JPS6083838A - Manufacture of multilayer board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 〔Technical field〕 It is related to

1 Background technology] Prepreg is manufactured by impregnating a base material such as glass cloth with a resin varnish and drying it, but the resin varnish used in the manufacture of pre-registers is polymerization type mt+h.
When varnish is used, there is a problem that water is released during heating and acid formation, reducing the adhesive strength. Even when the resin varnish is manufactured using resin varnish and the outer layer material or inner layer material such as brocade foil is laminated and molded, there is still a drawback that the adhesion between the inner and outer layer materials is insufficient.

OBJECTS OF THE INVENTION (1) The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing a multilayer board that can improve interlayer designability.

Disclosure of 1 shot 81J] That is, the present invention impregnates and dries a base material with a polycondensation type resin varnish, and then impregnates and dries an addition polymerization type resin varnish.
Let it dry to create a tsurizu register, and add fj! Is it laminated molding with i layer? Characterized by many N! The unexploded FIA, which is a method for manufacturing I-plates that achieves the above objectives, will be described in detail below. As the polycondensation resin varnish, polycondensation resin varnish can be used, and this resin varnish generally has good moldability and produces products with good dimensional accuracy. It has characteristics such as good adhesion with copper foil and good water resistance.However, during molding, water is released by reaction, so water is present in the contact layer with copper foil. It has the disadvantage of reducing adhesion. Examples of commercially available polycondensation type varnishes include Torlon (Amco), Pyflon (Hitachi Chemical Co., Ltd.), Lamcil (G-E Co., Ltd.), and Polyimide (Japan Synthetic Rubber Co., Ltd.). And so on! As the addition polymerization type resin varnish, the conventionally used addition polymerization type polyimide resin varnish 11 can be used. When manufacturing the entire print register, the base material such as glass cloth or paper is impregnated with the resin varnish described above and when steering, the amount of wafer is preferably between convex and 25%. 1, and the volatile content is preferably less than 50%.Next, this material is further impregnated with an addition polymerization type resin varnish and dried to create a represi.The total amount of resin in this prepreg is 50%. It is preferable that the trench yc volatile content is less than about convexity.The inner layer material made in this way is made of replenishing steel foil, etc., and is layered between the outer waste trench and the dregs. Laminated and molded RIJ body into multi#&? However, by completely impregnating the base material with polycondensed resin varnish and drying, it is possible to obtain all properties of moldability, adhesion, and water resistance. Polycondensation tie′
The reaction of the resin J proceeds, and the water released in response to the reaction on the ki scale is volatilized. In particular, polycondensation type polyimide resin varnish has low viscosity and sieve reactivity, so it can be sufficiently impregnated into the base material, and it can also react with the surface treatment agent of the base material. The cohesive force can be completely increased and the contact strength can be increased, and when this resin varnish is used, the dimensional accuracy is good and the moldability can be completely improved. Next, by impregnating and drying this material with a q-polymerized resin varnish, the outer layer material and the inner layer material can be replenished without the presence of water between the outer layer material and the inner layer material. It has high contact strength and can be bonded.

The following is a detailed explanation based on all the embodiments of the present invention (Example) varnish (polyimide, manufactured by Nippon Arien Co., Ltd.) with a thickness of 0.1 It was impregnated with a straw cloth and dried to obtain a varnish with 20% fat loss and 2.0% volatile content, and then impregnated with an addition polymerization type holinide'jfII fat varnish and dried. The total amount of resin was 55 inches (11 shots made of 2.0 inches of hanging plate was obtained. Next, electric circuits were formed on both mj and the thickness was IN) vi
Place one copy of the above on the top and bottom of the cover, and add I'l'-sa1. A piece of O*a [III Copper-clad polyimide plate was laminated on both the upper and lower sides of the above-mentioned sling register with the copper foil tlik facing the outermost side, and the molding pressure was 40/, 4
・Multi-layer board with 4 scrap circuits formed by lamination molding at 165℃ for 20 minutes?
! 1- Got it.

<Conventional Example> Only the polyimide resin varnish used in the examples was impregnated into a glass cloth with a total thickness of 0, 1 ms, and dried.The resin amount was 55 cm, and the volatile content was 2.0. Next, 11-? of the multilayer boards obtained in the Example and the conventional example were obtained by lamination molding in the same manner as in the Example VI except that the sound was used.
The peak link strength of the shrine was measured. Results are shown below. From the table above, it was confirmed that the adhesive force with the inner layer material was improved in the multilayer board of the example made of soft sea urchin wood.

1 shot] young fruit I The above process involves impregnating and drying the base material with MkJ stand type resin varnish, then impregnating and drying it with addition polymerization type resin varnish to create a purizu register. Since this type of varnish is interposed between the inner layer material and the outer layer material, it is said that the adhesion strength will decrease due to the water released during the reaction of the Ichiinaai type tree varnish. Therefore, it is possible to produce a multilayer board with excellent interlayer adhesive strength without any problems.

Agent Patent Attorney Ishi 1) Ai Shichi

Claims (1)

[Claims] + I + The base material is impregnated with a polycondensation type resin varnish and dried, and then an addition polymerization type resin varnish is impregnated and dried to create a represi, which is then laminated between the inner layer of this prepreg and the outer layer material. A method for manufacturing a multilayer board, characterized by forming a small amount of scrap.