JPS60794A - Guide mechanism for electronic part associating device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a mechanism for guiding leads created to be suitable for application to an apparatus for assembling electronic components with leads into a printed circuit board.

[Background of the invention]

Automated equipment for assembling leaded components onto printed circuit boards is being put into practical use, but a means to effectively guide the component leads into the lead holes of the printed circuit board has not yet been developed. Currently, the printed circuit board is manually positioned so that it is aligned with the lead hole.

For this reason, complete automation of electronic component assembling devices has been hindered.

The main reasons for having to add manual labor in this way are as follows.

(a) There is a slight error in the lead hole position of the printed circuit board. (b) There is a slight error or play in the so-called XY table that supports the printed circuit board and moves it within a plane.
If the errors in a) and (b) are left behind, the result will be an error of about 0.2 ms, and it is impossible to eliminate this error with the current technology based on economic profitability.

(C) In fact, the lead of the component is also slightly deformed and cannot be properly inserted into the lead hole unless this is corrected.

[Purpose of the invention]

The present invention was made in view of the above circumstances, and even if there is an XY table error of about a fraction of the lead hole diameter and a lead bending error of several times the lead hole diameter, the tip of the lead can be quickly and reliably fixed. The purpose of the present invention is to provide a guide device that can guide leads into lead holes, thereby contributing to the full automation of equipment for assembling electronic components with leads.

[Summary of the invention]

In order to achieve the above object, the guide device of the present invention provides a built-in device for inserting the above-mentioned leads into a printed circuit board having a hole for inserting the lead of an electronic component. a guide pin, a hook-shaped bin guide that engages with the guide pin, and a funnel-shaped lead guide fixed to the bin guide, and a small diameter portion at the lower end of the funnel-shaped lead guide. The present invention is characterized in that a means for approximately aligning the position with respect to the hole in the green l plate is provided, and a funnel-shaped lead guide is elastically supported by the above-mentioned approximate positioning means.

[Embodiments of the invention]

Next, one embodiment of the present invention will be described with reference to FIGS. 1 to 5.

Fig. 1 is a front view of the guide device of the present invention, and Fig. 2 is a plan view thereof.
, 1 is mounted on a printed circuit board 3.
An embodiment of a guide mechanism configured by applying the present invention is attached to a component assembling device configured to be inserted into a pair of lead holes 4. In this example, as shown in the figure, the lead 1 is slightly distorted, so the interval between its tips is slightly deviated from the dimension p. t is the bending dimension of the lead.

For convenience of explanation, the axis x-x' is 9.2 straight in the horizontal plane.

and Y-Y'. The printed circuit board 3 is driven by an XY table (not shown) in the ax-x' force direction and the Y-Y' direction.

Below the printed circuit board 3, a pair of pointed guide pins 5 that can be driven up and down are vertically supported on an XY table.

6 is a screw for screw feeding 9 for adjusting the distance between the pair of guide pins 50, and 7 is a driving motor thereof.

A funnel-shaped lead guide 8 is configured to guide the component lead 1 into the lead hole 4.

The lead guide 8 of this example is constructed in the shape of an inverted pyramid with a medium beam. FIG. 3 is a partially sectional perspective view thereof.

The lead guide 8 of this example is provided with a pair of slope plates 8b at the bottom of a rectangular frame 8a. It consists of:

Arrows a and a' are shown in the figure.

b represents the direction of inclination. This slope plate 8
b may be configured as shown in FIG. 4(2).

The Q portion facing the tip of each slope in the direction of inclination is the minimum diameter portion corresponding to the mouth of the funnel. (Not shown)
When the reed is lowered, the tip of the reed hits the slope plate 8b and is guided in the slope direction shown by arrows e and e', reaches the grooved slope 8C, and is guided toward the mouth part Q as shown by arrow f. .

As shown in FIG. 5, when the lead guide 8 is positioned near the guide pin 5, a hook-shaped bottle guide 9 is installed to guide the guide pin 5 toward the mouth portion Q. It is configured and fixed to the lead guide 8.

In this embodiment, the frame 8a of the lead guide 8 and the bin guide 9 are integrally molded from one metal plate.

Accordingly, when the lead guide 8 is fixed to the temporary shaft and the guide pin 5 is moved in the direction of the arrow X, the guide pin 5 is guided to the mouth part Q.

Still fix the guide pin 5 and move the lead guide 8 in the direction of arrow
'When moved in the force direction, the bottle guide 9 engages with the guide pin 5 such that the mouth portion Q coincides with the guide pin 5.

10 shown in FIG. 2 is a moving base, and actuator 1
1 in the x-x' force direction, actuator 12 in the Y direction
-Y' direction respectively.

This movable base 10 includes a bracket 13. Spring 1
4, the lead guide 8 is elastically supported. For the lead guide 8 supported in this way,
Supports the printed circuit board 3/ζXY table (not shown)
By driving the lead guide, the opening of the lead guide and the lead hole of the printed circuit board can be roughly aligned.

The accuracy of this positioning can be kept within an error of approximately ±0.2 trrrn using the conventional technology, as described above, but when the present invention is applied, the accuracy will be reduced to 1/1 of the diameter of the lead hole 4 due to the effect described later. Since an error of about 3.3 can be automatically corrected to zero, there is no technical difficulty in performing the general positioning described above.

15a and 15b shown in FIG. 1 are holding means, which have the function of holding the printed circuit board 3 and lead guide 8 together.

Next, a method of using the guide mechanism configured as described above will be described.

As shown in FIG. 1, the guide pin 5 is positioned almost directly below the lead hole 4 of the printed circuit board 3 and raised.

In this case, since the tip of the guide pin 5 is sharp, misalignment within about 1/3 of the hole diameter is automatically corrected. This automatic correction function is performed within the range of the backlash of the support of the guide pin 5 and the tolerance of the support of the printed circuit board.

As described above, the guide pin 5 is raised and positioned adjacent to the bin guide 9 as shown in FIG. In this state, the bottle guide 9 and the lead guide 8 are connected to the spring 1
4 (Fig. 2). When the guide pin 5 inserted into the lead hole of the printed circuit board 3 is driven in the direction of the arrow X in FIG. 5 together with the printed circuit board by using an XY table (not shown), the roughly aligned bins The guide pin 5 engages with the guide 9, bends the spring 14, and performs accurate positioning. In this operation. Since an error corresponding to the deflection of the spring 14 is allowed in the operation of the driving means, there is no technical difficulty in separately providing the driving means.

In this way, when the lead hole 4 and the lead guide 8 are aligned via the guide pin 5, the holding means 15a,
15b to relatively fix both members, and the guide pin 5 is lowered and retracted.

After completing the above preparations, the holder 1 will be placed as shown in Figure 1.
The leaded component 2 held at 6 is moved so that the lead 1 faces the lead guide 8.

If the dimension in the x-x' direction of the lead guide 8 is L, then the center point 0 of the pair of leads 1 is the center point O' of the lead hole 4.
If Li2 is biased to three sides in the figure, the tip of lead l will be almost directly opposite the center of lead guide 8.

In this case, if the curved dimension t of the lead tip is slightly smaller than Li2, the lead 1 will be guided into the lead hole 4 when the component 2 is lowered. During this lead insertion operation, the actuators 11 and 12 shown in FIG. 2 are operated to retract the lead guide 8 so that the lead guide 8 does not get in the way. Since the lead 1 is guided by a lead guide, a normal degree of warping is allowed as long as there is no abnormal deformation of the lead. That is, in FIG. 1, the lead song is allowed to sit within the range of t<Li2.

〔Effect of the invention〕

As described in detail above, the guide device of the present invention is a built-in device K for inserting the above-mentioned lead into a printed circuit board having a hole for inserting the lead of an electronic component. a guide pin, a hook-shaped bin guide that engages with the guide pin, and a funnel-shaped lead guide fixed to the bin guide, and a small diameter portion at the lower end of the funnel-shaped lead guide. With a simple structure in which a means for approximately aligning the position with respect to the hole in the printed circuit board is provided, and a funnel-shaped lead guide is elastically supported by the above-mentioned approximate positioning means, the XY angle of 18 degrees, which is a fraction of the lead hole diameter, is Even if there is a table error and a lead curve several times the diameter of the lead hole, the tip of the lead can be guided quickly and reliably to the lead hole, which greatly contributes to the automation of Kameko component assembly equipment. be.

[Brief explanation of the drawing]

FIG. 1 is a front view of an embodiment of a guide mechanism for an electronic component assembling apparatus according to the present invention, and FIG. 2 is a plan view thereof. FIG. 3 is a partially cutaway perspective view of the lead guide of the above embodiment, FIG. 4 is a perspective view of an extracted slope plate of the lead guide, and FIG.
The figure is an explanatory view of the same effect. 1... Lead, 2... Shinko parts, 3... Printed circuit board, 4... Lead hole, 5... Guide pin, 6...
・Screw, 7... Drive motor, 8... Lead guide, 8a... Surrounding frame, 8b... Slope plate, 8C...
Grooved slope, 9... Pin guide, 10... Moving base, 11.12... Actuator, 13... Bracket, 14... Spring, 16... Parts holder. Agent Patent Attorney Masami Akimoto X' 4-Figure 1 θ

Claims (1)

[Claims] 1. A built-in device for inserting the above lead into a printed circuit board having a hole for inserting the lead of an electronic component, including a pointed guide pin that can be inserted into and removed from the hole, and a hook that engages with the guide pin. A means for providing a shaped bin guide and a funnel-shaped lead guide fixed to the bin guide, and for roughly positioning a small diameter portion at the lower end of the funnel-shaped lead guide with respect to a hole in a printed circuit board. At the same time, the funnel-shaped lead guide is elastically supported by the above-mentioned rough positioning means, and the guide pin inserted through the hole in the printed circuit board is engaged with the pin guide to precisely connect the printed circuit board and the lead guide. A guide mechanism for an electronic component assembly device, which is characterized by being capable of positioning.