JPH01190104A - High frequency oscillator - Google Patents
High frequency oscillatorInfo
- Publication number
- JPH01190104A JPH01190104A JP63014911A JP1491188A JPH01190104A JP H01190104 A JPH01190104 A JP H01190104A JP 63014911 A JP63014911 A JP 63014911A JP 1491188 A JP1491188 A JP 1491188A JP H01190104 A JPH01190104 A JP H01190104A
- Authority
- JP
- Japan
- Prior art keywords
- ground electrode
- printed circuit
- circuit board
- board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
竜業上の利用分野
本発明は自動車電話及びコードレス電話等に使用する高
周波発振装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a high frequency oscillator used in car phones, cordless phones, and the like.
従来の技術
従来のマイクロストリップラインで構成された発振回路
を有する高周波発振装置は、第２図のような構造になっ
ていた。2. Description of the Related Art A conventional high frequency oscillation device having an oscillation circuit constructed of microstrip lines has a structure as shown in FIG.
すなわち、発振回路部とアンプ回路を小形化を図るため
、′／Ｃプリント基板１６とプリント基板１８とだ発振
回路とアンプ回路を分割するように各種チップ部品１４
．１９を実装し上下の回路を接続用端子２３で電気的に
接続していた。That is, in order to downsize the oscillation circuit section and the amplifier circuit, various chip components 14 are installed on the '/C printed circuit board 16 and the printed circuit board 18 to separate the oscillation circuit and the amplifier circuit.
．． 19 was mounted, and the upper and lower circuits were electrically connected by connection terminals 23.
又プリント基板１６とプリント基板１８は接地電極１６
．１７を相対する位置に配置し、外部とシールドするた
め（（義足２０を有するシールドケース２２に底板２４
をハンダ付等で接続固定し、この底板２４には外部接続
用端子２１．２５が通過するため穴が設けられている。Further, the printed circuit board 16 and the printed circuit board 18 are connected to the ground electrode 16.
．． 17 in opposing positions to shield it from the outside ((a bottom plate 24 is attached to the shield case 22 having the prosthetic leg 20).
are connected and fixed by soldering or the like, and holes are provided in the bottom plate 24 through which external connection terminals 21 and 25 pass.
この外部接続用端子２１．２５がシールドされていない
ため、この外部接続用端子２１．２５がアンテナとなシ
ミ波が飛び込むため一般的に貫通コンデンサ２６を有す
る端子が使用され、貫通コンデンサ２ｅのアース側の電
極が底板２４にハンダ付され高周波発振装置を構成して
いた。Since this external connection terminal 21.25 is not shielded, this external connection terminal 21.25 acts as an antenna and the stain waves jump in. Therefore, a terminal with a feedthrough capacitor 26 is generally used, and the ground of the feedthrough capacitor 2e is The side electrodes were soldered to the bottom plate 24 to constitute a high frequency oscillator.
発明が解決しようとする課題
しかし、このような構造のものでは外部と完全シールド
するためて底板２４を設け、かつ外部接続用端子２１．
２５の穴があシ、この部分がシールドされないため貫通
コンデンサ２６を使用する必要があシ形状が大きくなり
作業性も悪くコストアンプとなる問題があった。Problems to be Solved by the Invention However, in such a structure, a bottom plate 24 is provided for complete shielding from the outside, and external connection terminals 21.
Since the hole 25 is not shielded, it is necessary to use a feedthrough capacitor 26, which results in a large shape, poor workability, and an increase in cost.
課題を解決するための手段
そして上記課題を解決する本発明の技術的な手段は、プ
リント基板の配置を外周面が全面接地電極になるような
構造にしたものである。A means for solving the problem and a technical means of the present invention for solving the above-mentioned problem is that the printed circuit board is arranged so that the entire outer peripheral surface becomes a ground electrode.
作用 この技術的手段による作用は次のようになる。action The effect of this technical means is as follows.
すなわち、上部、及び下部のプリント基板の接地電翫面
を下面方向に取付は上部と下部の回路はこの接地電極に
よシ遮断され不必要な結合がなくなるため安定な特性が
得られ、かつ、下部のプリント基板の接地電極とシール
ドケースを電気的に接続することによシ発振回路及びア
ンプ回路が完全シールドされ外部から電波の飛込みが防
止できることになる。That is, when the grounding electrode surfaces of the upper and lower printed circuit boards are mounted in the downward direction, the upper and lower circuits are cut off by the grounding electrodes, eliminating unnecessary coupling, resulting in stable characteristics. By electrically connecting the ground electrode of the lower printed circuit board and the shield case, the oscillation circuit and amplifier circuit are completely shielded, and radio waves can be prevented from entering from the outside.
実施例
以下、本発明の一実施例を添付図面に基づいて説明する
。第１図においてプリント基板１２の上部面にマイクロ
ストリップラインで構成された発振素子及び発振回路の
一部をチップ部品３とプリント基板配線部２で構成し、
このプリント基板１２の他面には接地電極６を設ける。EXAMPLE Hereinafter, an example of the present invention will be described based on the accompanying drawings. In FIG. 1, a part of the oscillation element and the oscillation circuit formed by a microstrip line are formed on the upper surface of a printed circuit board 12 by a chip component 3 and a printed circuit board wiring section 2,
A ground electrode 6 is provided on the other surface of the printed circuit board 12.
２つ目のプリント基板９の上部には発振回路の一部とア
ンプ回路をチップ部品６．８とプリント基板配線部１１
で構成し、他面には接地電極面７を設け、この接地電極
７とシールドケース１をハンダ付等で接続する。父上、
下の回路を上、下接続用端子１３によシミ気的に接続し
、発振回路及びアンプ回路を構成することによシ小形、
薄形化が可能である。なお１図中４はシールドケース１
に設けた義足、１０は外部接続用端子である。On the upper part of the second printed circuit board 9, a part of the oscillation circuit and the amplifier circuit are connected to the chip components 6.8 and the printed circuit board wiring section 11.
A ground electrode surface 7 is provided on the other surface, and the ground electrode 7 and the shield case 1 are connected by soldering or the like. father,
By seamlessly connecting the lower circuit to the upper and lower connection terminals 13 and configuring an oscillation circuit and an amplifier circuit, it is possible to
It is possible to make it thinner. In addition, 4 in figure 1 is shield case 1
10 is a terminal for external connection.
上記とすることによシ、プリント基板１２上の回路とプ
リント基板９上の回路とは、プリント基板１２の下面の
接地電極、６によシシールドされて不必要な回路間の結
合がなくなシ、安定した特性とすることができる。また
、プリント基板９０下面に設けた接地電極７をシールド
ケース１に半田付けなどで電気的に接読しているため、
プリント基板９．１２上の発振回路、アンプ回路が完全
に外部からシールドされることになシ、外部から電波が
飛込むことも完全に防止でき、構成部品の削減が図れ、
小型化、薄形化が図れることになる。By doing the above, the circuit on the printed circuit board 12 and the circuit on the printed circuit board 9 are shielded by the ground electrode 6 on the lower surface of the printed circuit board 12, and unnecessary coupling between circuits is eliminated. , stable characteristics can be achieved. In addition, since the ground electrode 7 provided on the lower surface of the printed circuit board 90 is electrically read by soldering to the shield case 1,
The oscillation circuit and amplifier circuit on the printed circuit board 9.12 are completely shielded from the outside, and radio waves can be completely prevented from entering from the outside, reducing the number of components.
This means that it can be made smaller and thinner.
発明の効果
以上のように本発明は、発振回路及びアンプ回路を２枚
のプリント基板に分割し上、下プリント基板を電気的に
接続し、かつ下に位置するプリント基板の接地電極面を
外面に位置するように配置することＫよシ、プリント基
板の接地電極面をシールド板として使用できるため底板
が不要になシ薄形化が図れるとともに構成部品が削減で
きてコストダウンが図ることができる。Effects of the Invention As described above, the present invention divides an oscillation circuit and an amplifier circuit into two printed circuit boards, electrically connects the upper and lower printed circuit boards, and connects the ground electrode surface of the lower printed circuit board to the outer surface. In addition, the ground electrode surface of the printed circuit board can be used as a shield plate, eliminating the need for a bottom plate, making it thinner, and reducing the number of components, leading to cost reductions. .
第１図は本発明の高周波発振装置の一実施例の側面断面
図、第２図は従来の高周波発振装置の側面断面図である
。
１・・・・・・シールドケース、２・・・・・・プリン
ト基板配線部、３・・・・・チップ部品、４・・・・・
・義足、６・・・・・・接地電極、６，８・・・・・・
チップ部品、了・・・・・・接地電極、９・・・・・・
プリント基板、１０・・・・・・外部接続用端子、１１
・・・・・・プリント基板配線部、１２・・・・・・プ
リント基板、１３・・・・・・上、下接続用端子。FIG. 1 is a side sectional view of one embodiment of the high frequency oscillation device of the present invention, and FIG. 2 is a side sectional view of a conventional high frequency oscillation device. 1... Shield case, 2... Printed circuit board wiring section, 3... Chip parts, 4...
・Prosthetic leg, 6... Ground electrode, 6, 8...
Chip parts, End... Ground electrode, 9...
Printed circuit board, 10...Terminal for external connection, 11
...Printed board wiring section, 12...Printed board, 13...Top and bottom connection terminals.
Claims (1)
プラインや各種チップ部品を二枚のプリント基板に分割
して組込み、このプリント基板のそれぞれ下面に接地電
極を形成するとともに上下に配置してシールドケース内
に組込み、この上下に配置されたプリント基板を電気的
に接続し、かつ下側に位置するプリント基板の接地電極
を外面に位置するように配置してシールドケースに電気
的に接続してなる高周波発振装置。The microstrip lines and various chip components that make up the oscillation circuit and amplifier circuit are divided into two printed circuit boards and assembled into them.A ground electrode is formed on the bottom surface of each printed circuit board, and they are placed one above the other and assembled into a shield case. , a high-frequency oscillation device in which the printed circuit boards placed above and below are electrically connected, and the ground electrode of the lower printed circuit board is placed on the outer surface and electrically connected to the shield case. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63014911A JPH01190104A (en) | 1988-01-26 | 1988-01-26 | High frequency oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63014911A JPH01190104A (en) | 1988-01-26 | 1988-01-26 | High frequency oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01190104A true JPH01190104A (en) | 1989-07-31 |
Family
ID=11874157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63014911A Pending JPH01190104A (en) | 1988-01-26 | 1988-01-26 | High frequency oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01190104A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03110906A (en) * | 1989-09-26 | 1991-05-10 | Nec Corp | Oscillator |
| JPH04167805A (en) * | 1990-10-31 | 1992-06-15 | Matsushita Electric Ind Co Ltd | High stability high frequency oscillator |
-
1988
- 1988-01-26 JP JP63014911A patent/JPH01190104A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03110906A (en) * | 1989-09-26 | 1991-05-10 | Nec Corp | Oscillator |
| JPH04167805A (en) * | 1990-10-31 | 1992-06-15 | Matsushita Electric Ind Co Ltd | High stability high frequency oscillator |
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