiment of the present invention, where A is a sectional view and B is a side sectional view. 1... Capacitor element, 2... Ultraviolet curing resin layer, 3... External terminal, 4...
Board, 5... Lead terminal, 6... Exterior, 7... Groove, 8... Locking part, 9...
...wing section.
Claims (3)
デンサ素子と、該コンデンサ素子の表面に形成した紫外
線硬化樹脂層と、前記コンデンサ素子を載置した基板と
、該基板に一体に取着され前記リード端子と接続した外
部端子と、前記基板上のコンデンサ素子を成型被覆した
外装と、該外装に設けた溝とを具備したことを特徴とす
るチップ型アルミニウム電解コンデンサ。(1) A wound type capacitor element with lead terminals led out and impregnated with electrolyte, an ultraviolet curing resin layer formed on the surface of the capacitor element, a substrate on which the capacitor element is mounted, and an integrally mounted capacitor element on the substrate. 1. A chip-type aluminum electrolytic capacitor, comprising: an external terminal attached to the substrate and connected to the lead terminal; an outer casing formed by molding and covering a capacitor element on the substrate; and a groove provided in the outer casing.
の凹部を有し、該凹部の両端面に係止部と両側面に翼部
を設けたものであることを特徴とする実用新案登録請求
の範囲第1項に記載したチップ型アルミニウム電解コン
デンサ。(2) Registration of a utility model characterized in that the substrate has a semi-cylindrical recess that matches the shape of the capacitor element, and that the recess has locking parts on both end faces and wing parts on both sides. A chip-type aluminum electrolytic capacitor according to claim 1.
する実用新案登録請求の範囲第1項または第2項記載の
チップ型アルミニウム電解コンデンサ。(3) The chip-type aluminum electrolytic capacitor according to claim 1 or 2, characterized in that a groove is provided on the top or side surface of the exterior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13286079U JPS607468Y2 (en) | 1979-09-25 | 1979-09-25 | Chip type aluminum electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13286079U JPS607468Y2 (en) | 1979-09-25 | 1979-09-25 | Chip type aluminum electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5651342U JPS5651342U (en) | 1981-05-07 |
| JPS607468Y2 true JPS607468Y2 (en) | 1985-03-13 |
Family
ID=29364459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13286079U Expired JPS607468Y2 (en) | 1979-09-25 | 1979-09-25 | Chip type aluminum electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS607468Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58193671U (en) * | 1982-06-17 | 1983-12-23 | 富士通株式会社 | photo drawing machine |
-
1979
- 1979-09-25 JP JP13286079U patent/JPS607468Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5651342U (en) | 1981-05-07 |
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