JPS6086253A - Preparation of high-strength conductive copper alloy - Google Patents
Preparation of high-strength conductive copper alloyInfo
- Publication number
- JPS6086253A JPS6086253A JP19354683A JP19354683A JPS6086253A JP S6086253 A JPS6086253 A JP S6086253A JP 19354683 A JP19354683 A JP 19354683A JP 19354683 A JP19354683 A JP 19354683A JP S6086253 A JPS6086253 A JP S6086253A
- Authority
- JP
- Japan
- Prior art keywords
- owt
- strength
- copper alloy
- conductive copper
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、後記する銅合金を150℃〜700℃で30
秒〜20時間熱処理し1強度特に引張強さ、伸び、ばね
性を同時に向上させる製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for heating a copper alloy described below at 150°C to 700°C for 30°C.
The present invention relates to a manufacturing method that simultaneously improves strength, especially tensile strength, elongation, and springiness by heat treatment for 20 seconds to 20 hours.
従来、丹←及び黄餉は、その優れた加工性並びに低コス
ト材料であるため、電子、電気部品材料としても広範囲
に使用されていた。しかし近年0機器、装皿の小型化、
軽量化により、更に強度の増加が強く要望されており、
また耐食性が劣るため、耐食性の向上に対しても強い要
望がある。Traditionally, tan and yellow porcelain have been widely used as materials for electronic and electrical parts because of their excellent workability and low cost. However, in recent years, equipment and packaging have become smaller,
Due to weight reduction, there is a strong demand for further increase in strength.
Furthermore, since the corrosion resistance is poor, there is a strong demand for improving the corrosion resistance.
本発明は、この点にねみなされた安価で強度。The present invention takes into consideration this point and is inexpensive and strong.
ばね性に優れ、耐食性にも優れた合金の性質を最大限に
発揮させるための製造方法に関するものであり1本発明
で定めた熱処理条件においてのみ最も優れた性質の発現
が可能に々ることを見出した。This relates to a manufacturing method for maximizing the properties of an alloy that has excellent spring properties and excellent corrosion resistance. 1. It is believed that the most excellent properties can only be expressed under the heat treatment conditions specified in the present invention. I found it.
そして本発明は、亜鉛10〜40wt%、pん0、00
5〜0.070wt係、錫Q、05〜1. Owt係、
アルミニウム0.05〜1. OwtZを含み、さらに
ホウ素αO05〜0.1 wtZ 、ニッケルQ、On
5〜1.OwtZ 。And the present invention contains zinc 10 to 40 wt%, pn 0.00
5-0.070wt, tin Q, 05-1. Mr. Owt,
Aluminum 0.05~1. Contains OwtZ, and further contains boron αO05~0.1 wtZ, nickel Q, On
5-1. OwtZ.
ケイg 0.005〜1. OwtZ 、鉄0.005
〜1.OwtZ 、鉛0.005−0.3 wteI)
、 :Iメルト0.005−1.OwtZ 、 クロム
0.005−1.OwtZ 、 マンガンα005〜1
.0 Wtcり。Kei g 0.005~1. OwtZ, iron 0.005
~1. OwtZ, lead 0.005-0.3 wteI)
, :Imelt 0.005-1. OwtZ, chromium 0.005-1. OwtZ, Manganese α005~1
.. 0 Wtc.
テルル0.005〜1、Owt幅、インジウム[100
5〜t o wtZ 、チタン0.005〜1.Owt
Z 、 ジルコニウム0.005−1. OwtZ 、
ハフニウム0.005〜1.0 wtfD。Tellurium 0.005~1, Owt width, Indium [100
5~towtZ, titanium 0.005~1. Owt
Z, zirconium 0.005-1. OwtZ,
Hafnium 0.005-1.0 wtfD.
ベリリウム0005〜1.0wt%、マグネシウム00
05〜t o wt96 、銀0.005−1.Owt
4 、カドミウム0005〜1.0vrt係、ゲルマニ
ウムQ、005〜1.Owt係。Beryllium 0005-1.0wt%, Magnesium 00
05-to wt96, silver 0.005-1. Owt
4, Cadmium 0005-1.0vrt, Germanium Q, 005-1. Owt staff.
ヒ素0005〜0.1wt労、アンチモン0005〜0
.1wt%の内何れか1種又は2種以上を合計0005
〜2. OwtZ含み、残部銅及び不可避的々不純物か
ら々る合金を最終冷間圧延の後に150℃〜700℃で
30秒〜20時間熱処理し2強度。Arsenic 0005~0.1wt, antimony 0005~0
.. 1wt% of any one or two or more types in total 0005
~2. After the final cold rolling, the alloy containing OwtZ and the balance copper and unavoidable impurities was heat treated at 150°C to 700°C for 30 seconds to 20 hours to obtain a strength of 2.
ばね性を向上させる高力導電銅合金の製造方法に間する
ものである。The present invention provides a method for producing a high-strength conductive copper alloy that improves spring properties.
これにより2本発明の方法で製造すると第1図に示すよ
うに、引張強さと伸び及びばね限界値と同時に著しく向
上させることができた。As a result, the tensile strength, elongation, and spring limit value could be significantly improved at the same time as shown in FIG. 1 when the two products were manufactured using the method of the present invention.
次に合金成分の限定理由を説明する。亜鉛の含有基:を
10〜40wt係とする理由は、亜鉛含有量がj O’
wt%wtZは強度が低く、亜鉛含有量が40 wt4
をこえるとβ相の析出が多量となり。Next, the reason for limiting the alloy components will be explained. The reason why the zinc content group is set to 10 to 40 wt is that the zinc content is j O'
wt% wtZ has low strength and zinc content is 40 wt4
If the temperature exceeds 100%, a large amount of β phase will precipitate.
材料特性が安定しなくなるためである。This is because the material properties become unstable.
りんの含有量を0.005〜0.070 w14とする
理由は、りん含有量が0. O05wt4未満では強度
が低く、耐食性の改善も期待できず、りん含有量が0.
070 wtφをこえると導電性の低下2粒界腐食が発
生し易くなるためである。The reason why the phosphorus content is set to 0.005 to 0.070 w14 is that the phosphorus content is 0.005 to 0.070 w14. If the phosphorus content is less than O05wt4, the strength will be low and no improvement in corrosion resistance can be expected.
This is because if it exceeds 0.070 wtφ, the conductivity decreases and intergranular corrosion tends to occur.
C,の含有量を0.05〜1、Owt96とする理由は
。The reason why the C content is set to 0.05 to 1, Owt96.
錫含有量がo、 o 5wt4未満では強度が低く、偲
含有量が1. o wtlをこえると導電性の低下が著
しくなるためである。If the tin content is less than 5wt4, the strength will be low; This is because if it exceeds 0 wtl, the conductivity will drop significantly.
アルミニウムの含有量を0.05〜t o wtZとす
る理由は、アルミニウム含有量:が0.0 S wt係
未満では強度が低く、アルミニウム含有量力1.0wt
%をこえると加工性が低下し、導電性の低下も著しくな
るためである。The reason why the aluminum content is set to 0.05 to 1.0 wtZ is that if the aluminum content is less than 0.0 swt, the strength is low, and if the aluminum content is less than 1.0 wt.
This is because if it exceeds %, workability decreases and the conductivity decreases significantly.
副成分として前記所定量のホウ素、ニッケル。The predetermined amounts of boron and nickel as subcomponents.
ケイ素、鉄、tL コバルト、クロム、マンガン。Silicon, iron, cobalt, chromium, manganese.
テルル、インジウム、チタン、ジルコニウム。Tellurium, indium, titanium, zirconium.
ハフニウム、ベリリウム、マグネシウム、銀。Hafnium, beryllium, magnesium, silver.
カドミウム、ケルマニウム、ヒ素、アンチモンから々る
群より選択された1種以上の総量が0、 O05wt%
未満では高強度の合金が得られず。The total amount of one or more selected from the group consisting of cadmium, kermanium, arsenic, and antimony is 0, O05wt%
If it is less than that, a high-strength alloy cannot be obtained.
才だ、2.0wt%をこえると導電、性の低下及び半田
付は性の低下が著しく々るためである。This is because, if the content exceeds 2.0 wt %, the conductivity, properties and soldering properties will be significantly reduced.
熱処理温度を150℃〜700℃に限定したのは150
℃未満では熱処理効果が現われず。150 limited the heat treatment temperature to 150℃ to 700℃
Below ℃, the heat treatment effect does not appear.
1だ700℃をこえる温度では短時間で軟化してしまう
ためである。そして最も好ましい熱処理温度は200℃
〜600℃である。This is because at temperatures exceeding 700°C, the material softens in a short period of time. And the most preferable heat treatment temperature is 200℃
~600°C.
熱処理時間を30秒〜20時間に限定したのは30秒未
満では材料特性が安定せず、20時間をこえると経済的
価値がなくなるからである。The reason why the heat treatment time is limited to 30 seconds to 20 hours is because if it is less than 30 seconds, the material properties will not be stable, and if it exceeds 20 hours, it will lose its economic value.
第1図は熱処理前後の引張強さとばね限界値の関係を表
わすグラフであるが2本発明の熱処理後では引張強さと
ばね帳界値がいずれも著しく向上している。FIG. 1 is a graph showing the relationship between the tensile strength and the spring limit value before and after heat treatment.2 After the heat treatment of the present invention, both the tensile strength and the spring limit value are significantly improved.
次に本発明の詳細な説明する。Next, the present invention will be explained in detail.
実施例
第1表に示した組成の合金を溶解し、厚さ30mmの鋳
塊を得た。次に鋳塊を約700℃で熱間圧延し、厚さ8
0關にした後1表面を面側する。そして冷間圧延で厚さ
1.0 romにした後。Example An alloy having the composition shown in Table 1 was melted to obtain an ingot with a thickness of 30 mm. Next, the ingot was hot rolled at approximately 700℃ to a thickness of 8
After setting it to zero, turn the first surface sideways. After cold rolling to a thickness of 1.0 ROM.
焼(屯を行い、最終圧延で厚さ0.5調にし200℃で
1時間熱処理する。この試料を約10重関係の硫酸で酸
洗し、引張強さ、伸び、ばね限界値を測定した。The sample was baked and then final rolled to a thickness of 0.5 and heat treated at 200°C for 1 hour. This sample was pickled with sulfuric acid of about 10 times the strength, and the tensile strength, elongation, and spring limit values were measured. .
第1表より熱処珂後、引張強さ、伸び、ばね限界値が同
時に向上している。Table 1 shows that after heat treatment, tensile strength, elongation, and spring limit value all improved at the same time.
以上の実施例及び第1図より本発明の製造方法で強度、
ばね性が向上し、電気、電子部品材料、特に導電性ばね
材料として優れた合金とがる。From the above examples and FIG. 1, the manufacturing method of the present invention has a
This alloy has improved spring properties and is an excellent material for electrical and electronic parts, especially conductive spring materials.
第1図は合金50熱処理前後の引張強さとばね限界値の
関係を表わすグラフである。
特許出願人 日本鉱業株式会社
代理人 弁理士(7569)並用啓志
第1図
引張強式 (Kg/mm2)FIG. 1 is a graph showing the relationship between tensile strength and spring limit value before and after heat treatment of Alloy 50. Patent applicant Nippon Mining Co., Ltd. Agent Patent attorney (7569) Keishi for general use Figure 1 Tensile strength type (Kg/mm2)
Claims (1)
070 wt% 。 錫0.05〜1.0 wt(支)、アルミニウム0.0
5〜1、 Owt’Zを含み、さらにホウ素[1005
−0,1wt%、ニッケ# 0.005−1.Owt%
、ケイ素00o5〜1. Owt係、鉄0005〜1
.Owt係、鉛0.0 O5〜0.3 wt係、コバル
ト0005〜1.0wt%、クロム0005〜1.0w
t%、マンガン0.005〜1.0wt%。 テルル0.005〜1.0wt%、インジウム0005
〜1、owt%、チタン0.005−1.Owt% 、
ジルコニウム0005〜1.0wt%、ハフニウム0
..005−1. Owt% 、ベリリウム0.005
−1.0 wt% 、 マグネシウム0005〜i、0
wt%、錫0.005〜10wt受、カドミ受人カドミ
ウム0.005〜1.ゲルマニウム0005〜1.0w
t%、ヒ素0005〜0.1wt妬。 アンチモ:/ 0.005−Q、1 wt%の内何れか
1′X1ii又は2種以上を合計0005〜2.Owt
4含み、残部銀及び不可避的な不純物からなる合金を最
終冷間圧延の後に150℃〜700℃で30秒〜20時
間熱処理し1強度、ばね性を向上させる高力導電銅合金
の製造方法。(1) Zinc 10-10-4O, phosphorus 0.005-0.
070 wt%. Tin 0.05-1.0 wt (support), aluminum 0.0
5-1, contains Owt'Z, and further contains boron [1005
-0.1wt%, Nickel #0.005-1. Owt%
, silicon 00o5~1. Owt staff, iron 0005~1
.. Owt ratio, lead 0.0 O5~0.3 wt ratio, cobalt 0005~1.0wt%, chromium 0005~1.0w
t%, manganese 0.005-1.0wt%. Tellurium 0.005-1.0wt%, Indium 0005
~1, owt%, titanium 0.005-1. Owt%,
Zirconium 0005-1.0wt%, Hafnium 0
.. .. 005-1. Owt%, beryllium 0.005
-1.0 wt%, magnesium 0005~i, 0
wt%, tin 0.005-10wt, cadmium 0.005-1. Germanium 0005~1.0w
t%, arsenic 0005-0.1wt jealousy. Antimo:/0.005-Q, any one of 1'X1ii or two or more of 1 wt% in a total of 0005-2. Owt
A method for producing a high-strength conductive copper alloy, in which an alloy consisting of 4.4 and the balance silver and unavoidable impurities is heat treated at 150° C. to 700° C. for 30 seconds to 20 hours after final cold rolling to improve strength and springiness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19354683A JPS6086253A (en) | 1983-10-18 | 1983-10-18 | Preparation of high-strength conductive copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19354683A JPS6086253A (en) | 1983-10-18 | 1983-10-18 | Preparation of high-strength conductive copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6086253A true JPS6086253A (en) | 1985-05-15 |
Family
ID=16309863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19354683A Pending JPS6086253A (en) | 1983-10-18 | 1983-10-18 | Preparation of high-strength conductive copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6086253A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7628872B2 (en) * | 2004-01-15 | 2009-12-08 | Ningbo Powerway Alloy Material Co., Ltd. | Lead-free free-cutting copper-antimony alloys |
| EP3099832B1 (en) | 2014-01-30 | 2018-11-14 | Nordic Brass Gusum AB | Brass with improved dezincification resistance and machinability |
-
1983
- 1983-10-18 JP JP19354683A patent/JPS6086253A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7628872B2 (en) * | 2004-01-15 | 2009-12-08 | Ningbo Powerway Alloy Material Co., Ltd. | Lead-free free-cutting copper-antimony alloys |
| EP3099832B1 (en) | 2014-01-30 | 2018-11-14 | Nordic Brass Gusum AB | Brass with improved dezincification resistance and machinability |
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