JPS607752A - Semiconductor device and its manufacture - Google Patents

Abstract

PURPOSE:To enable mounting a semiconductor element without interruption by a lead wire terminal by providing plural number of penetrated holes on the main body of a package which mounts the semiconductor element to enable insertion of the lead wire terminal from either the front or the back surface and by providing a conductive film on the internal wall of the hole. CONSTITUTION:On one side of the main body 11 of a package, a recessed portion is formed where a semiconductor element is mounted and wiring electrodes provided on the element are connected to the wiring circuit of the main body 11 using a wire. Then, the wiring circuit is connected to such as lead wire terminals 23a, 23b which are penetrated through adjacent of the main body 11. In this case, the terminals 23a, 23b can be inserted from either surface through penetrated holes 13a and 13b and the internal wall of the hole is coated with a conductive film. In this construction, the terminals 23a, 23b penetrate through a insulation plate 9 and are fixed making the projected parts 25a, 25b and the inserting parts 24a, 24b protruded at the end of the plate 9. After the element is mounted, the inserting parts 24a and 24b are put in and fixed and a heat sink 8 is attached on the surface of the main body 11 facing the element.

Description

DETAILED DESCRIPTION OF THE INVENTION Cal Technical Field of the Invention The present invention relates to a semiconductor device, and in particular to a structure of a lead wire terminal lead-out portion and a method of manufacturing the same.

(b) Background of the Technology As the performance of semiconductor devices progresses, the degree of circuit integration within semiconductor elements increases and the amount of heat generated increases. In order to deal with this, configurations that can effectively dissipate heat are being developed.

The cavity down (Cavity Dos*n) method has emerged as a solution to this problem, and its excellent heat dissipation effect has contributed to the practical application of excellent semiconductor devices.

fc) Prior art and problems Figure 1 (Al is a block diagram of an example of a semiconductor device using the conventional cavity down method, Figure 1 (b) is a block diagram of the package body, 1 is the package body, 2 is the substrate , 2a
is the cavity, 3a and 3b are lead wire terminals, 4a and 4b
5 represents a conductor pattern, 5 represents a semiconductor element, 6 represents a wire, 7 represents a cover, and 8 represents a heat sink.

Made of multilayer ceramic, multiple lead wire terminals 3a and 3b
A cavity 2 provided for mounting a semiconductor element 5 on the substrate 2 in which the semiconductor elements 5 and the like are implanted substantially perpendicularly to the surface of the substrate 2.
A is open on the main surface side from which the lead wire terminals 3a, 3b, etc. protrude, and is located on the bottom surface of the cavity 2a, and is open to the semiconductor element 5.
The pad to be bonded is connected to a lead wire terminal, e.g. 3a, with a conductor pattern 4a, and other lead wire terminals, e.g. 3b, etc. are connected to a circuit lead-out band connected to the semiconductor element 5 with a wire 6, with a conductor pattern 4b. connected and first
The pan cage main body 1 shown in Figure (b) has - pieces of completed parts.

To assemble this into a semiconductor device, after placing and bonding the semiconductor element 5 on the bottom surface of the cavity 2a, the circuit lead-out pad of the semiconductor element and the circuit lead-out pad of the package body 1 are connected with the wire 6. After mounting the semiconductor element 5, a cover 7 is placed over the opening of the cavity 2a to seal the cavity 2a, and the cover 7 is bonded to the substrate 2 to complete the semiconductor device body. A heat sink 8 is attached to the substrate to complete the semiconductor device shown in FIG. 1(a).

In this cavity-down type semiconductor device, the semiconductor element 5 and the thinly formed surface of the substrate 2, as well as the back surface of the substrate 2 and the heat sink 8, are all bonded to each other at their surfaces. The heat generated on the surface of the semiconductor element 50 is effectively transferred to the heat sink 8 and has an excellent heat dissipation function, but the work of mounting the semiconductor element 5 on the package body 1, especially connecting the two bands with the wire 6, is difficult. The work to be done is to connect the lead wire terminals 3a and 3a implanted on the board 2.
3b etc. are in the way and have the disadvantage of being extremely difficult.

(dl) Purpose of the Invention In view of the above-mentioned conventional drawbacks, an object of the present invention is to provide a structure of a cavity-down type semiconductor device and a method for manufacturing the same, in which a semiconductor element can be mounted without being obstructed by a lead wire terminal. .

(Q) Structure of the Invention The above object is to form a through hole for inserting a lead wire terminal in each lead-out portion from which a plurality of lead wire terminals are led out in a package body in which a semiconductor element is mounted, and to insert the through hole into the inner surface. The package has a conductive film connected to the internal wiring in the package body, and the lead wire terminal can be inserted from either the main surface or the back surface of the package body. After mounting the semiconductor element on the main body and performing necessary sealing, etc., the plurality of lead wire terminals are inserted and fixed into the cough M through holes, and if necessary, the plurality of lead wire terminals are This is achieved by the structure of the present invention, in which the plurality of lead wire terminals are fixed to each other with an insulating plate, and the plurality of lead wire terminals are inserted and fixed into the through hole at once.

According to this configuration, since there are no lead wire terminals when mounting a semiconductor element, the work is easy, and the protruding portion of the lead wire terminal is placed on the semiconductor element mounting surface side which is the main surface side of the package body. If it is inserted and fixed at the position, the desired cavity down method will be achieved.

Furthermore, by positioning the protruding portion of the lead wire terminal on the back side and inserting and fixing it, it is possible to open the cavity.
ty Up) method, which can also contribute to the standardization of parts.

Furthermore, since there are no abnormally shaped protrusions such as lead wire terminals on the pancage body, the process of mounting and sealing the semiconductor elements has the advantage of being easier to automate assembling.

(fl Embodiments of the Invention Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same reference numerals indicate the same objects throughout the drawings.

FIG. 2 is a block diagram of an example of a puff cage main body according to the present invention, FIG. 3 is a block diagram of a semiconductor device main body, FIG. 4 is a block diagram of a lead wire terminal assembly, and FIGS. Figure 5 (b) is a block diagram of a completed semiconductor device that also uses the cavity down method, Figures 6 (a) and 6 (bl) are block diagrams of a completed semiconductor device that also uses the cavity-knob method, and 9 is a block diagram of a completed semiconductor device that also uses the cavity-down method. An insulating plate, 11 is a socket body, 12 is a substrate, 12a is a cavity, 13a and 13b are through holes, 1
4a and 44b are conductor patterns, 20 is a semiconductor device body,
21 is a lead wire terminal assembly, 23a and 23b are lead wire terminals, 24a and 24b are insertion portions, and 25a and 25b are protruding portions, respectively.

In the package body 11 shown in FIG. 2, the lead wire terminals 3a, 3b, etc. in the package body 1 shown in FIG. It can be inserted substantially vertically from either the top or the rear surface, and has a plurality of through holes 13a, 13b, etc., each having a conductive film on the inner surface. As in the case of FIG. 1(b), the conductor film in the through hole 13a, for example, is connected to the conductor pattern 14a, and the conductor films in other through holes 13b, etc. are connected to the conductor pattern 14b.

The procedure for assembling the semiconductor device is as follows.

First, the semiconductor element 5 is placed and bonded on the bottom surface of the cavity 12a, and the semiconductor element 5 connected with the wire 6 is mounted.The cavity 12a is sealed with the cover 7, and the semiconductor device main body 20 shown in FIG. 3 is completed. Finalize. This work includes:
Fig. 1 (Similar to the case of al), but since there is no obstacle such as a lead wire terminal that gets in the way of the work, and the work is flat, the work is easy and automation is easy.

Next, as shown in FIG. 5(a), the lead wire terminals 23a and
The protruding parts 25a, 25b, etc., such as 23b, are positioned on the opening side of the cavity 12a, and the insertion parts 24a, 25b, etc. are positioned on the opening side of the cavity 12a.
24b, etc., into the through hole 13a/1 of the package body 11.
3b and the like, and a heat sink 8 is attached to the opposite side to complete a cavity down type semiconductor device.

If it is desired to insert and fix a plurality of lead wire terminals 23a, 23b, etc. all at once, a lead wire terminal assembly 21 shown in FIG. 4 may be prepared. This is the lead wire terminal 23
a, 23b, etc. are arranged to match the arrangement of the through holes 13a, 13b, and the insertion portions 24a, 24b, etc., and the protruding portions 25a, 25b, etc. are disclosed, and the insulating plate 9 is made of an insulating material. When these are used, the completed semiconductor device is as shown in FIG. 5(b).

In the above configuration, if the protrusions 25a, 25b, etc. of the lead wire terminals 23a, 23b, etc. are positioned opposite to the opening side of the cavity 12a and inserted and fixed, as shown in FIG. 6(a).
- As shown in FIG. 6 (bl), it is possible to use a cavity-knob type semiconductor device. Therefore, with the configuration of the present invention, it is also possible to use common parts for both types.

(gl Effects of the Invention As explained above, according to the structure of the present invention, it is possible to provide a structure of a cavity-down type semiconductor device and a manufacturing method thereof, in which a semiconductor element can be mounted without being obstructed by lead wire terminals. Furthermore, it becomes possible to share parts with the cavity-up method, which has the effect of making it possible to stabilize the production of semiconductor devices.

[Brief explanation of drawings]

FIG. 1 (Al is a configuration diagram of an example of a semiconductor device using the conventional cavity down method, FIG. 1 (6) is a configuration diagram of its package body, and FIG. 2 is a configuration diagram of an example of a pan cage body according to the configuration of the present invention. , Fig. 3 is the same (configuration diagram of the semiconductor device main body, Fig. 4 is the same (configuration diagram of lead wire terminal assembly, Fig. 5 (a) and Fig. 5 (b) is the same semiconductor device of the cavity down method. Completed configuration diagram, Figure 6 (a), Figure 6
FIG. 1b) is a diagram illustrating the completed structure of a semiconductor device also using the cavity-up method. In the drawings, 1 is a pan cage body, 2 is a substrate, 2a is a cavity, 3a and 3b are lead wire terminals, 4a and 4b are conductor patterns, 5 is a semiconductor element, 6 is a wire, 7 is a cover, 8 is a heat sink, and 9 is a Insulating plate, 11 is the package body, 12 is the substrate, 12a is the cavity, 13a.
b is a through hole, 14a 44b is a conductor pattern, 20 is a semiconductor device body, 21 is a lead wire terminal assembly, 23a-23
b is a lead wire terminal, 24a and 24b are insertion parts, 25a
- 25b indicates a protrusion. Episode 4

Claims (1)

[Claims] (11) A plurality of through holes for inserting lead wire terminals are formed in the package body on which the semiconductor element is mounted, and the through holes have a conductor film connected to the internal wiring in the pan cage body on the inner surface. The lead wire terminals can be inserted from either the main surface or the back surface of the pan cage main body, and a plurality of the lead wire terminals are inserted and fixed into the through holes, respectively. (2) The semiconductor device according to claim (1), wherein the plurality of lead wire terminals are mutually held by an insulating plate separate from the pancage body. (3) The semiconductor device according to claim 11 or (2), wherein the lead wire terminal protrudes on the same side as the mounting surface of the semiconductor element. (4) A step of forming a plurality of through holes for inserting lead wire terminals having a conductive film on the inner surface in a package body on which a semiconductor element is mounted, a step of mounting the semiconductor element in the package body and sealing it, and then a step of sealing the package body. (5) In the step of inserting and fixing a plurality of lead wire terminals into the through hole, the plurality of leads 4. The method of manufacturing a semiconductor device according to claim 4, wherein the wire terminals are mutually held in advance by insulating plates, and then inserted and fixed all at once into the through hole.