JPS60962U - board equipment - Google Patents

board equipment

Info

Publication number
JPS60962U
JPS60962U JP9122783U JP9122783U JPS60962U JP S60962 U JPS60962 U JP S60962U JP 9122783 U JP9122783 U JP 9122783U JP 9122783 U JP9122783 U JP 9122783U JP S60962 U JPS60962 U JP S60962U
Authority
JP
Japan
Prior art keywords
holes
package
utility
board equipment
locking means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9122783U
Other languages
Japanese (ja)
Inventor
小島　義一郎
Original Assignee
アイワ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アイワ株式会社 filed Critical アイワ株式会社
Priority to JP9122783U priority Critical patent/JPS60962U/en
Publication of JPS60962U publication Critical patent/JPS60962U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図は従来例要部断面図、第３図、第４図は
本実施例斜視図である。 符号の説明、１・・・基板、４・・・ハンダペースト、
４′・・・実効ハンダ１．５・・・フラットパッケージ
型ＩＣ１７・・・透孔、８・・・捨てバネ。1 and 2 are sectional views of essential parts of the conventional example, and FIGS. 3 and 4 are perspective views of the present embodiment. Explanation of symbols, 1... Board, 4... Solder paste,
4'...Effective solder 1.5...Flat package type IC17...Through hole, 8...Discarded spring.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）フラットパッケージ型ＩＣが搭載されてリフロー
ソルダリング仕上げされる基板面に於て、パッケージ仮
固定用の捨てバネを係止する係止手段を具備してなる基
板装置。(1) A board device comprising a locking means for locking a spring for temporarily fixing a package on the board surface on which a flat package type IC is mounted and to be finished by reflow soldering. （２）上記係止手段が少なくとも二対の透孔であり、該
二点間を結ぶ線分がパッケージ搭載部を横切る如く位置
に上記透孔を穿設してなることを特徴とする実用新案登
録請求の範囲第１項記載の基板装置。(2) A utility model characterized in that the locking means is at least two pairs of through holes, and the through holes are bored at positions such that a line segment connecting the two points crosses the package mounting section. A board device according to registered claim 1.
JP9122783U 1983-06-16 1983-06-16 board equipment Pending JPS60962U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9122783U JPS60962U (en) 1983-06-16 1983-06-16 board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9122783U JPS60962U (en) 1983-06-16 1983-06-16 board equipment

Publications (1)

Publication Number Publication Date
JPS60962U true JPS60962U (en) 1985-01-07

Family

ID=30221210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9122783U Pending JPS60962U (en) 1983-06-16 1983-06-16 board equipment

Country Status (1)

Country Link
JP (1) JPS60962U (en)

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