JPS6094879U - metal package - Google Patents
metal packageInfo
- Publication number
- JPS6094879U JPS6094879U JP18663483U JP18663483U JPS6094879U JP S6094879 U JPS6094879 U JP S6094879U JP 18663483 U JP18663483 U JP 18663483U JP 18663483 U JP18663483 U JP 18663483U JP S6094879 U JPS6094879 U JP S6094879U
- Authority
- JP
- Japan
- Prior art keywords
- diameter hole
- metal package
- shape
- metal
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図は従来の一般的金属パッケージの代
表例を示す断面図、第３回部よび第４図は本考案の実施
例に係る金属パッケージの断面図、第５図は本考案の金
属パツケニジのガラス封着部の拡大断面図、第６図は本
考案の金属パッケージの他の実施例を示す断面図である
。
１・・・・・・金属本体、２・・・・・・電気信号入出
力端子、 ・３・・・・・・ガラス、４・・・・・
・放熱用異種金属、５・・・・・・大径穴、６・・・・
・・小径穴、７・・・・・・テーパ状連接部分（座グリ
段部）。1 and 2 are cross-sectional views showing typical examples of conventional general metal packages, the third part and FIG. 4 are cross-sectional views of metal packages according to embodiments of the present invention, and FIG. FIG. 6 is an enlarged cross-sectional view of the glass-sealed portion of the metal package, and FIG. 6 is a cross-sectional view showing another embodiment of the metal package of the present invention. 1...Metal body, 2...Electric signal input/output terminal, 3...Glass, 4...
・Dissimilar metal for heat dissipation, 5...Large diameter hole, 6...
...Small diameter hole, 7...Tapered connecting part (spot facing stepped part).
Claims (1)
に、他方の片側を大径穴の形状に形成し、これら小径穴
と大径穴との連接部分をテーパ状に形成したことを特徴
とするハイブリッドＩＣ用金属パッケージ。One side of the glass sealing hole in the package body is formed in the shape of a small diameter hole, and the other side is formed in the shape of a large diameter hole, and the connecting part between the small diameter hole and the large diameter hole is formed in a tapered shape. Metal package for hybrid IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18663483U JPS6094879U (en) | 1983-12-02 | 1983-12-02 | metal package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18663483U JPS6094879U (en) | 1983-12-02 | 1983-12-02 | metal package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6094879U true JPS6094879U (en) | 1985-06-28 |
Family
ID=30403077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18663483U Pending JPS6094879U (en) | 1983-12-02 | 1983-12-02 | metal package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6094879U (en) |
-
1983
- 1983-12-02 JP JP18663483U patent/JPS6094879U/en active Pending
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