JPS607490Y2 - Ultra high frequency circuit mounting structure - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an ultra-high frequency circuit mounting structure that has good ultra-high frequency transmission characteristics in mounting a microstrip substrate and an ultra-high frequency semiconductor.

With the development of semiconductor technology, semiconductor elements that can operate in an ultra-high frequency band of 4GH2 or higher have recently been developed and put into practical use.

In order to maintain good ultra-high frequency transmission characteristics of the signal input/output terminals in this semiconductor case, a flat pack package with the signal input/output terminals parallel to the bottom surface is optimal.

Conventionally, when connecting a semiconductor flat-pack package that operates in a high frequency band to a microstrip substrate, the semiconductor package was soldered directly on the substrate, or the semiconductor package was soldered between the two substrates, as shown in Figure 1a and b. was implemented.

In the figure, 1 is a high frequency semiconductor package, 2 is a signal input/output terminal, 3 is a soldering part, 4 is a surface conductor or line conductor of a microstrip board, 5 is a microstrip board, and 6 is a case.

In the case of a super high frequency semiconductor in which an internal matching circuit is mounted within the semiconductor package, the package height is several times thicker than that of a microstrip substrate.

However, in order to couple and connect the ultra-high frequency semiconductor and the microstrip substrate, it is necessary to bend the signal input/output terminals or to sit down the part where the ultra-high frequency semiconductor is to be attached.

In the former case, the connection distance between the center conductor of the signal input/output terminal and the top conductor of the microstrip board increases, and in the latter case, a gap is created between the case and the side where the signal input/output terminal of the ultra-high frequency semiconductor is provided, and the microstrip board Since the distance between the back ground and the boundary between the external conductor and the insulator of the signal input/output terminal of the ultra-high frequency semiconductor is increased, each has the disadvantage of deteriorating the ultra-high frequency transmission characteristics.

The purpose of the present invention is to solve this drawback by connecting the boundary between the external conductor and insulator of the signal input/output terminal of the ultra-high frequency semiconductor and the back surface of the microstrip board through the shortest possible distance. The object of the present invention is to provide an ultra-high frequency circuit mounting structure that can obtain ultra-high frequency transmission characteristics.

The present invention will be described in detail with reference to the drawings below.

2 is a side sectional view of an embodiment of the present invention, and FIG. 3 is a perspective sectional view of FIG. 2, and the same numbers as in FIG. 1 indicate the same components.

In addition, 10 is a finger spring, 11 is an insulator, 1
2 is a set screw.

In this configuration, as shown in FIG. 4, a finger spring 10 having a screw hole 13 is attached to a cyclostrip board 5.
The finger spring 10 is inserted between the case 6 and the case 6, and is fixed with a screw 12 with the tip of the finger spring 10 slightly protruding from the counterbore side surface of the case 6.

This amount of protrusion is such that when the semi-moving body package 1 for ultra-high frequency is attached to the counterbore part number of the case 6, the tip of the finger spring 10 will surely come into contact with the side surface of the semiconductor package 1 for ultra-high frequency. The amount of deformation should be small and the level should be maintained almost horizontal.

With this configuration, when the ultra-high frequency semiconductor package 1 is attached to the counterbore of the case 6, the tip of the finger spring 10 can be reliably electrically connected to the external metal of the ultra-high frequency semiconductor. Make it.

Therefore, when there is no finger spring 10, the connection length between the ultra-high frequency semiconductor and the back surface ground of the microstrip board is the counterbore side of the case, the gap between the ultra-high frequency semiconductor and the case, and the distance from the bottom of the ultra-high frequency semiconductor to the insulator 11. However, when the spring 10 is attached, the distance between the ultra-high frequency semiconductor and the counterbore side of the case can be shortened.

As explained above, when connecting an ultra-high frequency semiconductor and a microstrip substrate, the center conductor of the signal input/output terminal and the ground distance can be connected with the shortest distance, so good transmission characteristics can be maintained even in the ultra-high frequency band. It becomes possible.

[Brief explanation of the drawing]

1a and 1b are side sectional views of a conventional ultra-high frequency semiconductor circuit device, FIG. 2 is a side sectional view of an embodiment of the present invention, FIG. 3 is a perspective sectional view of FIG. 2, and FIG. FIG. 3 is a perspective view of the finger spring of FIG. 2; In the figure, 1... High frequency semiconductor package, 2...
...Signal input/output terminal, 3...Solder sealing part, 4.
...Microstrip board surface conductor, 5...
...Microstrip board, 6...Case, 10...Finger spring, 11...
...Insulator, 12...Screw, 13...
・It is a screw hole.

Claims (1)

[Scope of utility model registration request] The substrate and the circuit element are arranged on a conductor case having a recess provided at the location where the circuit element is arranged so that the conductor line of the microstrip substrate and the center conductor of the ultra-high frequency circuit element are directly connected. In the ultra-high frequency circuit mounting structure provided, a thin elastic conductive plate having a slot at the tip is inserted between the substrate and the conductor case near an end of the substrate facing the center conductor of the circuit element. An ultra-high frequency circuit mounting structure characterized in that the outer conductor near the center conductor of the circuit element and the tip of the conductive plate are in contact with each other.