JPS609575A - Solder plating method - Google Patents
Solder plating methodInfo
- Publication number
- JPS609575A JPS609575A JP11640283A JP11640283A JPS609575A JP S609575 A JPS609575 A JP S609575A JP 11640283 A JP11640283 A JP 11640283A JP 11640283 A JP11640283 A JP 11640283A JP S609575 A JPS609575 A JP S609575A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hoop material
- plated
- flux
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 60
- 238000007747 plating Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 17
- 239000000463 material Substances 0.000 claims abstract description 28
- 230000004907 flux Effects 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、必要な箇所に必要な量だけのはんだをメッ
キすることが可能なはんだメッキ方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a solder plating method capable of plating a required amount of solder on a required location.
フープ材の片面にはんだメッキを行う方法として、噴流
式はんだメッキ法が考え出されている。A jet solder plating method has been devised as a method for applying solder plating to one side of a hoop material.
この方法は、槽中の加熱溶融したはんだをポンプで吹き
上げるように噴流させつつ、フープ材にその噴流の波の
上を通過させることにより、フープ材の下面にメッキを
行う方法である。しかしながら、この方法にはつぎのよ
うな問題があった。すなわち、はんだを噴流させるとは
んだの酸化が発生する恐れが多く、そのため、酸化物が
フープ材に付着する恐れが多いという問題、噴流がフー
プの上面にまわり込んで上面もはんだメッキされてしま
う恐れが多いという問題、および必要な量だけをメッキ
することが非常に困難であるという問題である。その上
、この方法では、片面の一部のみにはんだメッキを行う
といったようなことが非常に困難である。In this method, heated and molten solder in a tank is blown up by a pump, and the hoop material is passed over the waves of the jet, thereby plating the lower surface of the hoop material. However, this method has the following problems. In other words, there is a high risk that oxidation of the solder will occur when the solder is jetted, and as a result, the oxide is likely to adhere to the hoop material, and the jet may wrap around the top surface of the hoop and cause the top surface to be plated with solder as well. The problem is that there is a large amount of plating, and that it is extremely difficult to plate only the required amount. Moreover, with this method, it is extremely difficult to perform solder plating on only a portion of one side.
［発明の目的］
この発明は、このような事情に鑑みなされたもので、必
要な箇所に必要な量だけのはんだをメッキすることが可
能で、はんだの酸化物が付着する恐れがほとんどない等
、前記従来の問題を解決したはんだメッキ方法を提供す
ることを目的とじている。[Purpose of the invention] This invention was made in view of the above circumstances, and it is possible to plate only the necessary amount of solder on the necessary places, and there is almost no risk of adhesion of solder oxides, etc. The object of the present invention is to provide a solder plating method that solves the above-mentioned conventional problems.
［発明の開示コ
前記のような目的を達成するため、この発明は、被メッ
キ体のメッキ箇所にフラックスを塗布したのち、そこに
はんだを載せて加熱溶融することを特徴とするはんだメ
ッキ方法をそあ要旨としている。以下にこの発明の詳細
な説明する。[Disclosure of the Invention] In order to achieve the above-mentioned object, the present invention provides a solder plating method characterized by applying flux to a plating point of an object to be plated, and then placing solder thereon and melting it by heating. That's the gist. This invention will be explained in detail below.
フープ材の片面にはんだメッキを行う場合、まず、第１
図に示されているように、フープ材１の片面にフラック
ス２を塗布し、その上に所定の厚みの長尺シート状のは
んだ（はんだ箔）３を重ね合わせる。このあと、フープ
材を加熱炉（リフロー加熱炉）等に送り、はんだを加熱
溶融したのち、フープ材を冷却すれば、フープ材の片面
がはんだメッキされる。フープ材の片面の一部にはんだ
メッキを行う場合は、まず、第２図に示されているよう
にフープ材４の片面の所定のメッキ箇所にフラックス２
を塗布し、その上に長尺シート状のはんだ５を重ね合わ
せる。このあと、前記の場合と同様、はんだを加熱溶融
したのち、フープ材を冷却すれば、フープ材の片面の一
部のみがはんだメッキされる。When performing solder plating on one side of the hoop material, first
As shown in the figure, flux 2 is applied to one side of a hoop material 1, and a long sheet-shaped solder (solder foil) 3 of a predetermined thickness is superimposed thereon. Thereafter, the hoop material is sent to a heating furnace (reflow heating furnace) or the like, and after heating and melting the solder, the hoop material is cooled, and one side of the hoop material is plated with solder. When performing solder plating on a part of one side of the hoop material, first apply flux 2 to a predetermined plating location on one side of the hoop material 4, as shown in FIG.
is applied, and a long sheet-shaped solder 5 is superimposed on it. Thereafter, as in the case described above, after heating and melting the solder, the hoop material is cooled, and only a portion of one side of the hoop material is plated with solder.
このように、メッキ箇所にフラックスを塗布したのち、
そこにはんだを載せ加熱溶融させて、メッキを行うよう
にすると、はんだを噴出させる必要がないので、はんだ
が酸化される恐れが少なく、酸化物が被メッキ体に付着
する恐れが非常に少ない。そのうえ、噴流式はんだメッ
キ法のようにはんだメッキ槽やポンプを必要としない。In this way, after applying flux to the plating area,
If solder is placed there and heated and melted to perform plating, there is no need to squirt out the solder, so there is little risk of the solder being oxidized and there is very little risk of oxides adhering to the object to be plated. Moreover, unlike the jet solder plating method, a solder plating bath or pump is not required.
また、溶融したはんだは水銀並みに表面張力が大きいの
で、フラックスによりぬれ性を促進させなければ、フー
プ材に対する付着性が悪い。そのため、フシックス塗布
面に載せられたはんだが加熱溶融したとき、塗布面以外
に流れる恐れが非常に少ないので、必要な箇所にはんだ
メッキを行うことができる。しかも、載置するはんだの
厚みを調整することにより、必要な量だけのはんだをメ
ッキすることができる。Furthermore, since molten solder has a surface tension as high as that of mercury, it has poor adhesion to the hoop material unless its wettability is promoted with flux. Therefore, when the solder placed on the Fusix coated surface is heated and melted, there is very little risk of it flowing to areas other than the coated surface, so solder plating can be performed on the necessary locations. Furthermore, by adjusting the thickness of the solder to be placed, it is possible to plate only the required amount of solder.
なお、前記実施例において、フープ材を連続的に繰り出
しつつ、その表面にフラックスを塗布し、その上から連
続的に長尺のシート状のはんだを重ね合わせて加熱炉に
通すようにすると、フープ材の片面あるいは片面の一部
に厚みが一定のメッキを連続して行うことができ、生産
性が上がる。In addition, in the above embodiment, if the hoop material is continuously fed out, flux is applied to the surface of the hoop material, and a long sheet of solder is continuously stacked on top of the flux and passed through the heating furnace. It is possible to continuously plate one side or part of one side of the material with a constant thickness, increasing productivity.
また、前記と同様の方法により、フープ材の片面のみに
限られず両面あるいは両面の各一部に非連続的あるいは
連続的にメッキを行うこともできる。この発明にかかる
方法で用いられる被メッキ体は、フープ材に限られるも
のではない。また、はんだも長尺シート状のものに限ら
れるものではなく、線状のもの（はんだ線）や短尺のも
のが用いられるようであってもよい。はんだ線を用いた
場合は、太さを調節することにより、必要量のはんだメ
ッキを行うことが容易にできるようになる。Further, by the same method as described above, plating is not limited to only one side of the hoop material, but also both sides or parts of both sides can be plated discontinuously or continuously. The object to be plated used in the method according to the present invention is not limited to a hoop material. Further, the solder is not limited to a long sheet-like solder, but a linear one (solder wire) or a short solder may also be used. If solder wire is used, the required amount of solder plating can be easily achieved by adjusting the thickness.
ただし、被メッキ体およびはんだが長尺のものでなけれ
ば、連続してメッキを行うことができない〔発明の効果
〕
この発明にかかるはんだメッキ方法は、前記のように構
成されているので、必要な箇所に必要な量だけのはんだ
をメッキすることが可能で、はんだの酸化物が付着する
恐れがほとんどない。However, unless the object to be plated and the solder are long, continuous plating cannot be performed. [Effects of the Invention] The solder plating method according to the present invention is configured as described above, so that the solder plating method is not necessary. It is possible to plate only the required amount of solder on the desired location, and there is almost no risk of adhesion of solder oxides.
第１図および第２図はそれぞれこの発明にかかるはんだ
メッキ方法の実施説明図である。
１．４・・・フープ材 ２・・・フラックス ３，５・
・・はんだ材
代理人 弁理士 松 本 武 彦1 and 2 are explanatory diagrams, respectively, of implementing the solder plating method according to the present invention. 1.4... Hoop material 2... Flux 3,5.
...Solder material agent Patent attorney Takehiko Matsumoto
Claims (2)
たのち、そこにはんだを載せて加熱溶融することを特徴
とするはんだメッキ方法。(1) A solder plating method characterized by applying flux to the plating location of the object to be plated, then placing solder thereon and heating and melting it.
り出しつつその表面にフラックスを塗布し、その上から
連続的にシート状のはんだを重ね合わせて加熱炉に通す
特許請求の範囲第１項記載のはんだメッキ方法。(2) The object to be plated is a hoop material, and flux is applied to the surface of the hoop material while it is continuously fed out, and a sheet of solder is continuously layered on top of the hoop material, and the material is passed through a heating furnace. The solder plating method described in item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11640283A JPS609575A (en) | 1983-06-27 | 1983-06-27 | Solder plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11640283A JPS609575A (en) | 1983-06-27 | 1983-06-27 | Solder plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS609575A true JPS609575A (en) | 1985-01-18 |
Family
ID=14686154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11640283A Pending JPS609575A (en) | 1983-06-27 | 1983-06-27 | Solder plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609575A (en) |
-
1983
- 1983-06-27 JP JP11640283A patent/JPS609575A/en active Pending
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