JPS6076134A - Inspecting device for appearance of shaft-shaped member - Google Patents

Inspecting device for appearance of shaft-shaped member

Info

Publication number
JPS6076134A
JPS6076134A JP58183877A JP18387783A JPS6076134A JP S6076134 A JPS6076134 A JP S6076134A JP 58183877 A JP58183877 A JP 58183877A JP 18387783 A JP18387783 A JP 18387783A JP S6076134 A JPS6076134 A JP S6076134A
Authority
JP
Japan
Prior art keywords
shaft
line sensor
diode
output
diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58183877A
Other languages
Japanese (ja)
Inventor
Seiichi Takemura
竹村 成市
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP58183877A priority Critical patent/JPS6076134A/en
Publication of JPS6076134A publication Critical patent/JPS6076134A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To inspect the appearances of shaft-shaped members, which are made a continuous feed at higher speed, in a simple structure by a method wherein a transferring unit for the shaft-shaped members, a defective existence detecting part, a line sensor to detect light to come out of the outer peripheral faces of the shaft-shaped members and a treating part are provided. CONSTITUTION:As shaft-shaped member 1 is exemplified a glass sealed DHD diode. The diodes are made a continuous feed on a chain conveyor 6 and rach the lower side of a line sensor 9 through the position of a defective existence detecting part 8. The output of the line sensor 9 steeply drops at the end parts 2a and 2b and the parts of seals 5a and 5b of the glas sleeve 2 of the diode 1, binary treatment and waveform shaping process are performed at a treatment part 14, the respective number of pulses a', b', c' and d' and the pulse intervals are decided whether they are respectively in the previously set extents, and decision of good or bad of the seals is made. When the diodes 1 reached the lower side of a drawing-out unit 13, the drawing-out unit 13 acts selectively and removes defective diodes from the conveyor 6.

Description

【発明の詳細な説明】 技術分野 本発明は軸状部材の外f1.↓検査装置に関し、軸状部
打音その軸と直交する方間に一定間隔で配列し移動させ
る移動装置上で、連続送り状態でその外観?検査し得る
ようにした装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an outer f1. ↓Regarding the inspection device, what does it look like when the shaft is continuously fed on a moving device that arranges and moves it at regular intervals in a direction perpendicular to the axis? This invention relates to a device that can be inspected.

背景技術 軸状部材、例えば部品本体からその両方向にリード全4
出したダイオードや抵抗等の電子?fIS品は、製造工
程中で電気旧特性が検査され良否判別、等級選別されて
、良品に礪独名、価性、ロット番号、等が捺印されテー
ピング処理や袋詰めされて出荷される。これらの処理全
連続的に行うため電子部品はチェーンコンベア等により
、リード両端部が支持され一定間隔で配列されて各工程
に送られる。
Background technology A shaft-shaped member, for example, a total of four leads from the component body in both directions.
Electrons such as emitted diodes and resistors? During the manufacturing process, fIS products are inspected for electrical characteristics, judged to be good or bad, graded, and good products are stamped with a German name, value, lot number, etc., taped, packed in bags, and shipped. In order to carry out all of these processes continuously, the electronic components are sent to each process by a chain conveyor or the like, with both ends of the leads supported and arranged at regular intervals.

と仁ろで、出荷前に捺印状態や外形等の外観検査がなさ
れる。この検査全自動化するために例えばテレビカメラ
にて外観保全電気信号に変換し、パターン化して解析す
る所謂パターンd m1ff全利用すりことが考えられ
るが、電子部品が小ざいだめカメラの拡大倍率全【情く
する必要があり、また高速移動しているだめ捕捉時間が
短かく、信頼性のおける解析ができなかった。そのため
テレビカメラ全榎敢台用怠し、連続して移動してくる電
子部品全それぞれ各テレビカメラで捕捉し一定距離迫尾
して電子部品全静止画として捕えパターン解析し・各テ
レビカメラ金兄の位置に戻して続く複数の電子部品全捕
える動作全昧返すことにより連続浦速送り状態でも十分
な外観検査が可能であるが、設備が該雑となV費用が関
〈つ〈欠点があった。
Before shipping, the product is inspected for appearance, including stamping status and external shape. In order to fully automate this inspection, it is conceivable to fully utilize the so-called pattern dm1ff, which uses a television camera to convert the signal into an electrical signal to maintain its appearance, pattern it, and analyze it. Since it was moving at high speed, the acquisition time was short, and reliable analysis was not possible. For this reason, all television cameras were not used, and each television camera captured all of the electronic components that were continuously moving, followed them at a certain distance, captured them as still images of all the electronic components, and analyzed the pattern. Although it is possible to carry out a sufficient visual inspection even in a continuous high-speed feed state by returning the electronic components to the previous position and then returning the entire operation to capture all of the electronic components, there are disadvantages such as the equipment being sloppy and the costs involved. Ta.

そのため目視検査VC頼ると、連続送りできず、また作
業者の疲労による誤判定もあり、改善が望まれていた。
For this reason, relying on visual inspection VC does not allow for continuous feeding, and also leads to erroneous judgments due to worker fatigue, so improvements have been desired.

つ6明の開示 本発明は上記間、U点や欠点金除き、ll1i単な構造
で1%速連続送りされる軸状部材の外観全検圧し得るよ
うにした装置は全提供する。
SUMMARY OF THE INVENTION The present invention provides an apparatus that is capable of detecting the entire external pressure of a shaft-like member continuously fed at a rate of 1% with a simple structure, excluding the U point and the disadvantages mentioned above.

本発明は軸状部利全そり軸と直交する方向に一定間隔で
配列しii+: !!IIさせる移動装置と、移動装置
の定位置で軸状VA5材の有無全検出する有無検出部と
、有無検出部によって検出された軸状1貝夕材の軸方向
にRう外周向からのyC乞検出するラインセンサと、有
無検出部及びラインセンサの出力に基いて軸状hIS材
の外観の良gk判別する処理部と?含むこと全特徴とす
る。
In the present invention, the shaft parts are arranged at regular intervals in a direction perpendicular to the sled axis, and ii+: ! ! a moving device for moving the shaft, a presence/absence detection unit that detects the presence or absence of the shaft-shaped VA5 material at a fixed position of the moving device; A line sensor that detects defects, and a processing section that determines whether the appearance of the shaft-shaped hIS material is good or not based on the output of the presence/absence detection section and the line sensor. Includes all features.

本発明によれば、軸状部材の外形、外周面の塗装状態等
の外観検査全連続送り状態でしかも関連で行い得る。ま
た外観全検出するラインセンサは固定でき、全体の構造
w fi1i単VCできる。
According to the present invention, visual inspection of the external shape of the shaft-shaped member, the coating state of the outer circumferential surface, etc. can be performed in a continuous feeding state and in conjunction with each other. In addition, the line sensor that detects the entire appearance can be fixed, and the entire structure can be constructed using a single VC.

発明全実施するだめの最良形態 以下に本発明の実施例全図面i参照して説明する。図に
おいて、lは軸状部材、例えばガラス封f D HDダ
イオードで、第2図に示すように、ガラススリーブ2内
で部品本体であるダイオードペレット3全スラグリード
4.4の端面で挟持し、ガラススリーブ2内周面とスラ
グリード4の外周間と全気蕃に封止したもので、ガラス
スリーブ2の外周向にはカラーフード化されたリング状
の捺印5,5がなされ、機種名や極性等が表示されてい
る。このダイオード1は移動装置et、例えばチェーン
:コンベア6,6eこリート−4,4旋1M部が支持さ
れ一定量1M+4で配列さtして移動される。7はチェ
ーンコンベア6.6に突設されV字状の四++l(’t
41′シダイオード1全、その軸が移動方間と直交する
ように−>j間1#、4で配列させるだめの支持体、8
はチェーンコンベア6の定位置でダイオードlの有無?
検出する有無検出部で、図示例では光ガイド8a。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to all drawings. In the figure, l is a shaft-shaped member, for example, a glass-sealed HD diode, which is held in the glass sleeve 2 by the end face of the diode pellet 3, which is the component body, and the entire slug lead 4.4, as shown in FIG. It is sealed between the inner circumferential surface of the glass sleeve 2 and the outer circumference of the slug lead 4, and all the air holes.A ring-shaped stamp 5, 5 in the form of a color hood is made on the outer circumference of the glass sleeve 2, and the model name and Polarity etc. are displayed. The diodes 1 are supported by moving devices such as chains: conveyors 6, 6e, 4, and 1M quadricycles, and are moved in a fixed amount of 1M+4. 7 is a V-shaped 4++l('t
41' A support body for arranging all of the diodes 1, with their axes perpendicular to the direction of movement ->j, 1#, 4, 8
Is there a diode L at the fixed position of the chain conveyor 6?
The presence/absence detection section detects the presence or absence, and in the illustrated example, the light guide 8a.

8bの対向する遊端全ダイオード1のリード4の移動軌
跡を横切るように配置し、各光ガイド8a。
Each light guide 8a is arranged so as to cross the movement locus of the lead 4 of the diode 1 at the free end facing each other.

8bの一端部には図示しないが光源及び光センサが接続
されている。9け有無検出1138の前方でダイオード
lのスリーブ2外周面からの光音その軸方向に検出する
ラインセンサで、図示例ではンリンドリカルレンズlo
T!″介し下方wB過するダイオードlからの光が集束
きれる。このラインセンサ9としてはCODイメージセ
ンサが好適であるが、撮像管′に龍槻偏回で用いてもよ
い。また11はライ〉・センサ9の下方でダイオード1
全下方から照明する光源で、スリ7)l’2aT!:有
する粕12内に収納され、所望部分にのみ光音照射する
ようにしている。また図示しないが、光源11とライン
センサ9の間にはラインセンサ9に対し有害な光成分全
除去するフィルタが仲人される。13はラインセンサ9
の前方でチェーンコンベア6上に配置され選択的に上下
動して不良ダイオード?吸Xi L取り出す取出装置、
14は、’rfJil(検出部8、ラインセンサ9の出
力に一!4いてダイオードlの外観の良否全判別し、取
出装置13全選択旧−に動1・lεさせる処理部全示す
。この処理部14のプロツクダイアダラム側音第3図に
示す。15はマイクロプロセッサ装置aで、中央処理部
(OP U ) l 67Cプログラムが書き込まれた
読出し専用のメモリ (ROM)17と、人出力データ
及び中間処理データ全一時+1Jに蓄えるp)き換え可
能なメモリ(RAM)を0PU16に接続する人出力制
御装置1j(Ilo)19とが接続されている。ここで
ラインセンサ9とx / 019の間にはラインセンサ
9のアナログ出力全ディジタル化するアナログ−ディジ
タル変換部20、ディジタル化されたデータ全2値化す
る2値化処理部21等が挿入されている。
Although not shown, a light source and a light sensor are connected to one end of 8b. It is a line sensor that detects light sound from the outer peripheral surface of the sleeve 2 of the diode l in the axial direction in front of the presence/absence detection 1138, and in the illustrated example, the linear lens lo
T! The light from the diode l that passes downward through the line sensor 9 is focused. A COD image sensor is suitable as the line sensor 9, but it may also be used in the image pickup tube with Tatsutsuki polarization. Diode 1 below sensor 9
With a light source that illuminates from below, pickpocket 7) l'2aT! : It is stored in the lees 12, and the light and sound are irradiated only to the desired areas. Although not shown, a filter is provided between the light source 11 and the line sensor 9 to remove all harmful light components to the line sensor 9. 13 is line sensor 9
Is the defective diode placed on the chain conveyor 6 in front of it and selectively moving up and down? Suction Xi L extraction device,
14 is a processing unit that detects the output of the detection unit 8 and the line sensor 9, determines whether the appearance of the diode 1 is good or bad, and causes the extraction device 13 to be selected to operate 1·lε. Figure 3 shows the block diagram of the block 14. 15 is a microprocessor unit a, a central processing unit (OPU), a read-only memory (ROM) 17 in which a 67C program is written, and human output data. and a human output control device 1j (Ilo) 19 which connects a replaceable memory (RAM) to the 0PU16 for storing all intermediate processing data temporarily in +1J. Here, between the line sensor 9 and the x/019, an analog-to-digital converter 20 that converts all the analog output of the line sensor 9 into digital, a binarization processor 21 that converts all the digitized data into binary, etc. are inserted. ing.

この装置の動作全以下に説明する。チェーンコンベア6
上をダイオードlが一定間隔で連続送りされてくるに、
定位1hで有jolt検出tγI(8が出力全発生する
。この出力が工/ 01 g y、介して0PU16に
人力され、0PU16はラインセンサ9からの人力待ち
状1塵となる。この待ち時間はチェーンコンベア6の送
りaljJ−と、有無検出部8及びラインセンサ9の間
隔とから決定され、この間ラインセンサ9からの入力全
受け(=Jけないようにすることにより誤動性全防止し
ている。そして一定時間後ダイオード1がラインセンサ
9の下方に達するとラインセンサ9の出力がx / O
l 92介してCPU16に人力されるが、ラインセ〉
・す9とダイオード1の軸が平行である場合には、第4
図に示すようにダイオード1がその軸と直交方間に移動
しているためラインセンサ9の走査方向はダイオード1
の軸に対し傾斜し、ダイオード1の移動速度に対応して
りtlめから数個の出力はダイオードlの一部しか表示
しないため、これら出力は無視して完全に外周面上全走
査した出力のみkRAM18に蓄え、再度不完全出力全
無視する。これは第1番1」の出力が人力されても直ち
にRAM18に入力せず、11番目の出力から一定時間
人力を無視しその後ラインセンサ9の走査間りf)時点
からの出カケ数個RA M l 8 Vc蓄え、さらV
cそれ以後の出力全無視すればよい。11(AMl’8
へのデータ人力終了抜、直ちにデータσJ屏析全行う。
The operation of this device is fully explained below. chain conveyor 6
As the diode L is continuously fed at regular intervals,
In localization 1h, the full output of jolt detection tγI (8) is generated. This output is manually inputted to 0PU16 via the machine, and 0PU16 becomes a waiting state for manual input from line sensor 9. This waiting time is It is determined from the feed rate of the chain conveyor 6 and the interval between the presence/absence detection unit 8 and the line sensor 9. After a certain period of time, when the diode 1 reaches below the line sensor 9, the output of the line sensor 9 becomes x/O.
l It is manually powered by the CPU 16 via 92, but the line
・If the axes of diode 1 and 9 are parallel, the fourth
As shown in the figure, since the diode 1 is moving in a direction perpendicular to its axis, the scanning direction of the line sensor 9 is the diode 1.
It is tilted with respect to the axis of diode 1, and corresponds to the moving speed of diode 1.Since several outputs from tl display only a part of diode l, these outputs are ignored and the output is obtained by completely scanning the entire outer peripheral surface. Only the output is stored in the kRAM 18, and all incomplete outputs are ignored again. This means that even if the output of "No. 1 1" is manually input, it is not immediately input to the RAM 18, but the human input is ignored for a certain period of time from the 11th output, and then several outputs from the point f) during the scan of the line sensor 9 are input to the RAM 18. M l 8 Vc storage, further V
c All outputs after that can be ignored. 11 (AMl'8
As soon as the data is completed manually, all data σJ analysis will be carried out.

即ち、第5図(Alに示す走査位置でのラインセンサ9
の出力は第5図(Blに示すようになる。即ちガラスス
リーブ2U) 17i4A部2aでは屈折により出力が
低下し、スリーブ2の外周面部分でもわずかに出力が低
下する。
That is, the line sensor 9 at the scanning position shown in FIG.
The output is as shown in FIG. 5 (Bl, that is, the glass sleeve 2U).The output decreases due to refraction at the 17i4A portion 2a, and the output also decreases slightly at the outer peripheral surface portion of the sleeve 2.

そして捺印5(5a、5b)部分で急激に出力低下し、
スリーブ2の他端部2bで再IW出力低下する。こび)
出力は2値化処理され第5図(C1に示すように整形さ
れ、これがRAM18に畜見られている。この出力に対
し始めのパルス降下点a′から次のパルス降下点b′ま
での間l!1lii(データのビット長ンを計数し、さ
らに各パルスb/ 、 c/の間隔′?!:泪数し、パ
ルスa’、 b’、 c’、 d’の数音計数する。こ
れらのパルス間隔及び故が予め設定された範囲内にある
か全判定し捺印の良否全知ることができる。
Then, the output suddenly decreased at the stamp 5 (5a, 5b) part,
The IW output decreases again at the other end 2b of the sleeve 2. Kobi)
The output is binarized and formatted as shown in Figure 5 (C1), which is stored in the RAM 18. l!1lii (Count the bit length of the data, then count the interval between each pulse b/, c/, and count the number of pulses a', b', c', d'. It is possible to determine whether the pulse interval and error are within a preset range, and to know whether the stamp is good or bad.

同様にして第6図(にに示すような走査1alL跡に対
シテはラインセンサ9の出力は第6図(Blに示すよう
になり、2値化されると第6図(0)に示すようになる
。この場合にも同様にパルス間隔及びパルスmk計数す
る。第5図及び第6図は良品全示すが、第7図(Alに
示すように、捺印5aに欠けや掠れがあると、図示i上
の走査に対しラインセンサ9の出力は第7図(Blに示
すようになり、2圃化されて第7図(C1に示す出力が
RAM18に人力される。
Similarly, the output of the line sensor 9 becomes as shown in FIG. 6 (Bl), and when it is binarized, it is shown in FIG. 6 (0). In this case, the pulse interval and pulse mk are counted in the same way. Figures 5 and 6 show all non-defective products, but if the stamp 5a is chipped or blurred as shown in Figure 7 (Al). , the output of the line sensor 9 for the scan on i shown in the figure becomes as shown in FIG. 7 (Bl), and the output shown in FIG.

この場合パルス間隔見が長くなりパルスb′σJ Ii
i Wも狭くなり不良と判定される。また第7図(Al
に示すダイオードで図中aに示すように走査すると、同
図(D)に示すようなパルス列が得られる。即ち、パル
スθの長き見′が長くなり、リード4,4の片寄り不良
であることが分る。またペレット3が無い場合には第7
図CD+のパルスθ、fが連結シ、ペレット3の欠品全
知ることができる。
In this case, the pulse interval becomes longer and the pulse b′σJ Ii
iW also becomes narrower and is determined to be defective. Also, Fig. 7 (Al
When the diode shown in FIG. 1 scans as shown in a in the figure, a pulse train as shown in FIG. That is, the long term ' of the pulse θ becomes long, indicating that the leads 4 are misaligned. Also, if there is no pellet 3, the 7th pellet
Since the pulses θ and f in the diagram CD+ are connected, it is possible to know if any of the pellets 3 are missing.

この他にも捺印位置の反転、即ちチェーンコンベア6上
にダイオード1が反対間きに支持されている状態も知る
ことができる。
In addition to this, it is also possible to know the reversal of the marking position, that is, the state in which the diodes 1 are supported on the chain conveyor 6 at opposite intervals.

このようにして良否判定がなされると、RAM18にソ
U)結果?保持しておき、ダイオードlが取出装置a1
3のF方に達した時に、RAM18に蓄えられた出力に
応じて取出装置13全選択的に1′lE !171J 
サせ、不良ダイオードのみチェーンフ〉・ベア6上から
除去する。
When the pass/fail judgment is made in this way, the results are stored in RAM 18. The diode l is the extractor a1.
When reaching the F side of 3, the extraction device 13 is selectively 1'lE! according to the output stored in the RAM 18. 171J
Remove only the defective diode from the chain f/bear 6.

これら一連の処理は軸状部イオであるダイオードの外表
面全−回乃至数回走査した結果に基いて判1+jiする
ため、軸状部材を一旦停止させることなく連続送り状J
庫で外観データ全捕捉でき、良否判別できる。また軸状
部材とラインセンサと全同期して移動させる必要がなく
装置が1“バj単にできる。
These series of processes are performed based on the results of scanning the outer surface of the diode, which is the shaft-like part, all or several times.
All appearance data can be captured in the warehouse and quality can be determined. Furthermore, there is no need to move the shaft-like member and the line sensor in full synchronization, making the device simple.

【図面の簡単な説明】[Brief explanation of the drawing]

第114は本発明の実施例全示す斜視図、第2図は軸状
部材の一側音示す一部断面側面図、第3図は第1図装置
の処理部全示すブロックダイアグラム)第4図は軸状部
材tc i<4するラインセンサの走査状態全示す平面
図、第5図(AI乃至CB+は捺印状態全検出するだめ
の走査状=T4 +示すもので(A)は軸状■S材の平
囲図、(B)はラインセンサの出力波形図、(C1は2
値化された出力波形図全示す。また第6図(Al乃至(
0)は外観状態全検出するだめの走査状態牙示すもので
(Alは軸状部材の平面図、(B)はラインセンサの出
力波形図、IO+は211な化された出力波形図?示す
。さらに第7図[Al乃至(Dlは捺印不良及び外観不
良の軸状部材に対する走査状態?示すもので、(AJけ
軸状部材の平面図、(B)は捺印不良に対するラインセ
ンサの出力波形図、(01はz値化された出力波形図、
(Dlは外観不良に対する2値化された出力波形開音そ
れぞれ示す。 1・・・・ 軸状glS利、 6・ 移動装置、 8・・・ 有無検田部、 9・・・・ ライン・センサ、 14 ・・・処理部。 弗]図 第4図 2 ]
114 is a perspective view showing the entire embodiment of the present invention, FIG. 2 is a partially sectional side view showing one side of the shaft member, and FIG. 3 is a block diagram showing the entire processing section of the device shown in FIG. 1). 5 is a plan view showing all the scanning states of the line sensor in which the shaft-like member tc i < 4 (AI to CB+ are the scanning states for detecting all the stamping states = T4 +, and (A) is the shaft-like ■ S (B) is the output waveform diagram of the line sensor, (C1 is 2
The entire digitized output waveform diagram is shown. Also, Fig. 6 (Al to (
0) shows the scanning state for detecting all the external conditions (Al is a plan view of the shaft-like member, (B) is an output waveform diagram of the line sensor, and IO+ is an output waveform diagram converted to 211). Furthermore, FIGS. 7A to 7D show scanning states for shaft-like members with poor markings and poor appearance; , (01 is a z-valued output waveform diagram,
(Dl indicates the binarized output waveform open sound for appearance defects, respectively. 1... Axial glS ratio, 6. Moving device, 8... Presence/absence detection section, 9... Line sensor, 14...Processing section. 弗]Figure 4, Figure 2]

Claims (1)

【特許請求の範囲】[Claims] 軸状部打音その軸と直交する方間に一゛定間隔で配列し
移動させる移動装置と、移動装置の定位置で軸状部材の
有無全検出する有無検出部と、有無検出部によって検出
された軸状部材の軸方間に沿う外周面からの元金検出す
るラインセンサと、有無検出部及びラインセンサの出力
に基いて軸状部材の外観σ〕艮百デ判別する処理部と全
含むこ−と全特徴とする軸状部材の外観検査装置。
Shaft-shaped part hitting sound is detected by a moving device that arranges and moves at regular intervals in a direction perpendicular to the axis, a presence/absence detection section that detects the presence or absence of the shaft-shaped member at a fixed position of the moving device, and an presence/absence detection section. a line sensor that detects the principal from the outer peripheral surface along the axial direction of the shaft-like member, a processing unit that determines the appearance σ of the shaft-like member based on the output of the presence/absence detection unit and the line sensor; An appearance inspection device for a shaft-shaped member, which has all the following features:
JP58183877A 1983-09-30 1983-09-30 Inspecting device for appearance of shaft-shaped member Pending JPS6076134A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58183877A JPS6076134A (en) 1983-09-30 1983-09-30 Inspecting device for appearance of shaft-shaped member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58183877A JPS6076134A (en) 1983-09-30 1983-09-30 Inspecting device for appearance of shaft-shaped member

Publications (1)

Publication Number Publication Date
JPS6076134A true JPS6076134A (en) 1985-04-30

Family

ID=16143390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58183877A Pending JPS6076134A (en) 1983-09-30 1983-09-30 Inspecting device for appearance of shaft-shaped member

Country Status (1)

Country Link
JP (1) JPS6076134A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62194406A (en) * 1986-02-21 1987-08-26 Rohm Co Ltd Coating film inspecting instrument for resistor
JPH0255962A (en) * 1988-08-20 1990-02-26 Fujitsu Ltd Contact resistance measuring instrument
CN104226615A (en) * 2013-06-06 2014-12-24 广东易德半导体有限公司 Device for automatically clearing crossing faults of multifunctional combined device for diode processing
WO2022128611A1 (en) * 2020-12-15 2022-06-23 Tyco Electronics (Shanghai) Co., Ltd. Terminal detection platform

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS545390A (en) * 1977-06-15 1979-01-16 Fujitsu Ltd Gate control system for slope drop-down system automatic handler
JPS54150089A (en) * 1978-05-18 1979-11-24 Nec Corp Test device for ic lead bend
JPS5735335A (en) * 1980-08-12 1982-02-25 Nec Corp Automatic grader
JPS5870110A (en) * 1981-08-03 1983-04-26 マイクロコンポ−ネント テクノロジ− インコ−ポレ−テツド Device for inspecting state of arrangement of reed

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS545390A (en) * 1977-06-15 1979-01-16 Fujitsu Ltd Gate control system for slope drop-down system automatic handler
JPS54150089A (en) * 1978-05-18 1979-11-24 Nec Corp Test device for ic lead bend
JPS5735335A (en) * 1980-08-12 1982-02-25 Nec Corp Automatic grader
JPS5870110A (en) * 1981-08-03 1983-04-26 マイクロコンポ−ネント テクノロジ− インコ−ポレ−テツド Device for inspecting state of arrangement of reed

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62194406A (en) * 1986-02-21 1987-08-26 Rohm Co Ltd Coating film inspecting instrument for resistor
JPH0255962A (en) * 1988-08-20 1990-02-26 Fujitsu Ltd Contact resistance measuring instrument
CN104226615A (en) * 2013-06-06 2014-12-24 广东易德半导体有限公司 Device for automatically clearing crossing faults of multifunctional combined device for diode processing
WO2022128611A1 (en) * 2020-12-15 2022-06-23 Tyco Electronics (Shanghai) Co., Ltd. Terminal detection platform
US12598398B2 (en) 2020-12-15 2026-04-07 Tyco Electronics (Shanghai) Co., Ltd. Terminal detection platform

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