JPS6092602A - Method of forming printed resistor - Google Patents
Method of forming printed resistorInfo
- Publication number
- JPS6092602A JPS6092602A JP58201270A JP20127083A JPS6092602A JP S6092602 A JPS6092602 A JP S6092602A JP 58201270 A JP58201270 A JP 58201270A JP 20127083 A JP20127083 A JP 20127083A JP S6092602 A JPS6092602 A JP S6092602A
- Authority
- JP
- Japan
- Prior art keywords
- printed resistor
- printed
- paste
- resistor
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 11
- 239000009719 polyimide resin Substances 0.000 claims description 11
- 238000009966 trimming Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 238000007650 screen-printing Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000010304 firing Methods 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 150000001721 carbon Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003505 heat denaturation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （イ）産業上の利用分野 本発明は印刷抵抗体の形成方法の改良に関する。[Detailed description of the invention] (b) Industrial application fields The present invention relates to improvements in the method of forming printed resistors.
（ロ）従来技術
従来混成集積回路等に用いられる印刷抵抗体は、エポキ
シ樹脂ベースのカーボン印刷抵抗ペーストをスクリーン
印刷して焼成して形成され、然る後印刷抵抗体をトリミ
ングして所望の抵抗値に調整していた。(B) Prior Art Printed resistors used in conventional hybrid integrated circuits are formed by screen printing and firing an epoxy resin-based carbon printed resistor paste, and then trimming the printed resistor to obtain the desired resistance. The value was adjusted.
エポキシ樹脂ペースのカーボン印刷抵抗ペーストはエポ
キシ樹脂１００、カーボン８、無機フィラー３０、有機
溶剤１００で組成されている。エポキシ樹脂はフレキシ
ブルで密着性が良いのでスクリーン印刷には適している
が、反面耐熱性が悪い欠点があった。The epoxy resin-based carbon printed resistance paste is composed of 100% epoxy resin, 80% carbon, 30% inorganic filler, and 100% organic solvent. Epoxy resin is flexible and has good adhesion, making it suitable for screen printing, but it has the disadvantage of poor heat resistance.
最近印刷抵抗体のトリミング技術が進歩し、レーザー光
を用いた自動トリミング装置が開発された。しかしレー
ザー光によるトリミングは発熱を伴うので、耐熱性の弱
いエポキシ樹脂ペースのカーボン印刷抵抗ペーストによ
り形成された印刷抵抗体（１）では第１図に示す如く、
損傷が大きくレーザー光の照射部分より大ぎくぎざぎざ
にトリミングされてしまう。この結果高精度の抵抗値の
調整を実現できない欠点があった。Recently, the technology for trimming printed resistors has advanced, and an automatic trimming device using laser light has been developed. However, since trimming with a laser beam generates heat, a printed resistor (1) made of a carbon printed resistor paste with an epoxy resin paste, which has low heat resistance, will not work as shown in Figure 1.
The damage was so great that the part that was irradiated with the laser beam was trimmed more jaggedly. As a result, there was a drawback that highly accurate resistance value adjustment could not be achieved.
（ハ）発明の目的
本発明は斯上した欠点に鑑みてなされ、従来の欠点を大
巾に改善した印刷抵抗体の形成方法を実現することを目
的とす＾。(c) Purpose of the Invention The present invention was made in view of the above-mentioned drawbacks, and an object of the present invention is to realize a method for forming a printed resistor that greatly improves the conventional drawbacks.
に）発明の構成
本発明に依れば第２図及び第３図に示す如く、絶縁基板
（ｉｌｌ上しエポキシ変性したポリイミド樹脂ベースの
カーボン印刷抵抗ペーストをスフＩ）−ン印刷し焼成し
て印刷抵抗体０３）を形成した後、印刷抵抗体θ３）を
レーザー光によりトリミングする様に構成される。B) Structure of the Invention According to the present invention, as shown in FIGS. 2 and 3, a carbon printed resistor paste based on an epoxy-modified polyimide resin is printed on an insulating substrate (illuminated film) and fired. After forming the printed resistor 03), the printed resistor θ3) is trimmed by laser light.
（ホ）実施例
本発明の第１の工程は絶縁基板ａＤ上に印刷抵抗体０を
形成することにある。(E) Embodiment The first step of the present invention is to form a printed resistor 0 on an insulating substrate aD.
絶縁基板（Ｉｌ＋としてはアルミニウム基板表面をアル
マイト処理したものあるいはアルミニウム基板表面にＡ
ｌ２Ｏ，を混入した絶縁樹脂を塗布したものを用い、良
好な放熱特性を得ている１、斯る基板（１υ上には離間
して導電路（１２１を設け、この導電路０２１間に印刷
抵抗体（１３１を形成している。Insulating substrate (Il+ is an aluminum substrate surface treated with alumite or an aluminum substrate surface with A
A conductive path (121) is provided spaced apart on such a substrate (1υ), and a printed resistor is placed between the conductive path (021). body (forming 131).
印刷抵抗体（１３）はエポキシ変性したポリイミド樹脂
ペースのカーボン印刷抵抗ペーストを用いて形成されろ
。このカーボン印刷抵抗ペーストは、エポキシ変性した
ポリイミド樹脂１００、カーボン８、無機フィラー３０
、有機溶剤１１００重葉比で組成されている。エポキシ
変性したポリイミド樹脂はビスマレイミド型ポリイミド
樹脂に分子量３００〜３０００のエポキシ樹脂をｉｏ〜
８０部添加して加熱変性して共重合して形成する。斯上
したカーボン印刷抵抗ペーストはエポキシ変性によりビ
スマレイミド型ポリイミド樹脂のもろさと低接着性の欠
点を７レキシプルで且つ高接着性というスクリーン印刷
に適した性質に変え、更にポリイミド樹脂の本来より持
つ耐熱性を兼備している。The printed resistor (13) is formed using a carbon printed resistor paste with an epoxy modified polyimide resin paste. This carbon printed resistance paste is made of 100% epoxy-modified polyimide resin, 80% carbon, and 30% inorganic filler.
, an organic solvent with a weight ratio of 1100. Epoxy-modified polyimide resin is a bismaleimide type polyimide resin mixed with an epoxy resin with a molecular weight of 300 to 3000.
It is formed by adding 80 parts, heat denaturation, and copolymerization. Through epoxy modification, the above-mentioned carbon printing resistance paste changes the flaws of bismaleimide type polyimide resin, such as brittleness and low adhesion, into properties suitable for screen printing such as 7 lexiples and high adhesion, and also has the inherent heat resistance of polyimide resin. It has both sex.
このエポキシ変性したポリイミド樹脂ペースのカーボン
印刷抵抗ペーストはスクリーン印刷後焼成される。焼成
は２００℃で１時間ででき、従来のエポキシ樹脂ベース
のカーボン印刷抵抗ペーストの焼成条件が２００°０６
時間であるのに比べると大巾に焼成時間を短縮できる。This epoxy-modified polyimide resin-based carbon printed resistor paste is fired after screen printing. Firing can be done in one hour at 200°C, and the firing conditions for conventional epoxy resin-based carbon printed resistance paste are 200°06.
The firing time can be drastically reduced compared to the time required.
本発明の第２の工程は印刷抵抗体Ｑ３１をレーザー光に
よりトリミングすることにある。The second step of the present invention consists in trimming the printed resistor Q31 with laser light.
本工程では本発明に依る印刷抵抗体（１３１がポリイミ
ド樹脂ペースで耐熱性に富む利点を大いに利用している
のである。第２図では印刷抵抗体（１３１をＬカットし
てトリミングしており、第３図では印刷抵抗体Ｑ３１を
サーペンタインカットしてトリミングしている。レーザ
ー光はＹＡＧレーザ−（波長１．０６μｍ）を用い、出
力２００ｍＷ程度である１、そしてトリミング巾は最少
６０μｍであり、極めて微細なトリミング加工を行なえ
る。第３図に示したサーベ′インタインカットではトリ
ミング巾を６０μｍ、抵抗中を１２５μｍの加工が行な
え、最小面積の印刷抵抗体（１３）より５〜ＩＯＫΩの
抵抗値を実現できろ。しかもレーザー光により損傷は周
辺に及ばないのでマイクロクラックの発生もない。This process takes full advantage of the advantage that the printed resistor (131) of the present invention is made of polyimide resin paste and has high heat resistance. In Fig. 2, the printed resistor (131) is trimmed by L-cutting. In Figure 3, the printed resistor Q31 is trimmed by serpentine cutting.The laser beam is a YAG laser (wavelength 1.06 μm), the output is about 200 mW1, and the trimming width is at least 60 μm, which is extremely Fine trimming can be performed.The survey in-line cut shown in Fig. 3 allows trimming width of 60 μm and resistor diameter of 125 μm, resulting in a resistance value of 5 to IOKΩ than the printed resistor (13) with the smallest area. What's more, the laser beam does not cause damage to the surrounding area, so there is no microcracking.
（へ）発明の効果
本発明に依れば耐熱性の強いエポキシ変性したポリイミ
ド樹脂ペースのカーボン印刷抵抗ペーストを用いること
により、レーザー光による印刷抵抗体のトリミングを可
能にした。この結果レーザー光による自動トリミング装
置を工程に導入でき、極めて精度の良いトリミングを自
動的に行なえる。(f) Effects of the Invention According to the present invention, by using a carbon printed resistor paste with a strong heat-resistant epoxy-modified polyimide resin paste, it is possible to trim a printed resistor with a laser beam. As a result, an automatic trimming device using a laser beam can be introduced into the process, and extremely accurate trimming can be performed automatically.
また周辺のレーザー光による熱損傷がほとんどないので
サーペンタインカットも実用化でき、印刷抵抗体の小型
化を図れる。Furthermore, since there is almost no thermal damage caused by surrounding laser light, serpentine cutting can also be put to practical use, making it possible to miniaturize printed resistors.
第１図は従来の形成方法を説明する上面図、第２図及び
第３図は本発明の形成方法を説明する上面図である。
αυは絶縁基板、 （１２１は導電路、 ０３）は印刷
抵抗体である。
出願人 三洋電機株式会社 外１名FIG. 1 is a top view illustrating a conventional forming method, and FIGS. 2 and 3 are top views illustrating a forming method according to the present invention. αυ is an insulating substrate, (121 is a conductive path, and 03) is a printed resistor. Applicant Sanyo Electric Co., Ltd. and 1 other person
Claims (1)
ースのカーボン印刷抵抗ペーストをスクリーン印刷し焼
成して印刷抵抗体を形成した後、該印刷抵抗体をレーザ
ー光によりトリミングすることを特徴とする印刷抵抗体
の形成方法。(1) A printed resistor characterized by screen printing a carbon printed resistor paste based on an epoxy-modified polyimide resin on an insulating substrate and baking it to form a printed resistor, and then trimming the printed resistor with a laser beam. How the body is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58201270A JPS6092602A (en) | 1983-10-26 | 1983-10-26 | Method of forming printed resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58201270A JPS6092602A (en) | 1983-10-26 | 1983-10-26 | Method of forming printed resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6092602A true JPS6092602A (en) | 1985-05-24 |
| JPH0550122B2 JPH0550122B2 (en) | 1993-07-28 |
Family
ID=16438168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58201270A Granted JPS6092602A (en) | 1983-10-26 | 1983-10-26 | Method of forming printed resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6092602A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55141705A (en) * | 1979-04-20 | 1980-11-05 | Matsushita Electric Industrial Co Ltd | Film resistor |
| JPS58106889A (en) * | 1981-12-18 | 1983-06-25 | 松下電器産業株式会社 | How to attach electrical components such as resistors to printed wiring boards |
| JPS5955090A (en) * | 1982-09-22 | 1984-03-29 | 松下電器産業株式会社 | Manufacturing method of flexible wiring board with resistor |
| JPS59134803A (en) * | 1983-01-20 | 1984-08-02 | 松下電器産業株式会社 | Manufacturing method of chip resistor |
-
1983
- 1983-10-26 JP JP58201270A patent/JPS6092602A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55141705A (en) * | 1979-04-20 | 1980-11-05 | Matsushita Electric Industrial Co Ltd | Film resistor |
| JPS58106889A (en) * | 1981-12-18 | 1983-06-25 | 松下電器産業株式会社 | How to attach electrical components such as resistors to printed wiring boards |
| JPS5955090A (en) * | 1982-09-22 | 1984-03-29 | 松下電器産業株式会社 | Manufacturing method of flexible wiring board with resistor |
| JPS59134803A (en) * | 1983-01-20 | 1984-08-02 | 松下電器産業株式会社 | Manufacturing method of chip resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0550122B2 (en) | 1993-07-28 |
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