JPS609709A - Device and method of washing thin-type inner circumference cutting edge - Google Patents
Device and method of washing thin-type inner circumference cutting edgeInfo
- Publication number
- JPS609709A JPS609709A JP11768383A JP11768383A JPS609709A JP S609709 A JPS609709 A JP S609709A JP 11768383 A JP11768383 A JP 11768383A JP 11768383 A JP11768383 A JP 11768383A JP S609709 A JPS609709 A JP S609709A
- Authority
- JP
- Japan
- Prior art keywords
- inner peripheral
- grinding fluid
- air
- cutting blade
- peripheral blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims 2
- 238000005406 washing Methods 0.000 title 1
- 230000002093 peripheral effect Effects 0.000 claims description 36
- 239000012530 fluid Substances 0.000 claims description 20
- 238000004140 cleaning Methods 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000006061 abrasive grain Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Auxiliary Devices For Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はシリコンインゴット等を薄板状に切断していわ
ゆるウェー八を製造する薄型内周切断刃（以後内周刃と
いう）の洗＃装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cleaning device for a thin inner circumferential cutting blade (hereinafter referred to as an inner circumferential cutter) for cutting a silicon ingot or the like into thin plates to produce so-called wafers.
シリコンインゴット等の切断装置ｌ二おいては、一般（
−ダイヤモンド砥粒全電着した内周刃を回転させ、前記
インゴット等を内周刃の回転面に平行に移動させて高速
回転する内周刃との接触により切断するが、この切断作
９乞能率的に継続するために研削液を内周刃の先端部に
吐出するよう構成されている。For cutting equipment such as silicon ingots, general (
- The inner peripheral blade, which is fully electrodeposited with diamond abrasive grains, is rotated, and the ingot, etc. is moved parallel to the rotating surface of the inner peripheral blade, and is cut by contact with the high-speed rotating inner peripheral blade. For efficient continuation, the grinding fluid is configured to be discharged to the tip of the inner peripheral cutter.
いま、シリコンインゴット全切断する場合を例にとると
、内周刃は１１００ｍ／ｍｉｎの周速間で回転し、これ
により内径１８０朋の内周刃の微小中部分が１回転に要
する時間は約０．０３秒に過ぎない。For example, when cutting a silicon ingot entirely, the inner peripheral blade rotates at a circumferential speed of 1100 m/min, and the time required for one rotation of the small and medium portion of the inner peripheral blade with an internal diameter of 180 mm is approximately It is only 0.03 seconds.
イン゛ゴツト切断中は、内周刃の空気中に露出している
時間は切断に参加している時間だけ雉くなる。この空気
中ＩＪｉ出している僅かな時間内（二、内周刃表面ｌ：
付着した微細な切り粉を効果的に洗浄除去下る必要があ
る。While cutting an ingot, the time the inner peripheral blade is exposed to the air is reduced by the time it participates in cutting. During this short period of time when IJi is released into the air (2. Inner peripheral blade surface l:
It is necessary to effectively wash and remove the attached fine chips.
これに対し従来のこの種の切断装置を第１図に示す。In contrast, a conventional cutting device of this type is shown in FIG.
単（二洗浄ノズル２１から研削液を内周刃のインゴット
２２への入口側２６と出口側２４で内周刃先端部Ｃ二回
って吐出下るだけであり、＃細す切り粉を内周刃先端部
から離脱させるために作用する力は、吐出された研削液
の圧力と内周刃の表面が研削液を浴びてからシリコンイ
ンゴットに入るまでの非常に僅かな時間内ζ二作用する
回転による遠心力のみであった。このため内周刃先端部
の洗浄が充分に行われず、切断枚数がふえるｇ二したが
って目詰りが進み、切断抵抗が増してウェーハの反りを
大きく下ると共ｇ二、内周刃先端部のダイヤモンド砥粒
ン固看している金属の摩滅が進行して内周刃としての寿
命を短かくしている。The grinding fluid is simply discharged from the two cleaning nozzles 21 to the ingot 22 of the inner circumferential cutter at the inlet side 26 and outlet side 24 of the inner circumferential cutter tip C twice, and # fine chips are discharged to the inner circumferential cutter. The force that acts to separate it from the tip is due to the pressure of the discharged grinding fluid and the rotation that occurs during a very short period of time from when the surface of the inner peripheral blade is exposed to the grinding fluid until it enters the silicon ingot. There was only centrifugal force.As a result, the tip of the inner peripheral blade was not sufficiently cleaned, resulting in an increase in the number of wafers cut.As a result, clogging progressed, cutting resistance increased, and the wafer warped significantly. The metal holding the diamond abrasive grains at the tip of the inner peripheral blade progresses and wears out, shortening the life of the inner peripheral blade.
本発明はかかる現状（二かんがみ、ｍＪ記の欠点を抑制
して高精度の切断加工を達成し、内周刃の寿命を延ばし
てコストの低減をはかると共（二、内周刃の交換サイク
ルを減らして生産性を同上させる装置を提供するもので
ある。The present invention achieves high-precision cutting by suppressing the drawbacks described in the current situation (2. mJ), extends the life of the inner peripheral cutter, and reduces costs (2. Replacement cycle of the inner peripheral cutter). The purpose of the present invention is to provide a device that reduces the above and improves productivity.
Ｔなわち本発明は、内周刃の回転面に平行ｇ二支持され
た複数個の研削液吐出孔と空気噴出小孔とを有するノズ
ルブロックからなり、前記切断刃に回って研削液の吐出
と空気の噴出を同時に行わせることを特徴とするもので
ある。In other words, the present invention consists of a nozzle block having a plurality of grinding fluid discharge holes and small air jet holes supported parallel to the rotating surface of the inner circumferential blade, and which rotates around the cutting blade to discharge the grinding fluid. It is characterized by simultaneously blowing out air and blowing out air.
以下本発明を添付の図面に基いて詳細に説明する。The present invention will be described in detail below with reference to the accompanying drawings.
第２図は内周刃に対する本発明にかかる。洗浄装置の支
持状態を例示下るもので、該装置は内周刃のインゴット
からの出口側に設ける。１は内周刃の合金で、２はその
内局【二電青した砥粒層である。FIG. 2 relates to the present invention for an inner peripheral cutter. The supporting state of the cleaning device is illustrated below, and the device is provided on the outlet side of the inner peripheral blade from the ingot. 1 is the alloy of the inner circumferential blade, and 2 is the internal abrasive grain layer.
３はノズルブロックで、それｌ二は研削液吐出孔４゜５
．６と空気噴出小孔７．８．９が設けられており、内周
刃に対し平行に支持されるようボルト１６で支持棒１２
＋二固定されている。3 is the nozzle block, and 2 is the grinding fluid discharge hole 4゜5
．． A support rod 12 is provided with a bolt 16 so that it is supported parallel to the inner peripheral blade.
+2 is fixed.
研削液はホース！介して研削液注入口１０より注入され
、ノズルブロック内で分配されて各吐出孔４．５．６よ
り内周刃の先端部に向けて吐出される。また空気もホー
スを介して空気圧入口１１より圧入され、各噴出小孔７
．８．９より内周刃Ｉ）〜
の先端部に向けて噴出される。このとき噴出迅７．８．
９は切り粉と研削液の吹きとばし効果を確実ζ二するた
め、内周刃先端部に対し少くとも真正面、斜め上方、斜
め下方から空気を噴出させる角度で設けられている。Hose the grinding fluid! The grinding fluid is injected through the inlet 10, distributed within the nozzle block, and discharged from each discharge hole 4.5.6 toward the tip of the inner peripheral blade. Air is also pressurized from the air pressure inlet 11 via a hose, and each small jet hole 7
．． From 8.9, it is ejected toward the tip of the inner peripheral blade I). At this time, the eruption speed was 7.8.
In order to ensure the effect of blowing away the chips and grinding fluid, the blade 9 is provided at an angle that allows air to be blown out from at least directly in front of, diagonally above, and diagonally below the tip of the inner peripheral blade.
この関係を各空気噴出小孔の断面図である第３図、第４
図、第５図を使ってさらに詳細に説明する。This relationship is shown in Figures 3 and 4, which are cross-sectional views of each air jet hole.
This will be explained in more detail using FIGS.
第３図は空気噴出小孔７の方向を示すもので、内周刃の
回転面に対して傾いていて斜め上方から内周刃の先端部
に向って直進している。第４図は噴出小孔８の方向を示
すもので、回転面（二平行で先端部に対し真正面から１
１進している。第５図は噴出小孔９の方向を示すもので
、回転面に対して傾いていて斜め下方から先端部に向っ
て直進し、前記噴出小孔７とは傾き角度Ｃ：おいて対を
なすものである。さらに各噴出小孔７．８． ９より噴
出させる空気は、内周刃の先端部の異なる点に向わせる
ため、各噴出小孔全前記回転面（二対して垂直線上ζ二
配列せず、内周刃の回転方向に対して上昇または下降下
る配列で設ける。この関係を第６図に示す。これにより
噴出空気の相互干渉による運動エネルギー減少の影響が
内局刃先端部Ｃ二およぶのを低減し、また噴出小孔７お
よび９より出た空気が噴出小孔８より出た空気により流
れ？変えられて内周刃の先端部よりずれる量を少くする
ことができ、噴出空気の運動エネルギーを洗浄作用Ｃ二
有効に利用することが可能となる。以上の態様は一例で
あって効果を確実ｌ二するため、研削液吐出孔の孔径１
個数、配置の仕方および空気噴出迅の孔径１個数、配置
の仕方、噴出角度（二ついて種々の変更修正が行われる
ことはいうまでもない。FIG. 3 shows the direction of the small air jet hole 7, which is inclined with respect to the rotating surface of the inner peripheral blade and extends straight from obliquely upward toward the tip of the inner peripheral blade. Figure 4 shows the direction of the small jet hole 8.
It's in 1 base. Fig. 5 shows the direction of the small ejection hole 9, which is inclined with respect to the rotating surface and goes straight from obliquely downward toward the tip, forming a pair with the small ejection hole 7 at an inclination angle of C. It is something. Furthermore, each small jet hole 7.8. In order to direct the air ejected from 9 to different points on the tip of the inner peripheral blade, each small jet hole is not aligned perpendicularly to the rotational surface (ζ2), but in the direction of rotation of the inner peripheral blade. This relationship is shown in Fig. 6. This reduces the influence of kinetic energy reduction due to mutual interference of ejected air on the inner blade tip C2, and And the air coming out from the small blowout hole 8 is changed by the air flowing out from the small blowout hole 8, so that the amount of deviation from the tip of the inner peripheral blade can be reduced, and the kinetic energy of the blowout air can be used effectively for cleaning action C2. The above embodiment is just an example, and in order to ensure the effect, the hole diameter of the grinding fluid discharge hole is 1.
It goes without saying that various changes and modifications may be made to the number, arrangement, air ejection speed, number of holes, arrangement, and ejection angle.
このように構成されたノズルブロック乞切断装置に設置
して４″シリコンインゴツトを切断したところ、内周刃
１枚あたりの切断可能枚数が６０％以上増加し、５“シ
リコンインゴットの切断に・おいても５０％以上の増加
が認められた。また、反りの発生や特にいわゆるソーマ
ークの発生が抑制された。When a 4" silicon ingot was cut using the nozzle block cutting device configured as described above, the number of pieces that could be cut per inner peripheral blade increased by more than 60%. An increase of more than 50% was also observed. Further, the occurrence of warpage and, in particular, the occurrence of so-called saw marks was suppressed.
この洗浄装置は小型軽量で非常に狭い内周刃内側に設置
可能であり、その実用的効果は大である。This cleaning device is small and lightweight and can be installed inside the very narrow inner circumferential blade, and its practical effects are great.
第１図は従来技術における内周刃の洗浄装置のとりつけ
状態を示す平面図であり、第２図は内周刃に対する本発
明の洗浄装置のとりつけ状態を示す斜視図であり、第３
図は内周刃の先端部に対し斜め上方から空気を噴出させ
る噴出小孔の断面図であり、第４図は内周刃の先端部に
対し真正面から空気全噴出させる噴出小孔の断面図であ
り、第５図は内周刃の先端部に対し斜め下方から空気を
噴出させる噴出小孔の断面図であり、第６図は研削液吐
出孔と空気噴出小孔のノズルブロックの面Ｃおける配列
を示す。
１・・・内周刃台金、 ２・・・ダイヤモンド砥粒層、
３・・・ノズルブロック、 ４・・・研削液吐出孔、５
・・・研削液吐出孔、６・・・研削液吐出孔、７・・・
空気噴出小孔、８・・・空気噴出小孔、９・・・空気噴
出小孔、１０・・・研削液注入口、１１・・・空気圧入
口、 １２・・・ノズルブロック支持棒、１６・・・ノ
ズルブロック固定ボルト、２１・・・ノズル、２２・・
・インゴット、２６・・・内周刃のインゴットへの入口
側、２４・・・内周刃のインゴットからの出口側、２５
・・・内周刃の先端部。FIG. 1 is a plan view showing a state in which a cleaning device for an inner peripheral blade according to the prior art is attached, FIG. 2 is a perspective view showing a state in which a cleaning device of the present invention is attached to an inner peripheral blade, and FIG.
The figure is a cross-sectional view of a small jet hole that jets air from diagonally above the tip of the inner peripheral blade, and Figure 4 is a cross-sectional view of a small jet hole that jets out all of the air from directly in front of the tip of the internal blade. FIG. 5 is a cross-sectional view of the small jet hole that jets air from diagonally downward to the tip of the inner peripheral blade, and FIG. 6 is a cross-sectional view of the nozzle block surface C of the grinding fluid discharge hole and the small air jet hole. This shows the array in . 1...Inner peripheral blade base metal, 2...Diamond abrasive layer,
3... Nozzle block, 4... Grinding fluid discharge hole, 5
...Grinding fluid discharge hole, 6...Grinding fluid discharge hole, 7...
Air blowout hole, 8... Air blowout hole, 9... Air blowout hole, 10... Grinding fluid inlet, 11... Air pressure inlet, 12... Nozzle block support rod, 16. ... Nozzle block fixing bolt, 21... Nozzle, 22...
- Ingot, 26... Entrance side of the inner peripheral blade to the ingot, 24... Exit side of the inner peripheral blade from the ingot, 25
...Tip of the inner peripheral blade.
Claims (1)
の研削液吐出孔と空気噴出小孔とを有Ｔるノズルブロッ
クからなり、前記切断刃に回って研削液の吐出と空気の
噴出を同時に行わせることを特徴とする薄型内周切断刃
の洗浄装置。 ２、薄型内周切断刃に封子るノズルブロックの面ｌ二、
はぼ水平に隔置された複数個の研削液吐出孔を設けると
共に、前記切断刃の先端部に対し少くとも真正面、斜め
上方、斜め下方から空気を噴出させる角度で、好ましく
は前記切断刃の回転面に対し垂直でなく配列された複数
個の空気噴出小孔を、研削液吐出孔に近く設けて洗浄す
ることを特徴とする薄型内周切断刃の洗浄方法。[Claims] 1. Consisting of a nozzle block having a plurality of grinding fluid discharge holes and small air jet holes supported parallel to the rotating surface of a thin inner circumferential cutting blade, which rotates around the cutting blade. A cleaning device for thin internal cutting blades characterized by discharging grinding fluid and jetting air at the same time. 2. The surface of the nozzle block that seals with the thin inner peripheral cutting blade,
A plurality of grinding fluid discharge holes spaced apart horizontally are provided, and the angle is preferably such that air is ejected from at least directly in front of, diagonally above, and diagonally below the tip of the cutting blade. A method for cleaning a thin inner peripheral cutting blade, characterized in that cleaning is performed by providing a plurality of small air jetting holes arranged not perpendicularly to a rotating surface near a grinding fluid discharge hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11768383A JPS609709A (en) | 1983-06-29 | 1983-06-29 | Device and method of washing thin-type inner circumference cutting edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11768383A JPS609709A (en) | 1983-06-29 | 1983-06-29 | Device and method of washing thin-type inner circumference cutting edge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS609709A true JPS609709A (en) | 1985-01-18 |
| JPS6353928B2 JPS6353928B2 (en) | 1988-10-26 |
Family
ID=14717703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11768383A Granted JPS609709A (en) | 1983-06-29 | 1983-06-29 | Device and method of washing thin-type inner circumference cutting edge |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609709A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62142613A (en) * | 1985-12-18 | 1987-06-26 | 株式会社日立製作所 | Semiconductor wafer recovery method |
| JPH0560809U (en) * | 1992-01-30 | 1993-08-10 | 株式会社東京精密 | Slicing machine |
-
1983
- 1983-06-29 JP JP11768383A patent/JPS609709A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62142613A (en) * | 1985-12-18 | 1987-06-26 | 株式会社日立製作所 | Semiconductor wafer recovery method |
| JPH0560809U (en) * | 1992-01-30 | 1993-08-10 | 株式会社東京精密 | Slicing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6353928B2 (en) | 1988-10-26 |
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