JPS6077413A - Laser excitation process apparatus - Google Patents
Laser excitation process apparatusInfo
- Publication number
- JPS6077413A JPS6077413A JP18448283A JP18448283A JPS6077413A JP S6077413 A JPS6077413 A JP S6077413A JP 18448283 A JP18448283 A JP 18448283A JP 18448283 A JP18448283 A JP 18448283A JP S6077413 A JPS6077413 A JP S6077413A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- reaction
- laser
- grid
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000005284 excitation Effects 0.000 title claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims abstract description 22
- 150000002500 ions Chemical class 0.000 claims abstract description 18
- 230000001133 acceleration Effects 0.000 claims abstract description 10
- 238000000354 decomposition reaction Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 16
- 238000005530 etching Methods 0.000 abstract description 6
- 230000036632 reaction speed Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/483—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using coherent light, UV to IR, e.g. lasers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、反応室内に導入される反応ガス分子にエキ
シマレーザ−のようなレーザービームを照射してイオン
化し分解効率を高めるようにしたレーザー励起プロセス
装置に関するものである。[Detailed Description of the Invention] This invention relates to a laser excitation process device that irradiates reactive gas molecules introduced into a reaction chamber with a laser beam such as an excimer laser to ionize them and increase decomposition efficiency. .
エキシマレーザ−は、エネルギーが高く(例えばArF
: 6−42eV、KrF : 5.DeV、XeC
L: 4.02eVなど)、分子に照射すると分解効率
が高いため光化学反応を利用する分野に積極的に利用さ
れている。ところで超LSIを目差す半導体技術分野に
おいても、基板表面への損傷が少ないことから、光励起
プロセスが注目されてお少、エキシマレーザ−を利用し
たCVD (化学反応を利用した*脱法)が研究されは
じめている。この種の従来提案されてきた実験装置は、
第1図に示すように反応室1内に挿置された基板ホルダ
2に装着された基板3に向ってガス導入口4からガスt
4人すると共に反応室1の側壁に設けた光導入窓5を介
して、エキシマレーザ−装置6からレンズ系7を通って
供給されるレーザービームを入射させるように構成され
ており、この構成によって反応室1内におけるレーザー
ビームの光路上に存在する分子は分解され、これがCV
Dの場合には基板6上に堆積し、或いは分解されて生成
されるラジカルによって基板3はエツチングされること
になる。しかしながら、このような構成では、基板表面
での反応が非常に遅く、堆積やエツチングの速度が非常
に遅い。Excimer lasers have high energy (e.g. ArF
: 6-42eV, KrF: 5. DeV, XeC
L: 4.02 eV, etc.), it has a high decomposition efficiency when irradiated to molecules, so it is actively used in fields that utilize photochemical reactions. By the way, in the field of semiconductor technology aiming for VLSI, the optical excitation process has been attracting a little attention because it causes less damage to the substrate surface, and CVD using excimer lasers (a method using chemical reactions) has only just begun to be researched. There is. This kind of experimental equipment that has been proposed so far is
As shown in FIG. 1, a gas t is introduced from a gas inlet 4 toward a substrate 3 mounted on a substrate holder 2 inserted in a reaction chamber 1.
It is configured so that a laser beam supplied from an excimer laser device 6 through a lens system 7 is incident through a light introduction window 5 provided on the side wall of the reaction chamber 1, and with this configuration, four people are seated. Molecules existing on the optical path of the laser beam in the reaction chamber 1 are decomposed, and this results in CV
In case D, the substrate 3 will be etched by the radicals deposited on the substrate 6 or generated by decomposition. However, in such a configuration, the reaction on the substrate surface is very slow, and the rate of deposition and etching is very slow.
すなわち、エキシマレーザ−を利用したCVDやエツチ
ングにおいては単に励起分子やラジカルが利用されてい
るにすぎず、イオンは積極的に利用されてない。That is, in CVD and etching using an excimer laser, only excited molecules and radicals are used, and ions are not actively used.
そこで、この発明の目的は、反応ガス分子にエキ7マレ
ーザーを照射することによって生成されるイオンを積極
的に利用するように構成したレーザー励起プロセス装置
を提供することにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a laser excitation process apparatus configured to actively utilize ions generated by irradiating reaction gas molecules with an excimer laser.
この目的を達成するために、この発明によるレーザー励
起プロセス装置は、反応室内の光照射部にイオン加速用
グリッドを設け、イオンに加速電圧を与えてイオンアシ
ステツド反応を起させるように構成したことを特徴とし
ている。In order to achieve this purpose, the laser excitation process apparatus according to the present invention is configured to provide an ion acceleration grid in the light irradiation section in the reaction chamber and apply an accelerating voltage to the ions to cause an ion-assisted reaction. It is characterized by
以下添附図面中、第2,5図を参照してこの発明をさら
に説明する。The present invention will be further described below with reference to FIGS. 2 and 5 of the accompanying drawings.
第2.3図にはこの発明によるレーザー励起プロセス装
置の一実施例を示し、8は反応室で、その中に基板9の
装着される基板ホルダー10が回転可能に配置されてい
る。この反応室8け反応ガス導入口8 a +ガス排出
口8bおよび光導入窓8Cを備えている。また第2図に
おいて11はレーザー光源であシ、このレーザー光源1
1で発生されたレーザービーム12はレンズ系13を通
って光導入窓8cから反応室1内に導入される。反応室
1内に導入されたレーザービームの光路に沿ってこの光
路を包むようにイオン加速用グリッド14が設けられ、
このグリッド140基板9に対向した側は第3図に示す
ように開放している。このグリッド14にはまた電源1
5によって0〜+50V程度の電圧が印加される。従っ
てレーザービーム12によって生成されるイオンは、グ
リッド14によって運動エネルギーが与えられ、50e
V程度までのエネルギーをもって基板9に入射される。FIG. 2.3 shows an embodiment of the laser excitation processing apparatus according to the present invention, in which 8 is a reaction chamber, in which a substrate holder 10 on which a substrate 9 is mounted is rotatably arranged. This reaction chamber is equipped with eight reaction gas inlets 8a, a gas outlet 8b, and a light introduction window 8C. In addition, in Fig. 2, 11 is a laser light source, and this laser light source 1
The laser beam 12 generated in step 1 passes through the lens system 13 and is introduced into the reaction chamber 1 from the light introduction window 8c. An ion acceleration grid 14 is provided along the optical path of the laser beam introduced into the reaction chamber 1 so as to surround this optical path.
The side of the grid 140 facing the substrate 9 is open as shown in FIG. This grid 14 also has a power supply 1
5, a voltage of about 0 to +50V is applied. The ions produced by the laser beam 12 are therefore imparted with kinetic energy by the grid 14 and are given 50e
The light is incident on the substrate 9 with energy up to about V.
その結果イオンアシステツドエツチングやCVDが行な
われることになる。すなわちグリッド14によって50
eV程度までの加速電圧を印加することによって、発生
したイオン全部を基板9へ到達させ、また到達する過程
で他の分子をイオン化し、さらに基板表面での反応を促
進させることができ、その結果反応レートを大きくする
ことができる。As a result, ion assisted etching and CVD are performed. i.e. 50 by grid 14
By applying an accelerating voltage of about eV, all the generated ions can reach the substrate 9, and in the process of reaching them, other molecules can be ionized, and the reaction on the substrate surface can be further promoted. The reaction rate can be increased.
なお加速電圧50eV以下とするのけ損傷を避けるため
である。Note that the acceleration voltage is set to 50 eV or less in order to avoid damage caused by scraping.
以上説明してきたようにこの発明においては、レーザー
光源から導入されるレーザービームの光照射部にイオン
加速用グリッドを設け、これに〜50eV程度の電位を
印加してイオンアシステツドエツチングやCVD i起
させるように構成しているので反応速度を高めることが
でき、その結果成膜速度やエツチング速度が飛躍的に高
くなると期待できる。このことは、従来実用化があやぶ
まれているl/−ザー励起プロセスの実用化を促進させ
ることを意味している。As explained above, in this invention, an ion acceleration grid is provided at the light irradiation part of the laser beam introduced from the laser light source, and a potential of about 50 eV is applied to the grid to perform ion assisted etching or CVD i. Since the structure is such that the reaction rate can be increased, it is expected that the film formation rate and etching rate will be dramatically increased as a result. This means that the practical application of the l/- laser excitation process, which has hitherto been difficult to put into practical use, is promoted.
なおレーザー光源としては好ましくはエキ7マレーザー
が用いられるが、分解効率の高い高エネルギーの他のレ
ーザーを用いてもよい。Note that an excimer laser is preferably used as the laser light source, but other high-energy lasers with high decomposition efficiency may also be used.
第1図は従来のレーザー励起プロセス装置の原理図、第
2図はこの発明のレーザー励起プロセス装僅の概略図、
第6図は第2図の反応室の内部を何方から見た図である
。
図中、8:反応室、 11:レーザー光源。
12:レーザービーム、 14:イオン加速用グリッド
、 15:電源。FIG. 1 is a principle diagram of a conventional laser excitation process device, and FIG. 2 is a schematic diagram of the laser excitation process device of the present invention.
FIG. 6 is a view of the interior of the reaction chamber shown in FIG. 2 as seen from all directions. In the figure, 8: reaction chamber, 11: laser light source. 12: Laser beam, 14: Grid for ion acceleration, 15: Power supply.
Claims (1)
照射してイオン化し分解効率を高めるようにしたレーザ
ー励起プロセス装置において、光照射部にイオン加速用
グリッドを設け、イオンに加速電圧を与えてイオンアシ
ステツド反応を起させるように構成したことを特徴とす
るレーザー励起プロセス装置。In a laser excitation process device that irradiates the reactive gas molecules introduced into the reaction guide with a laser beam to ionize them and increase decomposition efficiency, an ion acceleration grid is provided in the light irradiation section, and an accelerating voltage is applied to the ions to accelerate the ionization. A laser excitation process device characterized in that it is configured to cause an assisted reaction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18448283A JPS6077413A (en) | 1983-10-04 | 1983-10-04 | Laser excitation process apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18448283A JPS6077413A (en) | 1983-10-04 | 1983-10-04 | Laser excitation process apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6077413A true JPS6077413A (en) | 1985-05-02 |
Family
ID=16153939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18448283A Pending JPS6077413A (en) | 1983-10-04 | 1983-10-04 | Laser excitation process apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6077413A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119237A (en) * | 1986-11-06 | 1988-05-23 | Matsushita Electric Ind Co Ltd | Etching |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368171A (en) * | 1976-11-30 | 1978-06-17 | Hitachi Ltd | Method and apparatus for plasma treatment |
| JPS5689835A (en) * | 1979-12-21 | 1981-07-21 | Fuji Electric Co Ltd | Vapor phase growth apparatus |
-
1983
- 1983-10-04 JP JP18448283A patent/JPS6077413A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368171A (en) * | 1976-11-30 | 1978-06-17 | Hitachi Ltd | Method and apparatus for plasma treatment |
| JPS5689835A (en) * | 1979-12-21 | 1981-07-21 | Fuji Electric Co Ltd | Vapor phase growth apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119237A (en) * | 1986-11-06 | 1988-05-23 | Matsushita Electric Ind Co Ltd | Etching |
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