JPS6077509A - Surface acoustic wave device - Google Patents

Surface acoustic wave device

Info

Publication number
JPS6077509A
JPS6077509A JP18500283A JP18500283A JPS6077509A JP S6077509 A JPS6077509 A JP S6077509A JP 18500283 A JP18500283 A JP 18500283A JP 18500283 A JP18500283 A JP 18500283A JP S6077509 A JPS6077509 A JP S6077509A
Authority
JP
Japan
Prior art keywords
electrode
surface acoustic
acoustic wave
wave device
admittance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18500283A
Other languages
Japanese (ja)
Inventor
Yuji Fujita
勇次 藤田
Jun Yamada
純 山田
Takashi Shiba
隆司 芝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP18500283A priority Critical patent/JPS6077509A/en
Publication of JPS6077509A publication Critical patent/JPS6077509A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/145Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14517Means for weighting
    • H03H9/1452Means for weighting by finger overlap length, apodisation
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02637Details concerning reflective or coupling arrays
    • H03H9/02779Continuous surface reflective arrays

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To decrease voltage loss by taking number of electrode finger pairs of one electrode as <20 and taking the percentage of the width of electrode finger to 1/2 of the repetitive period to the electrode finger as >=76% or <=24% so as to make the admittance close to that of a device to be connected. CONSTITUTION:A comb line electrode 2 as an input electrode, a comb line electrode 3 being an output electrode and a shield electrode 4 are formed on a piezoelectric substrate 1 forming a surface acoustic wave device. The number of pairs of the electrode finger in the comb line electrodes 2, 3 is taken as <20 and also the percentage of the width of electrode finger to 1/2 of the repetitive period of the electrode finger is taken as >=76% or <=24%. Moreover, the percentage of the width of the electrode finger of the comb line electrodes 2, 3 arranged oppositely onto the substrate 1 is taken as <=24% for the electrode 2 or 3 and >=76% for the other electrode 3 or 2. Then the admittance of the surface acoustic wave device is approached to the device to be connected so as to decrease the voltage loss.

Description

【発明の詳細な説明】 〔重量の利用分野〕 本発明は、結合回路にアドミッタンスを近付目で、電圧
損失の改善や小型化をdlった弾性表面波装置に関する
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of Weight] The present invention relates to a surface acoustic wave device that approaches the admittance of a coupling circuit, improves voltage loss, and achieves miniaturization.

〔発明の背景〕[Background of the invention]

第1図に従来の弾性表面波装置の一列を示す。 FIG. 1 shows a row of conventional surface acoustic wave devices.

1は圧電性基板、2.3は櫛型電極、4はシールド電極
である。櫛型電極は一般に、弾性表面波の反射を抑圧す
る目的で、同極性の電極指をそれぞれ隣接した2本に分
割したものを、交互に極性を変えて配設した二重電極構
造(スプリット型電極)がよく用いられる。又、通常、
電極指の繰り返し周期の1/2と電極指幅の百分率比で
あるメタライデーションレイショは50%である。
1 is a piezoelectric substrate, 2.3 is a comb-shaped electrode, and 4 is a shield electrode. Comb-shaped electrodes generally have a double-electrode structure (split type) in which electrode fingers of the same polarity are divided into two adjacent ones and arranged with alternating polarities, in order to suppress the reflection of surface acoustic waves. electrodes) are often used. Also, usually
The metallization ratio, which is the percentage ratio of 1/2 of the repetition period of the electrode fingers to the width of the electrode fingers, is 50%.

弾性表面波装置は、一方の櫛型1!極たとえば第1図中
の櫛型電極2に信号を加えると、電気信号は弾性表面波
に変換される。この弾性表面波は基板上を伝搬し、他方
の櫛型電極たとえば第1図中の櫛型電極3により再び電
気信号に変換される。このとき少なくとも一方の櫛型電
極の交差幅あるいは繰り返し周期を変化させ、重み付け
を施すことにより所望の周波数特性を得る。また、シー
ルド電極は直接漏洩波を抑圧すV ’I’ Rに用いる
ビデオヘッドの特性補償を目的とした弾性表面波装置は
、中心周波数15■2゜比帯域幅057である。信号源
側は正規型電極で対数は35対、負荷側は重み付は電極
で対数は7.5対である。また、電極指は両方ともメタ
ライゼーションレイシ1150%の二重電極構造で、開
口長は1890μn1であり、チップサイズは9 wi
n X 2.5 Bである。このとき、正規型電極の放
射コンダクタンスGi %放射サセプタンスBtは、そ
れぞれ中心周波数で0.07m 9 、0.45m U
、また重み付は電極の放射コンダクタンス中、放射サセ
プタンスBoはそれぞれ中心周波数で0.011m&’
 、 0.75m17である。
The surface acoustic wave device is one comb type! When a signal is applied to a pole, for example, the comb-shaped electrode 2 in FIG. 1, the electrical signal is converted into a surface acoustic wave. This surface acoustic wave propagates on the substrate and is again converted into an electric signal by the other comb-shaped electrode, for example, the comb-shaped electrode 3 in FIG. At this time, desired frequency characteristics are obtained by changing the crossing width or repetition period of at least one of the comb-shaped electrodes and applying weighting. The shield electrode directly suppresses leakage waves.A surface acoustic wave device for the purpose of compensating the characteristics of a video head used for V'I'R has a center frequency of 15.times.2.degree. and a relative bandwidth of 0.57. The signal source side has regular electrodes with 35 pairs of logarithms, and the load side has weighted electrodes with 7.5 pairs of logarithms. In addition, both electrode fingers have a double electrode structure with 1150% metallization lacy, the aperture length is 1890 μn1, and the chip size is 9 wi.
n×2.5B. At this time, the radiation conductance Gi % radiation susceptance Bt of the regular electrode is 0.07 m 9 and 0.45 m U at the center frequency, respectively.
, and the radiation conductance of the electrode and the radiation susceptance Bo are respectively 0.011 m&' at the center frequency.
, 0.75m17.

この弾性表面波装置を、VTRで用いるとき、弾性表面
波装置からみた結合回路のアドミッタンスは、信号源側
Gsが50m 負荷側電がOゝ 0、2 +n Uである〇 次に、この弾性表面波装置の電圧損失について考察する
。弾性表面波装置の電力損失LbBはで表される。ここ
でKは、電極の双方向性損失で、入出力の電極指の開口
長の等しい場合は1//4である。また。その他の変数
は前述の通りである。
When this surface acoustic wave device is used in a VTR, the admittance of the coupling circuit seen from the surface acoustic wave device is as follows: signal source side Gs is 50 m, load side voltage is Oゝ0,2 +n U〇Next, this elastic surface Consider voltage loss in wave devices. The power loss LbB of the surface acoustic wave device is expressed as follows. Here, K is the bidirectional loss of the electrode, which is 1/4 when the opening lengths of the input and output electrode fingers are equal. Also. Other variables are as described above.

電圧損失は、前にめた電力損失を用いると次式のように
表される。
The voltage loss can be expressed as follows using the power loss determined earlier.

この式に従って前述の弾性表面波装置の電圧損失をめる
と25.4dBとなる。
According to this equation, the voltage loss of the surface acoustic wave device described above is calculated to be 25.4 dB.

この弾性表面波装置をVTRに用いると、再生した画像
は非常にS/N比が悪く、性能を十分に発揮できなかっ
た。これは、弾性表面波装置の電圧損失が大きいためで
ある。
When this surface acoustic wave device was used in a VTR, the reproduced images had a very poor S/N ratio, and the device could not fully demonstrate its performance. This is because the surface acoustic wave device has a large voltage loss.

電圧損失は、前述の電圧損失を表す式より結合回路およ
び弾性表面波装置のアドミッタンスを最適の条件に近付
けることにより低減できるが、結合回路のアドミッタン
スは、電圧損失を最小にする条件を、はぼ満足している
。しかし、弾性表面波装置のアドミッタンスは、前述の
電圧損失を示す式から分かるとおり%Giは大きく、G
□は小さくした方が望ましい。
Voltage loss can be reduced by bringing the admittance of the coupling circuit and surface acoustic wave device closer to the optimum conditions according to the equation expressing voltage loss above, but the admittance of the coupling circuit can be reduced by approaching the conditions that minimize voltage loss. Is pleased. However, as can be seen from the above formula for voltage loss, the admittance of a surface acoustic wave device has a large %Gi and a G
It is desirable to make □ smaller.

この弾性表面波装置の信号源側放射コンダクタンスGL
が小さい理由は、周波数が低いことと電極指対数が少な
い・−とによる。しかし電極指対数は、比帯域幅によっ
て決まり、これを変えることは出来ない。また電極指の
開口長を大きくすることによりGtを大きく出来るが、
この方法は装置寸法の増大を招いてしまう。
The signal source side radiation conductance GL of this surface acoustic wave device
The reason why is small is that the frequency is low and the number of electrode finger pairs is small. However, the number of electrode finger pairs is determined by the fractional bandwidth and cannot be changed. Furthermore, Gt can be increased by increasing the aperture length of the electrode fingers;
This method results in an increase in device size.

このように、従来の弾性表面波装置では、電極指のアド
ミッタンスの自由1(が小さく、電圧損失が大きいか、
又は装置寸法が増大してしまうという不具合を有してい
た。
In this way, in conventional surface acoustic wave devices, the admittance freedom 1 (of the electrode fingers is small, the voltage loss is large,
Otherwise, there was a problem that the size of the device increased.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、前記従来の不具合を改善し、小型のま
ま、接続する機器にアドミッタンスを近付け、電圧損失
の低減を計った弾性表面波装置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a surface acoustic wave device that improves the above-mentioned conventional problems, has an admittance close to connected equipment, and reduces voltage loss while remaining small.

〔発明の概要〕[Summary of the invention]

上記目的を達成するために本発明においては、少なくと
も一方の電極の電極指対数を20未満とし、かつ、その
電極指の繰り返し周期の1/2(第2図中に示す寸法5
)に対する電極指幅(第2図中に示す寸法6)の百分率
比すなわちメタライゼーシロンレイシロを76%以上ま
たは24%以下にして弾性表面波装置のアドミッタンス
を、結合回路に近付けるようにした。
In order to achieve the above object, in the present invention, the number of pairs of electrode fingers of at least one electrode is less than 20, and 1/2 of the repetition period of the electrode fingers (dimension 5
) to the electrode finger width (dimension 6 shown in Figure 2), that is, the metallization ratio is set to 76% or more or 24% or less to bring the admittance of the surface acoustic wave device close to that of the coupling circuit. .

電極指のメタライゼーションレイショと弾性表面波装置
の関係については、従来から種々の解析や実験がなされ
ており、例えばSm1th(IE E E ’l’ra
ns、 MTT −25,No、 11.1975)等
は、メタライゼーションレイショと容量及び放射コンダ
クタンスの関係は、メタライゼーションレイショを増加
させることにより、電極指の容量は増加するが、放射コ
ンダクタンスはメタライゼ−ションレイシ目が50%の
とき最大で、それ以外では減少すると報告している。し
かし、本発明者の実験によれば、上記報告は電極指対数
が多い(20対以上)場合についてのものであり、VT
R用の弾性表面波装置等電極指対数の少ない場合には適
合しない。
Regarding the relationship between the metallization ratio of electrode fingers and surface acoustic wave devices, various analyzes and experiments have been conducted in the past.
ns, MTT-25, No. 11.1975) et al., the relationship between metallization ratio, capacitance, and radiation conductance is that by increasing the metallization ratio, the capacitance of the electrode finger increases, but the radiation conductance increases as the metallization ratio increases. It has been reported that the rate is maximum when 50% of the order is 50%, and decreases at other times. However, according to the inventor's experiments, the above report concerns the case where the number of electrode finger pairs is large (20 or more), and the VT
It is not suitable for cases where the number of pairs of electrode fingers is small, such as surface acoustic wave devices for R.

WL極極対対数35電極指開口長1890μm、ソリッ
ド電極の場合に、本発明者が実験の結果得たメタライゼ
ーションレイシロと放射コンダクタンスとの関係を第3
図に、また、メタライゼーションレイシロと容量との関
係を第4図に示す。
In the case of a WL pole pair number of 35 electrode finger opening length of 1890 μm and a solid electrode, the relationship between metallization radiation and radiation conductance obtained by the inventor as a result of experiments is expressed in the third example.
In addition, the relationship between the metallization ratio and the capacitance is shown in FIG.

ここで、容量及び放射コンダクタンスは電極指1対、開
口長1μm当たりの値である。
Here, the capacitance and radiation conductance are values per pair of electrode fingers and 1 μm of aperture length.

このように容量および放射コンダクタンスはメタライゼ
ーションレイシロに伴って増加し、メタライゼーション
レイシロにより、装置のアドミッタンスを、メタライゼ
ーションレイシロ50%の場合に対【2、約0.1倍か
ら2倍まで変えられることが分かった。このとき、電圧
損失が改善されるか、またはアドミッタンスを不変とし
て、開口長を小さくシ、小型化を計れる。
In this way, the capacitance and radiation conductance increase with the metallization Raysilo, and the metallization Raysilo increases the admittance of the device by about 0.1 to 2 times compared to the case of 50% metallization Raysilo. I found out that it can be changed. At this time, the voltage loss can be improved or the admittance can be kept unchanged and the aperture length can be reduced to achieve miniaturization.

また、二重電極構造でも同様の効果があることは明らか
である。
Furthermore, it is clear that a double electrode structure has similar effects.

〔発明の実施例〕[Embodiments of the invention]

実施例として、VTRのFM再生位相等化器に用いる弾
性表面波装置について説明する。
As an example, a surface acoustic wave device used in an FM reproduction phase equalizer of a VTR will be described.

本装置は、ビデオヘッドの特性補償のため用いられるも
ので、装置の作成上、ビデオ信号をアップコンバートし
て周波数変換して用いる。
This device is used to compensate for the characteristics of a video head, and when creating the device, the video signal is up-converted and frequency-converted.

重列ではアップコンバート周波数を1iMHzとし、装
置の中心周波数を15MITzとした。本発明の第1実
施例を第5[i!!Iを用いて説明する。
In the multi-array, the upconversion frequency was 1 iMHz, and the center frequency of the device was 15 MITz. The first embodiment of the present invention is described in the fifth [i! ! This will be explained using I.

圧電性基板1は板厚0.5m、、128度回転Y軸カッ
トX伝搬ニオブ酸リチウム単結晶を用いた。
As the piezoelectric substrate 1, a 128-degree rotated Y-axis cut, X-propagating lithium niobate single crystal with a plate thickness of 0.5 m was used.

入力電極2は3.5対のソリッド電極の正規型電極でメ
タライゼーションレイシロは90%、出力電極5は8.
5対の二重電極構造の重み付けl(極でメタライゼーシ
ョンレイシロは50%である。また、これらの電極はa
ooo Aのアルミニウム蒸着膜をホトリソグラフィ技
術により形成した。電極指の開口長は1890μmであ
る。このとき、装置のアドミッタンスは、中心周波数で
Qj=0.12m0 、 Bi=0.76mty 、 
Go=0.041m 5r 、B□=0.74m c’
で、入力側のアドミッタンスは従来に比へ約1.7倍に
増加し、信号源側アドミッタンスが50m−r、負荷側
アドミッタンスが0.2mQ−のとき、電圧1失は20
JdB となり、従来に比べて5dB低減された。
The input electrode 2 is a regular type electrode with 3.5 pairs of solid electrodes, and the metallization ratio is 90%, and the output electrode 5 is 8.5%.
The weighting of the 5-pair dual electrode structure l (the metallization reciprocity at the poles is 50%. Also, these electrodes have a
ooo An aluminum vapor deposited film of A was formed by photolithography technology. The opening length of the electrode finger is 1890 μm. At this time, the admittance of the device is Qj=0.12m0, Bi=0.76mty at the center frequency,
Go=0.041m 5r, B□=0.74m c'
Therefore, the admittance on the input side has increased approximately 1.7 times compared to the conventional one, and when the admittance on the signal source side is 50 m-r and the admittance on the load side is 0.2 mQ-, the voltage loss is 20
JdB, which is 5 dB lower than before.

次に、本発明の第2実施例について説明する。Next, a second embodiment of the present invention will be described.

第2実施例は第1実a例とは電極指開口長を1000μ
mにした点のみに異なっており、その他は同一である。
The second example differs from the first example in that the electrode finger aperture length is 1000 μm.
The only difference is that it is set to m, and the rest are the same.

このとき装置のアドミッタンスは、中心周波数テGt=
=0.104m ’ 、 B L=0.66m ;、、
Q□==0.035m二: 、BO=0.64m;で、
電圧損失は21.1dBとなり、従来に比べて2.3d
B低減され、がっ、装置の圧電性基板寸法は9 HHX
 2.2 mmと12%低減できた。
At this time, the admittance of the device is the center frequency te Gt=
=0.104m', B L=0.66m ;,,
Q = = 0.035 m2: , BO = 0.64 m;
Voltage loss is 21.1dB, which is 2.3d lower than before.
B is reduced, and the piezoelectric substrate dimensions of the device are 9 HHX
This was a 12% reduction to 2.2 mm.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、放射コンダクタン
スを従来の約01倍から2倍まで変えることか出来、電
圧損失の改善と装置の小型化が計れる。
As explained above, according to the present invention, the radiation conductance can be changed from about 0.1 times to 2 times that of the conventional method, thereby improving voltage loss and downsizing the device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の弾性表面波装置の電極パターン図、第2
図はメタライゼーションレイシロの説明図、第3図はメ
タライゼーションレイシロと放射コンダクタンスの関係
を示す図、第4図はメタライゼーションレイシロと容量
の関係を示す図、第5図は本発明第1実施例の¥IL極
パターン図である。 1・・・圧電性基板、 2.3・・・櫛型電極、7・・
・メタライゼーションレイシロと放射コンダクタンスの
関係を示す特性曲線、 8・・・メタライゼーションレイシロと容量の関係を示
す特性曲線。 弔 1 図 第 2 ダ ×104 罵 3 図 メタライ亡′−ジョレレシオCe′/−J手続補正書(
方式) 特許庁長官殿 jlj件の表示 昭和 58年特許願第 185002号発明の名称 弾
性表面波装置 補正をする者 IIfl!:σ匍fイ 特許出願人 r、称 151す)11式会ン! 日 立 製 作 所
代 理 人
Figure 1 is an electrode pattern diagram of a conventional surface acoustic wave device;
The figure is an explanatory diagram of metallization Reishiro, Fig. 3 is a diagram showing the relationship between metallization Reishiro and radiation conductance, Figure 4 is a diagram showing the relationship between metallization Reishiro and capacitance, and Figure 5 is a diagram showing the relationship between metallization Reishiro and capacitance. FIG. 3 is a diagram of the ¥IL pole pattern of one embodiment. 1... Piezoelectric substrate, 2.3... Comb-shaped electrode, 7...
・Characteristic curve showing the relationship between metallization Reishiro and radiation conductance, 8...Characteristic curve showing the relationship between metallization Reishiro and capacitance. Condolences 1 Diagram 2 Da
Method) Director General of the Patent OfficeJljIndication 1982 Patent Application No. 185002 Title of Invention Person who corrects surface acoustic wave device IIfl! :σ匍fii Patent applicant r, title 151su) 11th ceremony! Hitachi Manufacturing Agent

Claims (1)

【特許請求の範囲】 1)圧電性基板上に少なくとも1組の人力および出力櫛
型電極を対向して配設した弾性表面波装置において、前
記櫛型電極のうち少なくとも一方は、電極指対数が20
未満、かつ電極指の繰り返し周期の1/2に対する電極
指幅の百分率比が76%以上または24%以下であるこ
とを特徴とする弾性表面波装置。 2)対向して配設した櫛型電極の電極指の上記電極指幅
百分率比が、一方の電極では24%以下で、他方の電極
では76%以上である特許請求の範囲第1項記載の弾性
表面波装置。
[Scope of Claims] 1) In a surface acoustic wave device in which at least one set of manual and output comb-shaped electrodes are disposed facing each other on a piezoelectric substrate, at least one of the comb-shaped electrodes has a number of pairs of electrode fingers. 20
and a percentage ratio of the electrode finger width to 1/2 of the repetition period of the electrode fingers is 76% or more or 24% or less. 2) The electrode finger width percentage ratio of the electrode fingers of the comb-shaped electrodes arranged facing each other is 24% or less for one electrode and 76% or more for the other electrode. Surface acoustic wave device.
JP18500283A 1983-10-05 1983-10-05 Surface acoustic wave device Pending JPS6077509A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18500283A JPS6077509A (en) 1983-10-05 1983-10-05 Surface acoustic wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18500283A JPS6077509A (en) 1983-10-05 1983-10-05 Surface acoustic wave device

Publications (1)

Publication Number Publication Date
JPS6077509A true JPS6077509A (en) 1985-05-02

Family

ID=16163055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18500283A Pending JPS6077509A (en) 1983-10-05 1983-10-05 Surface acoustic wave device

Country Status (1)

Country Link
JP (1) JPS6077509A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999044284A1 (en) * 1998-02-24 1999-09-02 Mitsubishi Denki Kabushiki Kaisha Surface acoustic wave element

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561805A (en) * 1979-06-19 1981-01-10 Yanmar Agricult Equip Automatic steering device for transplanter
JPS58154914A (en) * 1982-03-10 1983-09-14 Hitachi Ltd surface acoustic wave device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561805A (en) * 1979-06-19 1981-01-10 Yanmar Agricult Equip Automatic steering device for transplanter
JPS58154914A (en) * 1982-03-10 1983-09-14 Hitachi Ltd surface acoustic wave device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999044284A1 (en) * 1998-02-24 1999-09-02 Mitsubishi Denki Kabushiki Kaisha Surface acoustic wave element

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